公开(公告)号：US06505397B1

公开(公告)日：2003-01-14

申请号：US09596681

申请日：2000-06-19

申请人： Tsutomu Mimata ,  Osamu Kakutani

发明人： Tsutomu Mimata ,  Osamu Kakutani

IPC分类号： B23P1900

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/6838 ,  H01L24/75 ,  H01L2224/13 ,  H01L2924/00014 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53265 ,  Y10T156/1771 ,  Y10T279/11 ,  H01L2224/0401

摘要： A die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of the die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers. The die holding mechanism is moved to above a tray or a substrate so that the die is packed in the tray or bonded to the substrate.

摘要翻译： 一种模具保持机构，包括可上下移动的连接线容纳轴，一对模具保持杆，其具有用于保持模具的模具保持部，并且安装成使得这些杆自由地打开和关闭， 封闭杆，打开和关闭模具夹持杆。 在其上表面形成有连接线的模具被模具上推装置向上推动，并且模具的线与模具保持机构的连接线接收轴接触。 当连接线接收轴通过模具的向上移动而升高给定量时，模具保持杆被关闭，使得模具保持杆的模具保持部分位于模具的下表面之下。 之后，模具上推装置的上推针被降低，导致模具被模具夹持杆保持。 将模具保持机构移动到托盘或基板的上方，使得模具被包装在托盘中或结合到基板。

公开(公告)号：US06383844B2

公开(公告)日：2002-05-07

申请号：US09748812

申请日：2000-12-26

申请人： Tsutomu Mimata ,  Osamu Kakutani

发明人： Tsutomu Mimata ,  Osamu Kakutani

IPC分类号： H01L2144

CPC分类号： H01L21/67144 ,  Y10S438/907

摘要： A multi-chip bonding method and apparatus, in which a first wafer ring which has electronic components of a first type is held by a holding device; substrates are fed out to a conveying device from the first storing section; the electronic components of the first type on the holding device are successively bonded to the substrates; the substrates with the electronic components of the first type bonded is accommodated in the second storing section; the first wafer ring held by the holding device is exchanged for a second wafer ring which has electronic components of a second type; the substrates accommodated in the second storing section is fed out to the conveying device; the electronic components of the second type are successively bonded to the substrates; and the substrates with the electronic components of the second type bonded is accommodated in the first storing section.

摘要翻译： 一种多芯片接合方法和装置，其中具有第一类型的电子部件的第一晶片环由保持装置保持; 基板从第一存储部分送出到输送装置; 保持装置上的第一类型的电子部件依次结合到基板上; 具有第一类型的电子部件的基板被容纳在第二存储部中; 由保持装置保持的第一晶片环被更换为具有第二类型的电子部件的第二晶片环; 容纳在第二存储部中的基板被送出到输送装置; 第二类型的电子部件依次结合到基板上; 并且具有第二类型的电子部件的基板被容纳在第一存储部中。

公开(公告)号：US4674670A

公开(公告)日：1987-06-23

申请号：US762823

申请日：1985-08-06

申请人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

发明人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

IPC分类号： B23K20/00 ,  H01L21/00 ,  B23K1/00

CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

摘要： The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

摘要翻译： 本发明涉及一种制造装置，其包括连续地移动沿着框架槽传送的工件的移动装置和检测至少一部分被移动的工件的检测器装置。 移动装置由工作数据和来自检测装置的工作位置信号控制，工件被设定到预定位置。 因此，即使不同种类的工作也可以被设定为最佳的结合位置，而不需要更换单元，使得可以完全自动地执行操作并且达到一般目的。 此外，提供了使框架滑槽沿与工件移动方向成直角的方向移动的装置，使得即使在宽度方向上具有不同宽度和形状的工件也可以被放置就位 完全自动粘接。 检测器装置不仅可以在接合位置处设置，而且还可以设置在上游侧的位置，具有相对于接合位置的关系。 本发明可以特别有效地适用于焊线机和颗粒接合机。

公开(公告)号：US06760968B2

公开(公告)日：2004-07-13

申请号：US10014251

申请日：2001-10-26

申请人： Tsutomu Mimata ,  Osamu Kakutani

发明人： Tsutomu Mimata ,  Osamu Kakutani

IPC分类号： B23P1900

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/6838 ,  H01L24/75 ,  H01L2224/13 ,  H01L2924/00014 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53265 ,  Y10T156/1771 ,  Y10T279/11 ,  H01L2224/0401

摘要： A die packing device including die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of to die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers. The die holding mechanism is moved to above a tray or a substrate so that the die is packed in the tray or bonded to the substrate.

摘要翻译： 一种模具包装装置，包括：模具保持机构，包括可上下移动的连接线容纳轴;一对模具保持杆，具有用于保持模具的模具保持部，并且安装成使得这些杆自由地打开和关闭， 以及打开和关闭模具夹持杆的打开和关闭杆。 在其上表面上形成有连接线的模具被模具上推装置向上推动，模具的电线与模具保持机构的连接线接收轴接触。 当连接线接收轴通过模具的向上移动而升高给定量时，模具保持杆被关闭，使得模具保持杆的模具保持部分位于模具的下表面之下。 之后，模具上推装置的上推针被降低，导致模具被模具夹持杆保持。 将模具保持机构移动到托盘或基板的上方，使得模具被包装在托盘中或结合到基板。

公开(公告)号：US4763827A

公开(公告)日：1988-08-16

申请号：US38939

申请日：1987-04-16

申请人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

发明人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

IPC分类号： B23K20/00 ,  H01L21/00 ,  B23K31/00

CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

摘要： The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

摘要翻译： 本发明涉及一种制造装置，其包括连续地移动沿着框架槽传送的工件的移动装置和检测至少一部分被移动的工件的检测器装置。 移动装置由工作数据和来自检测装置的工作位置信号控制，工件被设定到预定位置。 因此，即使不同种类的工作也可以被设定为最佳的结合位置，而不需要更换单元，使得可以完全自动地执行操作并且达到一般目的。 此外，提供了使框架滑槽沿与工件移动方向成直角的方向移动的装置，使得即使在宽度方向上具有不同宽度和形状的工件也可以被放置就位 完全自动粘接。 检测器装置不仅可以在接合位置处设置，而且还可以设置在上游侧的位置，具有相对于接合位置的关系。 本发明可以特别有效地适用于引线接合机和颗粒接合机。

公开(公告)号：US20080304772A1

公开(公告)日：2008-12-11

申请号：US12156758

申请日：2008-06-04

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Shoji Wada

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Shoji Wada

IPC分类号： F16C32/06

CPC分类号： F16C29/025 ,  F16C29/12 ,  F16C32/0402 ,  F16C32/06 ,  F16C32/0603 ,  F16C32/0674

摘要： A hydrostatic guide system including a guide table, a transfer table, a floating amount sensor attached to the transfer table, and a control unit. The transfer table has an inner portion, in which a magnetic attraction unit including a yoke and an electromagnet is embedded, and an outer shell portion, which covers the side surface and the upper surface of the inner portion. After the inner portion houses the yoke and the electromagnet, a gap around the yoke and the electromagnet is filled with a material having appropriate strength, so that the inner portion is integrated with the outer shell portion, and the transfer surface is flattened as whole. A surrounding groove is provided around the transfer table, and pressurized fluid supplied into the groove is jetted out to the guide table.

摘要翻译： 一种静压导向系统，包括导向台，转印台，附接到转印台的浮动量传感器和控制单元。 转印台具有嵌入有包括磁轭和电磁体的磁性吸引单元的内部部分和覆盖内侧部分的侧表面和上表面的外壳部分。 在内部容纳磁轭和电磁体之后，通过具有适当强度的材料填充磁轭和电磁体周围的间隙，使得内部与外壳部分一体化，并且转印表面整体变平。 在转印台周围设置有周围的槽，并且供给到槽中的加压流体喷射到导向台。

公开(公告)号：US20060269655A1

公开(公告)日：2006-11-30

申请号：US11498173

申请日：2006-08-03

申请人： Makoto Higami ,  Kohei Goto ,  Nagayuki Kanaoka ,  Ryoichiro Takahashi ,  Yoichi Asano ,  Osamu Kakutani ,  Gen Okiyama

发明人： Makoto Higami ,  Kohei Goto ,  Nagayuki Kanaoka ,  Ryoichiro Takahashi ,  Yoichi Asano ,  Osamu Kakutani ,  Gen Okiyama

IPC分类号： B05D5/12

CPC分类号： H01M8/1023 ,  H01M4/8605 ,  H01M4/92 ,  H01M4/926 ,  H01M8/1004 ,  H01M8/1039 ,  H01M8/1053 ,  Y02P70/56

摘要： The present invention is intended to provide a process for producing an electrolyte membrane-bonded electrode having excellent power generation property when constitutes an electrode assembly, and a varnish composition for an electrolyte, by the use of which an electrolyte membrane-electrode bonded structure capable of retaining excellent power generation property is obtained. A process for producing a first electrolyte membrane-bonded electrode comprises applying, onto an electrode, a water-containing dispersion containing a perfluorosulfonic acid polymer, an organic solvent A and water and having a perfluorosulfonic acid polymer content of 0.5 to 20% by weight and then applying, onto the resulting film, a solution of sulfonated polyarylene in an organic solvent B, to form an electrolyte membrane. A process for producing a second electrolyte membrane-bonded electrode comprises applying, onto an electrode, a solution or dispersion containing a proton-conductive polymer, an organic solvent B and water and having a water content of 25 to 50% by weight and then applying, onto the resulting film, a solution or dispersion containing a proton-conductive polymer, an organic solvent B and water and having a water content of less than 25% by weight, to form an electrolyte membrane. A process for producing a third electrolyte membrane-bonded electrode comprises applying, onto an electrode, a varnish composition 6 obtained by dissolving a sulfonated polymer in a solvent containing an organic solvent C, an organic solvent D and water to form an electrolyte membrane, said organic solvent C being a good solvent for the sulfonated polymer and having a higher boiling point than that of other solvent components, said organic solvent D having a boiling point of not lower than 50° C. and being not a good solvent for the sulfonated polymer when used alone but causing a solubility region of the sulfonated polymer to appear when mixed with the organic solvent C and/or the water. The varnish composition 6 of the invention is a varnish composition obtained by dissolving the sulfonated polymer in a solvent containing an organic solvent C, an organic solvent D and water.

公开(公告)号：US07096912B2

公开(公告)日：2006-08-29

申请号：US10808845

申请日：2004-03-25

申请人： Osamu Kakutani

发明人： Osamu Kakutani

IPC分类号： B23Q15/26

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K37/0247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T156/1702 ,  Y10T156/1768 ,  H01L2924/00014

摘要： A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid pressure so that the bonding head 120 is movable in the horizontal plane. The linear motors 130 and 140 respectively include driving sections 132 and 142 and movable coil assemblies 134 and 144. An arm 136 extending from the movable coil assembly 134 of the first linear motor 130 is fastened to the bonding head 120, and an arm 146 extending from the movable coil assembly 144 of the second linear motor 140 is engaged with the bonding head 120. A driving force aimed at the center of gravity of the bonding head 120 is applied to the bonding head 120 via the arms 136 and 146, so that the bonding head 120 is moved.

摘要翻译： 一种接合装置，在支撑台12上包括两个线性电动机130和140以及通过流体压力支撑接合头120的接合头支撑台114，使得接合头120可在水平面中移动。 线性电动机130和140分别包括驱动部分132和142以及可移动线圈组件134和144.从第一线性电动机130的可动线圈组件134延伸的臂136被紧固到接合头120，并且臂146延伸 来自第二线性电动机140的可动线圈组件144的接合头与接合头120接合。针对接合头120的重心的驱动力经由臂136和146施加到接合头120，使得 接合头120移动。

公开(公告)号：US20050211746A1

公开(公告)日：2005-09-29

申请号：US11089262

申请日：2005-03-24

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

IPC分类号： H01L21/60 ,  B23K1/06 ,  B23K20/00

CPC分类号： B23K20/005 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78823

摘要： A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.

摘要翻译： 一种接合装置，包括前连杆，其下端可旋转地连接到接合臂和上部，可转动地连接到接合头，并且后连杆的下端可旋转地连接到接合臂和上部的后端， 连接到焊接头; 并且接合臂的假想旋转中心位于接合面上，并且被设置为连接前连杆的上下旋转中心的线和连接后连杆的上下旋转中心的线 其特征在于，所述马达的不可移动元件固定在所述接合头上，所述马达的旋转元件安装在所述后连杆的上端，使得所述旋转元件围绕所述后连杆的上旋转中心旋转。

公开(公告)号：US20050202308A1

公开(公告)日：2005-09-15

申请号：US11074931

申请日：2005-03-09

申请人： Ryoichiro Takahashi ,  Chikara Iwasawa ,  Masahiro Ise ,  Yoichi Asano ,  Hideki Watanabe ,  Atsuhito Yoshizawa ,  Takashi Suzuki ,  Osamu Kakutani

发明人： Ryoichiro Takahashi ,  Chikara Iwasawa ,  Masahiro Ise ,  Yoichi Asano ,  Hideki Watanabe ,  Atsuhito Yoshizawa ,  Takashi Suzuki ,  Osamu Kakutani

IPC分类号： H01M4/86 ,  H01M4/88 ,  H01M4/94 ,  H01M4/96 ,  H01M8/02 ,  H01M8/10

CPC分类号： H01M8/1004 ,  H01M4/8605 ,  H01M4/8642 ,  H01M4/8652 ,  H01M4/8657

摘要： In a polymer electrolyte fuel cell in which a cathode diffusion layer, a cathode electrode catalyst layer, a polymer electrolyte membrane, an anode electrode catalyst layer, and an anode diffusion layer are laminated in this order, electron conductivity of the cathode electrode catalyst layer at a portion on the side of the cathode diffusion layer is higher than at a portion on the side of the polymer electrolyte membrane and electron conductivity of the cathode electrode catalyst layer at the portion on the side of the polymer electrolyte membrane is lower than at the portion on the side of the cathode diffusion layer, and furthermore, electron conductivity of the anode electrode catalyst layer at a portion on the side of the anode diffusion layer is higher than at a portion on the side of the polymer electrolyte membrane and electron conductivity of the anode electrode catalyst layer at the portion on the side of the polymer electrolyte membrane is lower than at the portion on the side of the anode diffusion layer.

摘要翻译： 在其中依次层叠有阴极扩散层，阴极电极催化剂层，高分子电解质膜，阳极电极催化剂层，阳极扩散层的固体高分子型燃料电池中，阴极电极催化剂层的电子传导性为 阴极扩散层侧的部分高于聚合物电解质膜侧的部分，并且在高分子电解质膜侧的部分处的阴极电极催化剂层的电子传导性低于部分 在阳极扩散层侧，阳极扩散层侧的部分的阳极电极催化剂层的电子传导性高于高分子电解质膜侧的部分的电子传导性， 高分子电解质膜一侧部分的阳极电极催化剂层比Si的部分低 de的阳极扩散层。