公开(公告)号：US08979104B2

公开(公告)日：2015-03-17

申请号：US14004702

申请日：2012-03-08

申请人： Toshiyuki Niwa ,  Masayoshi Suehiro ,  Atsushi Seto ,  Takeshi Kawachi ,  Masaaki Mizumura ,  Seiichi Daimaru ,  Kaoru Kawasaki ,  Hatsuhiko Oikawa ,  Yasunobu Miyazaki ,  Tatsuya Sakiyama ,  Nobutaka Shimizu ,  Naoki Yoshinaga

发明人： Toshiyuki Niwa ,  Masayoshi Suehiro ,  Atsushi Seto ,  Takeshi Kawachi ,  Masaaki Mizumura ,  Seiichi Daimaru ,  Kaoru Kawasaki ,  Hatsuhiko Oikawa ,  Yasunobu Miyazaki ,  Tatsuya Sakiyama ,  Nobutaka Shimizu ,  Naoki Yoshinaga

IPC分类号： B62D25/08 ,  B62D25/02

CPC分类号： B62D25/088 ,  B62D25/025 ,  B62D25/082

摘要： A structure (10) for a front section of a vehicle body in a vehicle body (1) comprising a front chamber (3) disposed on the forward side of a vehicle interior (2) is provided with the following: a pair of front side members (11), located within the front chamber, that extend in the longitudinal direction of the vehicle body; a pair of strut towers (16) disposed on either side in the width direction of the front chamber and within which front wheel suspensions are disposed; and reinforcement members (20) that link the top of each strut tower with the front side members that face the strut towers, and that extend between the strut towers and the front side members. This configuration allows a structure for a front section of a vehicle body to be provided that can efficiently improve the rigidity of the vehicle body of an automobile against torsion and against lateral bending, and that can efficiently reduce the weight of the vehicle body by means of thickness reduction using a high-strength steel plate.

摘要翻译： 一种用于车体（1）中的车身前部的结构（10），其包括设置在车辆内部（2）的前侧上的前室（3），其具有：一对前侧 位于前室内的构件（11）沿车身纵向方向延伸; 一对支柱塔（16），其设置在所述前室的宽度方向的任一侧上，并且其中设置有前轮悬架; 以及将每个支柱塔顶部与面向支柱塔的前侧构件连接并且在支柱塔和前侧构件之间延伸的加强构件（20）。 这种构造允许设置用于车身前部的结构，其可以有效地提高汽车的车体抵抗扭转和横向弯曲的刚性，并且可以通过以下方式有效地减轻车身的重量： 使用高强度钢板减薄厚度。

公开(公告)号：US20140054872A1

公开(公告)日：2014-02-27

申请号：US14004702

申请日：2012-03-08

申请人： Toshiyuki Niwa ,  Masayoshi Suehiro ,  Atsushi Seto ,  Takeshi Kawachi ,  Masaaki Mizumura ,  Seiichi Daimaru ,  Kaoru Kawasaki ,  Hatsuhiko Oikawa ,  Yasunobu Miyazaki ,  Tatsuya Sakiyama ,  Nobutaka Shimizu ,  Naoki Yoshinaga

发明人： Toshiyuki Niwa ,  Masayoshi Suehiro ,  Atsushi Seto ,  Takeshi Kawachi ,  Masaaki Mizumura ,  Seiichi Daimaru ,  Kaoru Kawasaki ,  Hatsuhiko Oikawa ,  Yasunobu Miyazaki ,  Tatsuya Sakiyama ,  Nobutaka Shimizu ,  Naoki Yoshinaga

IPC分类号： B62D25/08

CPC分类号： B62D25/088 ,  B62D25/025 ,  B62D25/082

摘要： A structure (10) for a front section of a vehicle body in a vehicle body (1) comprising a front chamber (3) disposed on the forward side of a vehicle interior (2) is provided with the following: a pair of front side members (11), located within the front chamber, that extend in the longitudinal direction of the vehicle body; a pair of strut towers (16) disposed on either side in the width direction of the front chamber and within which front wheel suspensions are disposed; and reinforcement members (20) that link the top of each strut tower with the front side members that face the strut towers, and that extend between the strut towers and the front side members. This configuration allows a structure for a front section of a vehicle body to be provided that can efficiently improve the rigidity of the vehicle body of an automobile against torsion and against lateral bending, and that can efficiently reduce the weight of the vehicle body by means of thickness reduction using a high-strength steel plate.

摘要翻译： 一种用于车体（1）中的车身前部的结构（10），其包括设置在车辆内部（2）的前侧上的前室（3），其具有：一对前侧 位于前室内的构件（11）沿车身纵向方向延伸; 一对支柱塔（16），其设置在所述前室的宽度方向的任一侧上，并且其中设置有前轮悬架; 以及将每个支柱塔顶部与面向支柱塔的前侧构件连接并且在支柱塔和前侧构件之间延伸的加强构件（20）。 这种构造允许设置用于车身前部的结构，其可以有效地提高汽车的车体抵抗扭转和横向弯曲的刚性，并且可以通过以下方式有效地减轻车身的重量： 使用高强度钢板减薄厚度。

公开(公告)号：US09069886B2

公开(公告)日：2015-06-30

申请号：US13240393

申请日：2011-09-22

申请人： Nobutaka Shimizu ,  Suguru Saotome ,  Takumi Shioya

发明人： Nobutaka Shimizu ,  Suguru Saotome ,  Takumi Shioya

IPC分类号： A61M1/00 ,  G06F3/00 ,  G06F19/00 ,  A61M5/142 ,  A61M1/28

CPC分类号： G06F19/323 ,  A61M1/28 ,  A61M5/14244 ,  A61M2005/14272 ,  A61M2205/12 ,  A61M2205/502 ,  G06F19/00 ,  G16H10/65

摘要： A home medical apparatus can give explanations corresponding to the levels of proficiency in operation when explaining to a patient about operation procedures. A home medical apparatus according to this invention includes a selection unit which selects an explanation mode corresponding to the level of proficiency in operation, a storage unit which stores a plurality of display windows classified to the respective explanation modes upon associating them with each other between adjacent levels, and a display control unit which displays the display windows classified to the selected explanation mode in a predetermined order. When a detailed explanation button is pressed, the display control unit makes transition to a display window classified to an explanation mode one level lower than the current explanation mode.

摘要翻译： 当向患者解释操作程序时，家庭医疗设备可以对应于操作熟练程度的解释。 根据本发明的家用医疗设备包括：选择单元，其选择与操作能力水平相对应的说明模式;存储单元，存储在相邻的解释模式之间相关联的多个显示窗口 电平和显示控制单元，其以预定顺序显示分类为所选择的说明模式的显示窗口。 当按下详细说明按钮时，显示控制单元转换到分类为比当前说明模式低一级的说明模式的显示窗口。

公开(公告)号：US08932700B2

公开(公告)日：2015-01-13

申请号：US13521714

申请日：2011-01-13

申请人： Nobutaka Shimizu ,  Koji Hanya

发明人： Nobutaka Shimizu ,  Koji Hanya

IPC分类号： B32B1/00 ,  E04C2/32

CPC分类号： E04C2/326 ,  E04C2/32 ,  Y10T428/24479 ,  Y10T428/24628 ,  Y10T428/24661 ,  Y10T428/24669 ,  Y10T428/24678

摘要： A panel which includes, among protrusions protruding from a predetermined reference surface, flat sections being flush with the reference surface, and recesses being recessed from the reference surface, the protrusions, and the flat sections or recesses, wherein; when the panel includes the flat sections, the entire periphery of each of the protrusions is surrounded by the flat sections, and the entire periphery of each of the flat sections is surrounded by the protrusions, while when the panel includes the recesses, the entire periphery of each of the protrusions is surrounded by the recesses, and the entire periphery of each of the recesses is surrounded by the protrusions.

摘要翻译： 其特征在于，在从规定的基准面突出的突起之间包括与所述基准面齐平的平坦部以及从所述基准面凹陷的凹部，所述突起和所述平坦部或凹部， 当面板包括平坦部分时，每个突起的整个周边被平坦部分包围，并且每个平坦部分的整个周边被突起包围，而当面板包括凹部时，整个周边 每个突起被凹部包围，并且每个凹部的整个周边被突起包围。

公开(公告)号：USD667696S1

公开(公告)日：2012-09-25

申请号：US29407944

申请日：2011-12-05

申请人： Nobutaka Shimizu ,  Koji Hanya ,  Ryoichi Kanno

设计人： Nobutaka Shimizu ,  Koji Hanya ,  Ryoichi Kanno

公开(公告)号：US07754534B2

公开(公告)日：2010-07-13

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US5081067A

公开(公告)日：1992-01-14

申请号：US698030

申请日：1991-05-10

申请人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

发明人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

IPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/15312 ,  Y10T29/49144

摘要： A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring patttern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

公开(公告)号：US5055914A

公开(公告)日：1991-10-08

申请号：US477404

申请日：1990-02-09

申请人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

发明人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

IPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/15312 ,  Y10T29/49144

摘要： A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring pattern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

公开(公告)号：US20080261336A1

公开(公告)日：2008-10-23

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/66 ,  H01L21/56

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US06995044B2

公开(公告)日：2006-02-07

申请号：US10650692

申请日：2003-08-29

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Atsushi Kikuchi

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.