公开(公告)号：US20240332189A1

公开(公告)日：2024-10-03

申请号：US18136885

申请日：2023-04-20

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Shih-Cheng Chen ,  Ko-Wei Lin ,  Ying-Wei Yen ,  Chun-Ling Lin ,  Po-Jen Chuang

IPC: H01L23/532 ,  H01L21/768

CPC classification number: H01L23/53238 ,  H01L21/76843 ,  H01L21/76877 ,  H01L23/53266

Abstract: A method for fabricating an interconnect structure is disclosed. A substrate with a first dielectric layer is provided. A first conductor is formed in the first dielectric layer. A second dielectric layer is formed on the first dielectric layer. A trench is formed in the second dielectric layer to expose the top surface of the first conductor. An annealing process is performed on the top surface of the first conductor. The annealing process includes the conditions of a temperature of 400-450° C., duration less than 5 minutes, and gaseous atmosphere comprising hydrogen and nitrogen.

公开(公告)号：US20140159211A1

公开(公告)日：2014-06-12

申请号：US13710382

申请日：2012-12-10

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chien-Liang Lin ,  Yu-Ren Wang ,  Ying-Wei Yen

IPC: H01L21/02 ,  H01L21/441 ,  H01L29/06

CPC classification number: H01L21/28185 ,  H01L21/02164 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/28202 ,  H01L21/3105 ,  H01L21/31155 ,  H01L21/441 ,  H01L29/0603 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/78

Abstract: A semiconductor structure includes a dielectric layer located on a substrate, wherein the dielectric layer includes nitrogen atoms, and the concentration of the nitrogen atoms in the dielectric layer is lower than 5% at a location wherein the distance between this location in the dielectric layer to the substrate is less than 20% of the thickness of the dielectric layer. Moreover, the present invention provides a semiconductor process including the following steps: a dielectric layer is formed on a substrate. Two annealing processes are performed in-situly on the dielectric layer, wherein the two annealing processes have different imported gases and different annealing temperatures.

Abstract translation: 半导体结构包括位于基板上的电介质层，其中介电层包括氮原子，并且介电层中氮原子的浓度低于5％，其中介电层中该位置之间的距离与 基板的厚度小于电介质层厚度的20％。 此外，本发明提供一种包括以下步骤的半导体工艺：在基板上形成电介质层。 在电介质层上进行两个退火工艺，其中两个退火工艺具有不同的进口气体和不同的退火温度。

公开(公告)号：US12237398B2

公开(公告)日：2025-02-25

申请号：US17338691

申请日：2021-06-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Ming Kuo ,  Po-Jen Chuang ,  Yu-Ren Wang ,  Ying-Wei Yen ,  Fu-Jung Chuang ,  Ya-Yin Hsiao ,  Nan-Yuan Huang

IPC: H01L29/66 ,  H01L21/02 ,  H01L21/265 ,  H01L21/28 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/324 ,  H01L29/08 ,  H01L29/49 ,  H01L29/51 ,  H01L29/78 ,  H01L29/423

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer adjacent to the gate structure, wherein the first spacer comprises silicon carbon nitride (SiCN); forming a second spacer adjacent to the first spacer, wherein the second spacer comprises silicon oxycarbonitride (SiOCN); and forming a source/drain region adjacent to two sides of the second spacer.

公开(公告)号：US20210296466A1

公开(公告)日：2021-09-23

申请号：US17338691

申请日：2021-06-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Ming Kuo ,  Po-Jen Chuang ,  Yu-Ren Wang ,  Ying-Wei Yen ,  Fu-Jung Chuang ,  Ya-Yin Hsiao ,  Nan-Yuan Huang

IPC: H01L29/66 ,  H01L21/02 ,  H01L21/265 ,  H01L21/324 ,  H01L29/08 ,  H01L29/78

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer adjacent to the gate structure, wherein the first spacer comprises silicon carbon nitride (SiCN); forming a second spacer adjacent to the first spacer, wherein the second spacer comprises silicon oxycarbonitride (SiOCN); and forming a source/drain region adjacent to two sides of the second spacer.

公开(公告)号：US09634083B2

公开(公告)日：2017-04-25

申请号：US13710382

申请日：2012-12-10

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chien-Liang Lin ,  Yu-Ren Wang ,  Ying-Wei Yen

IPC: H01L21/20 ,  H01L29/06 ,  H01L21/441 ,  H01L21/02 ,  H01L21/3105 ,  H01L21/3115 ,  H01L21/28 ,  H01L29/49 ,  H01L29/51 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L21/28185 ,  H01L21/02164 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/28202 ,  H01L21/3105 ,  H01L21/31155 ,  H01L21/441 ,  H01L29/0603 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/78

Abstract: A semiconductor structure includes a dielectric layer located on a substrate, wherein the dielectric layer includes nitrogen atoms, and the concentration of the nitrogen atoms in the dielectric layer is lower than 5% at a location wherein the distance between this location in the dielectric layer to the substrate is less than 20% of the thickness of the dielectric layer. Moreover, the present invention provides a semiconductor process including the following steps: a dielectric layer is formed on a substrate. Two annealing processes are performed in-situly on the dielectric layer, wherein the two annealing processes have different imported gases and different annealing temperatures.

公开(公告)号：US20170186617A1

公开(公告)日：2017-06-29

申请号：US15455109

申请日：2017-03-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chien-Liang Lin ,  Yu-Ren Wang ,  Ying-Wei Yen

IPC: H01L21/28 ,  H01L29/66 ,  H01L29/51

CPC classification number: H01L21/28185 ,  H01L21/02164 ,  H01L21/02332 ,  H01L21/02337 ,  H01L21/0234 ,  H01L21/28202 ,  H01L21/3105 ,  H01L21/31155 ,  H01L21/441 ,  H01L29/0603 ,  H01L29/4966 ,  H01L29/51 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/78

Abstract: A semiconductor structure includes a dielectric layer located on a substrate, wherein the dielectric layer includes nitrogen atoms, and the concentration of the nitrogen atoms in the dielectric layer is lower than 5% at a location wherein the distance between this location in the dielectric layer to the substrate is less than 20% of the thickness of the dielectric layer. Moreover, the present invention provides a semiconductor process including the following steps: a dielectric layer is formed on a substrate. Two annealing processes are performed in-situly on the dielectric layer, wherein the two annealing processes have different imported gases and different annealing temperatures.

公开(公告)号：US11063135B2

公开(公告)日：2021-07-13

申请号：US15996539

申请日：2018-06-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Ming Kuo ,  Po-Jen Chuang ,  Yu-Ren Wang ,  Ying-Wei Yen ,  Fu-Jung Chuang ,  Ya-Yin Hsiao ,  Nan-Yuan Huang

IPC: H01L29/66 ,  H01L21/02 ,  H01L21/265 ,  H01L21/324 ,  H01L29/08 ,  H01L29/78 ,  H01L29/51 ,  H01L21/321 ,  H01L21/3213 ,  H01L29/423 ,  H01L29/49 ,  H01L21/28

Abstract: A method for fabricating semiconductor device includes the steps of: forming a gate structure on a substrate; forming a first spacer adjacent to the gate structure, wherein the first spacer comprises silicon carbon nitride (SiCN); forming a second spacer adjacent to the first spacer, wherein the second spacer comprises silicon oxycarbonitride (SiOCN); and forming a source/drain region adjacent to two sides of the second spacer.

公开(公告)号：US20150021776A1

公开(公告)日：2015-01-22

申请号：US14507317

申请日：2014-10-06

Applicant: United Microelectronics Corp.

Inventor： Chien-Liang Lin ,  Yu-Ren Wang ,  Ying-Wei Yen ,  Wen-Yi Teng ,  Chan-Lon Yang

IPC: H01L29/49

CPC classification number: H01L29/4916 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/28035 ,  H01L29/4925

Abstract: A polysilicon layer including an amorphous polysilicon layer and a crystallized polysilicon layer is provided. The crystallized polysilicon layer is disposed on the amorphous polysilicon layer. Besides, the amorphous polysilicon layer has a first grain size, the crystallized polysilicon layer has a second grain size, and the first grain size is smaller than the second grain size. The amorphous polysilicon layer with a smaller grain size can serve as a base for the following deposition, so that the crystallized polysilicon layer formed thereon has a flatter topography, and thus, the surface roughness is reduced and the Rs uniformity within a wafer is improved.

Abstract translation: 提供了包括非晶多晶硅层和结晶的多晶硅层的多晶硅层。 结晶的多晶硅层设置在非晶多晶硅层上。 此外，非晶多晶硅层具有第一晶粒尺寸，结晶的多晶硅层具有第二晶粒尺寸，并且第一晶粒尺寸小于第二晶粒尺寸。 具有较小晶粒尺寸的非晶多晶硅层可以用作随后沉积的基底，使得其上形成的结晶多晶硅层具有更平坦的形貌，因此表面粗糙度降低，晶片内的Rs均匀性提高。