公开(公告)号：US5731111A

公开(公告)日：1998-03-24

申请号：US823871

申请日：1997-03-25

申请人： Nobuaki Yamada ,  Shuichi Kozaki ,  Tsuyoshi Nakano ,  Reiko Sasaki ,  Yoshikatsu Okada

发明人： Nobuaki Yamada ,  Shuichi Kozaki ,  Tsuyoshi Nakano ,  Reiko Sasaki ,  Yoshikatsu Okada

IPC分类号： G02B5/20 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1337

CPC分类号： G02F1/133514 ,  G02B5/201 ,  G02F1/133377 ,  G02F2001/133757

摘要： A color filter of the present invention includes: a conductive layer having low conductivity regions; and a plurality of colored regions included in a colored layer on the conductive layer, wherein each of the colored regions has a concave portion at a position corresponding to each of the low conductivity regions.

摘要翻译： 本发明的滤色器包括：具有低导电性区域的导电层; 以及包括在导电层上的着色层中的多个着色区域，其中每个着色区域在对应于每个低导电区域的位置处具有凹部。

公开(公告)号：US5725976A

公开(公告)日：1998-03-10

申请号：US786291

申请日：1997-01-22

申请人： Tsuyoshi Nakano ,  Reiko Sasaki ,  Yoshikatsu Okada

发明人： Tsuyoshi Nakano ,  Reiko Sasaki ,  Yoshikatsu Okada

IPC分类号： G02B6/255 ,  G02F1/1335 ,  G02B5/20

CPC分类号： G02F1/133514 ,  G02B6/2551 ,  G02F1/133512

摘要： A color filter comprising a transparent substrate, more than one transparent, electrically conductive circuit provided on a surface of the transparent substrate, window-shaped, colored coating films on the more than one transparent, electrically conductive circuit, and frame-shaped light-screening coating films interlaced between the window-shaped, colored coating films, the frame-shaped light-screening coating films having a larger film thickness than the window-shaped, colored coating films, which is free from the leakage of light from around each of the colored coating films so that it provides high contrast image and its method of manufacture.

摘要翻译： 一种滤色器，包括透明基板，设置在透明基板的表面上的多于一个透明导电电路，多于一个透明导电电路上的窗形彩色涂层和框架形光栅 在窗形彩色涂膜之间交织的涂膜，具有比窗形彩色涂膜大的膜厚度的框状遮光涂膜，其没有从每个 使其具有高对比度的图像及其制造方法。

公开(公告)号：US5561011A

公开(公告)日：1996-10-01

申请号：US292962

申请日：1994-08-22

申请人： Susumu Miyazaki ,  Tsuyoshi Nakano ,  Yoshikatsu Okada ,  Jun-ichi Yasukawa ,  Miki Matsumura ,  Kazuo Tsueda

发明人： Susumu Miyazaki ,  Tsuyoshi Nakano ,  Yoshikatsu Okada ,  Jun-ichi Yasukawa ,  Miki Matsumura ,  Kazuo Tsueda

IPC分类号： G02B5/20 ,  G02F1/1335 ,  G03F7/20 ,  H05K3/00 ,  H05K3/24 ,  G03F9/00

CPC分类号： G03F7/2022 ,  G02F1/133512 ,  H05K3/0082 ,  H05K3/244

摘要： A method for manufacturing a substrate having electrically conductive circuits on the surface of a transparent substrate, window-shaped coating films on the electrically conductive circuits and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, includes the steps of:(a) coating the surface of a transparent substrate with a photoresist composition to cover the circuits-carrying surface of the substrate, followed by forming a photoresist coating film,(b) superposing a photomask on the surface of the photoresist coating film formed through step (a) and exposing the thus masked photoresist coating film to light,(c) subjecting the substrate formed through steps (a) and (b) to development, and eliminating the photoresist coating film in the frame-shaped part,(d) subjecting the photoresist coating film left in step (c) to heat-treatment,(e) coating the substrate obtained through steps (a) to (d) in this order with a negative photoresist composition containing a function-imparting additive to cover the circuits-carrying surface of the substrate, followed by forming a functional coating film,(f) exposing the substrate obtained through steps (a) to (e) in this order to light emitted from the opposite side of the circuits-carrying surface of the substrate,(g) subjecting the substrate obtained through steps (a) through (f) in this order to development, and eliminating the uncured part of the functional coating film,(h) eliminating the photoresist coating film having been heat-treated in step (d), and (i) subjecting the substrate obtained through steps (a) to (h) in this order to electro-deposition using the circuits on the substrate as one electrode, and forming electro-deposition coating films at the window-shaped parts on the circuits.

公开(公告)号：US5503732A

公开(公告)日：1996-04-02

申请号：US273967

申请日：1994-07-12

申请人： Susumu Miyazaki ,  Tsuyoshi Nakano ,  Yoshikatsu Okada ,  Yasuhiko Teshima ,  Miki Matsumura

发明人： Susumu Miyazaki ,  Tsuyoshi Nakano ,  Yoshikatsu Okada ,  Yasuhiko Teshima ,  Miki Matsumura

IPC分类号： G02B5/20 ,  G02F1/1335 ,  G03F7/00 ,  C25D7/00

CPC分类号： G03F7/0007

摘要： A method for manufacturing a substrate useful as a color filter for LCD and having window-shaped coating films and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, which comprises the steps of:(a) forming a functional coating film on a transparent substrate having electrically conductive circuits on a surface thereof,(b) superposing a photomask having a predetermined pattern on the surface of the coating film formed in step (a), and exposing the thus masked coating film to light,(c) subjecting the intermediate product to developing to leave a frame-shaped coating film, and(d) subjecting the resulting substrate formed through steps (a) to (c) to electro-deposition to form electro-deposition coating films on the electrically conductive circuits, enables production of coating films of fine pattern with improved precision.

摘要翻译： 一种制造用作LCD的滤色器的基板的方法，其具有窗形涂膜和在未被窗形涂膜所占据的区域上的框状的功能性涂膜，其包括以下步骤：（a ）在其表面上具有导电电路的透明基板上形成功能性涂膜，（b）在步骤（a）中形成的涂膜的表面上叠加具有预定图案的光掩模，并将这样被掩蔽的涂膜 （c）对中间产物进行显影以留下框状涂膜，（d）对由步骤（a）至（c）形成的所得衬底进行电沉积以形成电沉积涂膜 在导电电路上，能够以精度提高精细图案的涂膜。

公开(公告)号：US20080018909A1

公开(公告)日：2008-01-24

申请号：US11779754

申请日：2007-07-18

申请人： Tatsuo Osaka ,  Yoshikatsu Okada ,  Shigeru Yamada ,  Keiji Sakai

发明人： Tatsuo Osaka ,  Yoshikatsu Okada ,  Shigeru Yamada ,  Keiji Sakai

IPC分类号： G01B9/02

CPC分类号： G01B11/08 ,  G01N15/1463 ,  G01N2013/0208 ,  G01N2015/1497

摘要： In order to accurately measure a shape feature of a minute droplet arranged on a substrate by a simple method, with respect to the droplet, the substrate is perpendicularly irradiated with laser light to cause diffracted light fluxes generated during passage of the laser light through the droplet to interfere with each other, so that a diffraction pattern is obtained. The diffraction pattern formed on a screen of a detector as an image is picked up by an image pickup apparatus. The shape feature of the droplet is measured by using the resultant diffraction pattern and a refractive index of the droplet.

摘要翻译： 为了通过简单的方法精确地测量布置在基板上的微小液滴的形状特征，相对于液滴，用激光垂直地照射基板，使激光通过液滴时产生的衍射光束 彼此干涉，从而获得衍射图案。 在作为图像的检测器的屏幕上形成的衍射图案由图像拾取装置拾取。 通过使用所得到的衍射图案和液滴的折射率来测量液滴的形状特征。

公开(公告)号：US5503952A

公开(公告)日：1996-04-02

申请号：US404741

申请日：1995-03-15

申请人： Tameyuki Suzuki ,  Akira Kubo ,  Yoshikatsu Okada

发明人： Tameyuki Suzuki ,  Akira Kubo ,  Yoshikatsu Okada

IPC分类号： G02B5/20 ,  G03F9/00

CPC分类号： G02B5/201

摘要： A color filter having discrete color layers arrayed on a substrate and light screening coating films interlaced between the color layers and if desired seal part having no coating film thereon, with high precision is industrially advantageously manufactured by (a) forming a transparent electroconductive layer on a transparent substrate, (b) coating the transparent electroconductive layer with a positive photoresist composition to form a photoresist layer, (c) exposing the photoresist layer to light through a photomask and developing the light-exposed photoresist layer to form a circuit-form photoresist layer, (d) etching and eliminating the transparent electroconductive layer bared in the gaps between the circuit-form photoresist layer to obtain a substrate having thereon a circuit-form laminate, (e) exposing the laminate to light through a photomask and developing the light-exposed laminate to bare the transparent electroconductive layer discretely, (f) carrying out electrodeposition using a thermosetting or photosensitive resin material-containing electro-deposition bath to form colored layers on the discretely bared transparent electroconductive layers, (g) eliminating the photoresist layer remaining after the development of step (e) to obtain a substrate having discrete color layers, the gaps being bared substrate surface and bared transparent electroconductive layer, (h) coating the substrate with a light screening material-containing photosensitive resin composition to form a light screening resin layer, and (i) exposing the light screening resin layer to light from the back side and developing the substrate to eliminate the unexposed part of the light screening resin layer. The color filter is well prevented from leakage of light and clear in coloration and superior in optical properties. A liquid crystal display of high image quality is manufactured by the use of this color filter.

公开(公告)号：US07486403B2

公开(公告)日：2009-02-03

申请号：US11779754

申请日：2007-07-18

申请人： Tatsuo Osaka ,  Yoshikatsu Okada ,  Shigeru Yamada ,  Keiji Sakai

发明人： Tatsuo Osaka ,  Yoshikatsu Okada ,  Shigeru Yamada ,  Keiji Sakai

IPC分类号： G01B11/02 ,  G01N21/00

CPC分类号： G01B11/08 ,  G01N15/1463 ,  G01N2013/0208 ,  G01N2015/1497

摘要： In order to accurately measure a shape feature of a minute droplet arranged on a substrate by a simple method, with respect to the droplet, the substrate is perpendicularly irradiated with laser light to cause diffracted light fluxes generated during passage of the laser light through the droplet to interfere with each other, so that a diffraction pattern is obtained. The diffraction pattern formed on a screen of a detector as an image is picked up by an image pickup apparatus. The shape feature of the droplet is measured by using the resultant diffraction pattern and a refractive index of the droplet.

摘要翻译： 为了通过简单的方法精确地测量布置在基板上的微小液滴的形状特征，相对于液滴，用激光垂直地照射基板，使激光通过液滴时产生的衍射光束 彼此干涉，从而获得衍射图案。 在作为图像的检测器的屏幕上形成的衍射图案由图像拾取装置拾取。 通过使用所得到的衍射图案和液滴的折射率来测量液滴的形状特征。

公开(公告)号：US20060147916A1

公开(公告)日：2006-07-06

申请号：US10521305

申请日：2003-07-18

申请人： Toru Ishibashi ,  Yoshikatsu Okada ,  Katsuaki Kuge

发明人： Toru Ishibashi ,  Yoshikatsu Okada ,  Katsuaki Kuge

IPC分类号： C12Q1/68 ,  C12M1/34

CPC分类号： G01N33/54353

摘要： A method of producing a probe carrier in which a probe is immobilized to a substrate is disclosed, which comprises providing the substrate and contacting a basic group introduced to the substrate with the probe having an acidic group to thereby immobilize the probe to the substrate. This method enables production of a probe carrier that can reduce the number of steps performed for immobilizing the probe to the substrate and easily immobilize the probe.

摘要翻译： 公开了一种生产探针载体的方法，其中将探针固定在基底上，其包括提供基底并使引入基底的碱性基团与具有酸性基团的探针接触，从而将探针固定在基底上。 该方法能够生产探针载体，其可以减少将探针固定到基底上并且容易地固定探针的步骤数。

公开(公告)号：US06803075B2

公开(公告)日：2004-10-12

申请号：US10379509

申请日：2003-03-06

申请人： Kenichi Iwata ,  Yoshikatsu Okada

发明人： Kenichi Iwata ,  Yoshikatsu Okada

IPC分类号： C23C1604

CPC分类号： C23C14/228 ,  C23C14/04 ,  H01L21/2855 ,  H01L21/32051 ,  H01L21/76838

摘要： A film deposition method includes the steps of preparing a first chamber, a second chamber, and a transport connector which connects the first chamber and the second chamber with each other, setting a pressure in the second chamber to be lower than a pressure in the first chamber, and introducing a plurality of kinds of particles into the second chamber using a differential pressure between the pressure in the first chamber and the pressure in the second chamber so that the particles collide with a substrate placed in the second chamber to form a film on the substrate. The plurality of kinds of particles include particles of a sublimable substance and particles of a material for forming the film on the substrate in the second chamber. Consequently, cleaning by the sublimable substance and film deposition by the material for forming the film are performed simultaneously.

摘要翻译： 薄膜沉积方法包括以下步骤：制备将第一腔室和第二腔室相互连接的第一腔室，第二腔室和输送连接器，将第二腔室中的压力设定为低于第一腔室中的压力 并且使用第一室中的压力和第二室中的压力之间的压差将多种颗粒引入第二室中，使得颗粒与放置在第二室中的基板碰撞以形成膜 底物。 多种颗粒包括可升华物质的颗粒和在第二室中的基板上形成膜的材料的颗粒。 因此，通过可升华物质的清洗和用于形成膜的材料的膜沉积同时进行。

公开(公告)号：US5589711A

公开(公告)日：1996-12-31

申请号：US365502

申请日：1994-12-28

申请人： Toshifumi Sano ,  Masahiro Yamada ,  Yoshiaki Umezawa ,  Yoshikatsu Okada ,  Akira Natori

发明人： Toshifumi Sano ,  Masahiro Yamada ,  Yoshiaki Umezawa ,  Yoshikatsu Okada ,  Akira Natori

IPC分类号： H01L23/36 ,  H01L23/40 ,  H01L23/552 ,  H01L25/04 ,  H01L25/065 ,  H01L25/18 ,  H05K9/00 ,  H01L23/34

CPC分类号： H01L23/4006 ,  H01L23/552 ,  H01L25/0655 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025

摘要： In a semiconductor package comprising a heat spreader, a heat sink, a wiring board, and a connector, a heat spreader mounted on a remaining region of the upper surface of a substrate. The heat sink is thermally connected to a primary integrated circuit chip through the heat spreader and to a secondary integrated circuit chip. The heat sink has electrical conductivity. The heat sink comprises a base plate and at least one connecting member which perpendicularly extends from the base plate. A wiring board has a plurality of contact holes and a plurality of contact slits. A connector is mounted on the wiring board. The connector has a plurality of contacts. The contacts comprises a plurality of socket portions and a plurality of terminal portions. The contacts are connected to an input/output pins with the input/output pins inserted into the respective socket portions. The terminal portions are inserted into the respective contact holes. The connector has at least one ground contact. The ground contact comprises a ground socket portion and a ground terminal portion. The at least one ground contact is electrically connected to the at least one connecting member with the connecting member inserted into the ground socket portion. The ground terminal portions are inserted into the contact slits.

摘要翻译： 在包括散热器，散热器，布线板和连接器的半导体封装中，安装在基板的上表面的剩余区域上的散热器。 散热器通过散热器和辅助集成电路芯片与初级集成电路芯片热连接。 散热片具有导电性。 散热器包括基板和从基板垂直延伸的至少一个连接构件。 布线板具有多个接触孔和多个接触狭缝。 连接器安装在接线板上。 连接器具有多个触点。 触点包括多个插座部分和多个端子部分。 触点连接到输入/输出引脚，输入/输出引脚插入相应的插座部分。 端子部分插入相应的接触孔中。 连接器至少有一个接地触点。 接地触头包括接地插座部分和接地端子部分。 所述至少一个接地触点电连接到所述至少一个连接构件，其中所述连接构件插入所述接地插座部分。 接地端子部分插入到接触缝隙中。