摘要:
A manufacturing method for a vertical transistor of random-access memory, having the steps of: defining an active region on a semiconductor substrate; forming a shallow trench isolation structure outside of the active region; etching the active region and forming a gate dielectric layer and a positioning gate thereon, forming a word line perpendicular to the positioning gate; forming spacing layers on the outer surfaces of the word line; implanting ions to the formed structure in forming an n-type and a p-type region on opposite sides of the word line with the active region; forming an n-type and a p-type floating body respectively on the n-type and p-type region; forming a source line perpendicular to the word line and connecting to the n-type floating body; forming a bit line perpendicular to the source line and connecting to the p-type floating body. Hence, a vertical transistor with steady threshold voltage is achieved.
摘要:
A memory layout structure is disclosed, in which, a lengthwise direction of each active area and each row of active areas form an included angle not equal to zero and not equal to 90 degrees, bit lines and word lines cross over each other above the active areas, the bit lines are each disposed above a row of active areas, bit line contact plugs or node contact plugs may be each disposed entirely on an source/drain region, or partially on the source/drain region and partially extend downward along a sidewall (edge wall) of the substrate of the active area to carry out a sidewall contact. Self-aligned node contact plugs are each disposed between two adjacent bit lines and between two adjacent word lines.
摘要:
A semiconductor device is disclosed which includes a silicide substrate, a nitride layer, two STIs, and a strain nitride. The silicide substrate has two doping areas. The nitride layer is deposited on the silicide substrate. The silicide substrate and the nitride layer have a recess running through. The two doping areas are at two sides of the recess. The end of the recess has an etching space bigger than the recess. The top of the silicide substrate has a fin-shaped structure. The two STIs are at the two opposite sides of the silicide substrate (recess). The strain nitride is spacer-formed in the recess and attached to the side wall of the silicide substrate, nitride layer, two STIs. The two doping areas cover the strain nitride. As a result, the efficiency of semiconductor is improved, and the drive current is increased.
摘要:
A memory layout structure is disclosed, in which, a lengthwise direction of each active area and each row of active areas form an included angle not equal to zero and not equal to 90 degrees, bit lines and word lines cross over each other above the active areas, the bit lines are each disposed above a row of active areas, bit line contact plugs or node contact plugs may be each disposed entirely on an source/drain region, or partially on the source/drain region and partially extend downward along a sidewall (edge wall) of the substrate of the active area to carry out a sidewall contact. Self-aligned node contact plugs are each disposed between two adjacent bit lines and between two adjacent word lines.
摘要:
A trench MOS structure is disclosed. The trench MOS structure includes a substrate, an epitaxial layer, a doping well, a doping region and a trench gate. The substrate has a first conductivity type, a first side and a second side opposite to the first side. The epitaxial layer has the first conductivity type and is disposed on the first side. The doping well has a second conductivity type and is disposed on the epitaxial layer. The doping region has the first conductivity type and is disposed on the doping well. The trench gate is partially disposed in the doping region. The trench gate has a bottle shaped profile with a top section smaller than a bottom section, both are partially disposed in the doping well. The bottom section of two adjacent trench gates results in a higher electrical field around the trench MOS structures.
摘要:
A MOS test structure is disclosed. A scribe line region is disposed on a substrate which has a first side and a second side opposite to the first side. An epitaxial layer is disposed on the first side, the doping well is disposed on the epitaxial layer and the doping region is disposed on the doping well. A trench gate of a first depth is disposed in the doping region, in the doping well and in the scribe line region. A conductive material fills the test via which has a second depth and an isolation covering the inner wall of the test via and is disposed in the doping region, in the doping well, in the epitaxial layer and in the scribe line region, to electrically connect to the epitaxial layer so that the test via is capable of testing the epitaxial layer and the substrate together.
摘要:
A recognition system is offered. The recognition system is for sensing a plurality of units under test of at least an object under test. The recognition system comprises a periodic guided-wave structure and a near field sensing device. The periodic guided-wave structure is disposed under the object under test and has a plurality of conductive units periodically arranged on a plane. The near field sensing device has a near field antenna and senses the plurality of units under test through detecting the near field magnetic field. The periodic guided-wave structure confines the electromagnetic field for facilitating to determine the distance from any one of the units under test to the periodic guided-wave structure.
摘要:
A high-order harmonic device of a cavity filter including a base and a lid cover the base is disclosed. The base has a through groove connecting to an upper and a lower portion. The base has a plurality of output terminal with metallic conductor extending into the inner side formed on the surface of the sidewall. The base has resonance space formed indented to receive the metallic conductor and extending to connect to the through groove. The lid has a plurality of threading holes formed corresponding to chambers and partitions received with adjusting elements for height adjustment. The adjusting elements has the resonance bars corresponding to every chamber and the suppressing bars corresponding to every partition. By adjusting suppressing bar and the partition to a predetermined distance, the space of the channel for transmitting the high-order harmonic wave can be reduced to suppress noise produced by high-order harmonic wave.
摘要:
A trench MOS structure is provided. The trench MOS structure includes a substrate, an epitaxial layer, a trench, a gate isolation, a trench gate, a guard ring and a reinforcement structure within the guard ring. The substrate has a first conductivity type, a first side and a second side opposite to the first side. The epitaxial layer has the first conductivity type and is disposed on the first side. The trench is disposed in the epitaxial layer. The gate isolation covers the inner wall of the trench. The trench gate is disposed in the trench and has the first conductivity type. The guard ring has a second conductivity type and is disposed within the epitaxial layer. The reinforcement structure has an electrically insulating material and is disposed within the guard ring.
摘要:
A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying device comprising two spray bars jointed together via a joint member.