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13 条记录 (耗时 0.016 秒)

    Die holding mechanism for a die with connecting wires thereon
    1.
    发明授权
    Die holding mechanism for a die with connecting wires thereon 失效
    具有连接线的模具的模具保持机构

    公开(公告)号：US06505397B1

    公开(公告)日：2003-01-14

    申请号：US09596681

    申请日：2000-06-19

    申请人： Tsutomu Mimata ,  Osamu Kakutani

    发明人： Tsutomu Mimata ,  Osamu Kakutani

    IPC分类号： B23P1900

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/6838 ,  H01L24/75 ,  H01L2224/13 ,  H01L2924/00014 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53265 ,  Y10T156/1771 ,  Y10T279/11 ,  H01L2224/0401

    摘要： A die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of the die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers. The die holding mechanism is moved to above a tray or a substrate so that the die is packed in the tray or bonded to the substrate.

    摘要翻译： 一种模具保持机构，包括可上下移动的连接线容纳轴，一对模具保持杆，其具有用于保持模具的模具保持部，并且安装成使得这些杆自由地打开和关闭， 封闭杆，打开和关闭模具夹持杆。 在其上表面形成有连接线的模具被模具上推装置向上推动，并且模具的线与模具保持机构的连接线接收轴接触。 当连接线接收轴通过模具的向上移动而升高给定量时，模具保持杆被关闭，使得模具保持杆的模具保持部分位于模具的下表面之下。 之后，模具上推装置的上推针被降低，导致模具被模具夹持杆保持。 将模具保持机构移动到托盘或基板的上方，使得模具被包装在托盘中或结合到基板。

    Multi-chip bonding method and apparatus
    2.
    发明授权
    Multi-chip bonding method and apparatus 失效
    多芯片接合方法和装置

    公开(公告)号：US06383844B2

    公开(公告)日：2002-05-07

    申请号：US09748812

    申请日：2000-12-26

    申请人： Tsutomu Mimata ,  Osamu Kakutani

    发明人： Tsutomu Mimata ,  Osamu Kakutani

    IPC分类号： H01L2144

    CPC分类号： H01L21/67144 ,  Y10S438/907

    摘要： A multi-chip bonding method and apparatus, in which a first wafer ring which has electronic components of a first type is held by a holding device; substrates are fed out to a conveying device from the first storing section; the electronic components of the first type on the holding device are successively bonded to the substrates; the substrates with the electronic components of the first type bonded is accommodated in the second storing section; the first wafer ring held by the holding device is exchanged for a second wafer ring which has electronic components of a second type; the substrates accommodated in the second storing section is fed out to the conveying device; the electronic components of the second type are successively bonded to the substrates; and the substrates with the electronic components of the second type bonded is accommodated in the first storing section.

    摘要翻译： 一种多芯片接合方法和装置，其中具有第一类型的电子部件的第一晶片环由保持装置保持; 基板从第一存储部分送出到输送装置; 保持装置上的第一类型的电子部件依次结合到基板上; 具有第一类型的电子部件的基板被容纳在第二存储部中; 由保持装置保持的第一晶片环被更换为具有第二类型的电子部件的第二晶片环; 容纳在第二存储部中的基板被送出到输送装置; 第二类型的电子部件依次结合到基板上; 并且具有第二类型的电子部件的基板被容纳在第一存储部中。

    Manufacturing apparatus
    3.
    发明授权
    Manufacturing apparatus 失效
    制造设备

    公开(公告)号：US4674670A

    公开(公告)日：1987-06-23

    申请号：US762823

    申请日：1985-08-06

    申请人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    发明人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    IPC分类号： B23K20/00 ,  H01L21/00 ,  B23K1/00

    CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

    摘要： The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

    摘要翻译： 本发明涉及一种制造装置，其包括连续地移动沿着框架槽传送的工件的移动装置和检测至少一部分被移动的工件的检测器装置。 移动装置由工作数据和来自检测装置的工作位置信号控制，工件被设定到预定位置。 因此，即使不同种类的工作也可以被设定为最佳的结合位置，而不需要更换单元，使得可以完全自动地执行操作并且达到一般目的。 此外，提供了使框架滑槽沿与工件移动方向成直角的方向移动的装置，使得即使在宽度方向上具有不同宽度和形状的工件也可以被放置就位 完全自动粘接。 检测器装置不仅可以在接合位置处设置，而且还可以设置在上游侧的位置，具有相对于接合位置的关系。 本发明可以特别有效地适用于焊线机和颗粒接合机。

    Die packing device
    4.
    发明授权
    Die packing device 失效
    模具包装设备

    公开(公告)号：US06760968B2

    公开(公告)日：2004-07-13

    申请号：US10014251

    申请日：2001-10-26

    申请人： Tsutomu Mimata ,  Osamu Kakutani

    发明人： Tsutomu Mimata ,  Osamu Kakutani

    IPC分类号： B23P1900

    CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L21/6838 ,  H01L24/75 ,  H01L2224/13 ,  H01L2924/00014 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53265 ,  Y10T156/1771 ,  Y10T279/11 ,  H01L2224/0401

    摘要： A die packing device including die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of to die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers. The die holding mechanism is moved to above a tray or a substrate so that the die is packed in the tray or bonded to the substrate.

    摘要翻译： 一种模具包装装置，包括：模具保持机构，包括可上下移动的连接线容纳轴;一对模具保持杆，具有用于保持模具的模具保持部，并且安装成使得这些杆自由地打开和关闭， 以及打开和关闭模具夹持杆的打开和关闭杆。 在其上表面上形成有连接线的模具被模具上推装置向上推动，模具的电线与模具保持机构的连接线接收轴接触。 当连接线接收轴通过模具的向上移动而升高给定量时，模具保持杆被关闭，使得模具保持杆的模具保持部分位于模具的下表面之下。 之后，模具上推装置的上推针被降低，导致模具被模具夹持杆保持。 将模具保持机构移动到托盘或基板的上方，使得模具被包装在托盘中或结合到基板。

    Manufacturing method
    5.
    发明授权
    Manufacturing method 失效
    制造方法

    公开(公告)号：US4763827A

    公开(公告)日：1988-08-16

    申请号：US38939

    申请日：1987-04-16

    申请人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    发明人： Kenji Watanabe ,  Isamu Yamazaki ,  Ryuichi Kyomasu ,  Nobuhiro Takasugi ,  Tsutomu Mimata ,  Osamu Kakutani

    IPC分类号： B23K20/00 ,  H01L21/00 ,  B23K31/00

    CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

    摘要： The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position.The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

    摘要翻译： 本发明涉及一种制造装置，其包括连续地移动沿着框架槽传送的工件的移动装置和检测至少一部分被移动的工件的检测器装置。 移动装置由工作数据和来自检测装置的工作位置信号控制，工件被设定到预定位置。 因此，即使不同种类的工作也可以被设定为最佳的结合位置，而不需要更换单元，使得可以完全自动地执行操作并且达到一般目的。 此外，提供了使框架滑槽沿与工件移动方向成直角的方向移动的装置，使得即使在宽度方向上具有不同宽度和形状的工件也可以被放置就位 完全自动粘接。 检测器装置不仅可以在接合位置处设置，而且还可以设置在上游侧的位置，具有相对于接合位置的关系。 本发明可以特别有效地适用于引线接合机和颗粒接合机。

    Grinding method
    6.
    发明授权
    Grinding method 失效
    研磨方法

    公开(公告)号：US4016855A

    公开(公告)日：1977-04-12

    申请号：US608733

    申请日：1975-08-28

    申请人： Tsutomu Mimata

    发明人： Tsutomu Mimata

    IPC分类号： H01L21/301 ,  B23D59/02 ,  B28D5/00 ,  B28D5/02 ,  B28D1/04

    CPC分类号： B28D5/0076 ,  B23D59/02 ,  B28D5/022

    摘要： A method for segmenting a plate-like material, particularly a semiconductor wafer on which a plurality of elements are formed in regular arrangement, is provided. Segmentation is performed while flowing a fluid over the entire surface of the plate-like material to wash the surface thereof.

    摘要翻译： 提供了一种用于分割板状材料，特别是其上以规则排列形成有多个元件的半导体晶片的方法。 当流体流过板状材料的整个表面以洗涤其表面时进行分段。

    Manufacturing apparatus
    7.
    发明授权
    Manufacturing apparatus 失效
    制造设备

    公开(公告)号：US4890780A

    公开(公告)日：1990-01-02

    申请号：US93715

    申请日：1987-09-08

    申请人： Tsutomu Mimata ,  Toshihide Uematsu ,  Katsuhiro Tabata

    发明人： Tsutomu Mimata ,  Toshihide Uematsu ,  Katsuhiro Tabata

    IPC分类号： H01L21/02 ,  H01L21/56

    CPC分类号： H01L21/02 ,  H01L24/78 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/14

    摘要： A manufacturing apparatus has a clean air supply means provided integrally with a part thereof for supplying clean air toward at least an area in which a workpiece exists, and an air discharge means disposed so as to face the clean air supply means across the workpiece and adapted to discharge the air to the outside of the apparatus. It is therefore possible for clean air to be constantly supplied to the workpiece area under positive pressure. Thus, there is no risk of dust generated not only inside but also outside the apparatus being moved to the vicinity of the workpiece. Accordingly, it is possible to prevent adhesion of dust to the surface of the workpiece by the apparatus alone and also possible to install the apparatus as desired.

    摘要翻译： 一种制造装置具有与其一部分一体地设置的清洁空气供给装置，用于朝向至少存在工件的区域供应清洁空气;以及空气排出装置，其布置成跨过工件面对清洁空气供应装置，并适应 以将空气排出到设备的外部。 因此，可以在正压力下将清洁空气恒定地供给到工件区域。 因此，不仅在内部而且设备外部产生的灰尘不会被移动到工件附近。 因此，可以防止由设备单独地将灰尘附着到工件的表面，并且还可以根据需要安装设备。

    Electronic device and method of fabricating the same
    8.
    发明授权
    Electronic device and method of fabricating the same 失效
    电子装置及其制造方法

    公开(公告)号：US4348751A

    公开(公告)日：1982-09-07

    申请号：US916923

    申请日：1978-06-19

    申请人： Hideki Kosaka ,  Tsutomu Mimata ,  Tsuyoshi Shimizu ,  Hideharu Yamamoto ,  Kaoru Itoh ,  Yasuhusa Shima

    发明人： Hideki Kosaka ,  Tsutomu Mimata ,  Tsuyoshi Shimizu ,  Hideharu Yamamoto ,  Kaoru Itoh ,  Yasuhusa Shima

    IPC分类号： G04G17/02 ,  H01M2/10 ,  G04C19/00 ,  G04C23/02

    CPC分类号： G04G17/02 ,  H01M2/1044 ,  H01L2924/0002

    摘要： An electronic device having an indicator element and a plurality of other electronic parts for electrically driving the indicator element compactly assembled one another, which includes, as fundamental structure, lead conductors for electrically connecting the indicator element and the electronic parts to one another, and resin member completely embedding the lead conductors except the electrical contact portions between each electronic part and the lead conductors and having sections for receiving the electronic parts. This invention may be applied to the module for an electronic wrist watch using the LCD indicator element to thereby enable easy and compact assembly of the indicator element and the other electronic parts into the module.

    摘要翻译： 一种电子设备，具有指示元件和多个用于电驱动指示元件的其他电子元件，其彼此紧凑地组装，其包括作为基本结构的用于将指示元件和电子元件彼此电连接的引线导体和树脂 构件完全嵌入除了每个电子部件和引线导体之间的电接触部分之外的引线导体，并具有用于接收电子部件的部分。 本发明可以应用于使用LCD指示元件的电子手表用模块，从而能够将指示元件和其他电子部件容易且紧凑地组装到模块中。

    Conveyor apparatus for dies and small components
    9.
    发明授权
    Conveyor apparatus for dies and small components 失效
    模具和小零件输送设备

    公开(公告)号：US06579057B2

    公开(公告)日：2003-06-17

    申请号：US09874599

    申请日：2001-06-05

    申请人： Tsutomu Mimata ,  Hiroshi Watanabe ,  Yasushi Sato

    发明人： Tsutomu Mimata ,  Hiroshi Watanabe ,  Yasushi Sato

    IPC分类号： B65G4791

    CPC分类号： H01L21/67144 ,  Y10T29/49128 ,  Y10T29/53183 ,  Y10T156/1744

    摘要： A conveyor apparatus for conveying, for instance, dies, comprising: an X-axis moving block movable in an X-axis direction that is a lead frame conveying direction, a Y-axis moving block installed on the X-axis moving block and moved in a Y-axis direction that is perpendicular to the X-axis direction, a nozzle holder installed on the Y-axis moving block so as to be movable upward and downward, a Z-axis guide rail installed on the X-axis moving block and has an inclined part that rises from a die pick-up position side toward a die bonding position side, a Z-axis moving plate moved upward and downward along the Z-axis guide rail and is connected to the nozzle holder, and a suction chucking nozzle that holds the dies by vacuum suction and is installed so as to be moved upward and downward on the nozzle holder and together with the nozzle holder.

    摘要翻译： 一种用于输送例如模具的输送装置，包括：X轴移动块，其沿作为引线框输送方向的X轴方向移动，Y轴移动块安装在X轴移动块上并移动 在与X轴方向垂直的Y轴方向上，安装在Y轴移动块上以能够上下移动的喷嘴保持架，安装在X轴移动块上的Z轴导轨 并且具有从模具拾取位置侧朝向模具接合位置侧上升的倾斜部，Z轴移动板沿着Z轴导轨上下移动并与喷嘴保持架连接， 夹紧喷嘴，其通过真空吸附保持模具，并且安装成在喷嘴保持器上与喷嘴保持器一起向上和向下移动。