METHOD AND APPARATUS FOR CONTACTLESSLY ADVANCING SUBSTRATES
    1.
    发明申请
    METHOD AND APPARATUS FOR CONTACTLESSLY ADVANCING SUBSTRATES 审中-公开
    不间断地提高基板的方法和装置

    公开(公告)号:US20130199448A1

    公开(公告)日:2013-08-08

    申请号:US13808392

    申请日:2011-07-06

    Abstract: A method of contactlessly advancing a substrate (140), comprising: —providing a process tunnel (102), extending in a longitudinal direction and bounded by at least a first (120) and a second (134) wall; —providing first and second gas bearings (124, 134) by providing substantially laterally flowing gas alongside the first and second walls respectively; —bringing about a first longitudinal division of the process tunnel into a plurality of pressure segments (116), wherein the gas bearings (124, 34) in a pressure segment have an average gas pressure that is different from an average gas pressure of the gas bearings in an adjacent pressure segment; —providing a substrate (140) in between the first wall (120) and the second wall (130); and 1—allowing differences in average gas pressure between adjacent pressure segments (116) to drive the substrate along the longitudinal direction of the process tunnel.

    Abstract translation: 一种非接触地推进衬底(140)的方法,包括:提供在纵向方向上延伸并由至少第一(120)和第二(134)壁限定的工艺通道(102); 通过分别在第一和第二壁旁边提供基本上横向流动的气体来提供第一和第二气体轴承(124,134); 围绕加工隧道的第一纵向划分成多个压力段(116),其中压力段中的气体轴承(124,34)具有与气体的平均气体压力不同的平均气体压力 相邻压力段的轴承; - 在第一壁(120)和第二壁(130)之间提供衬底(140); 和1-允许相邻压力段(116)之间的平均气体压力的差异,以沿着处理隧道的纵向方向驱动衬底。

    Semiconductor processing parts having apertures with deposited coatings and methods for forming the same
    2.
    发明授权
    Semiconductor processing parts having apertures with deposited coatings and methods for forming the same 有权
    具有沉积涂层的孔的半导体加工部件及其形成方法

    公开(公告)号:US07807222B2

    公开(公告)日:2010-10-05

    申请号:US11856418

    申请日:2007-09-17

    Abstract: Holes in semiconductor processing reactor parts are sized to facilitate deposition of protective coatings, such as by chemical vapor deposition at atmospheric pressure. In some embodiments, the holes each have a flow constriction that narrows the holes in one part and that also divides the holes into one or more other portions. In some embodiments, the aspect ratios of the one or more other portions are about 15:1 or less, or about 7:1 or less, and have a cylindrical or conical cross-sectional shape. The holes are coated with a protective coating, such as a silicon carbide coating, by chemical vapor deposition, including chemical vapor deposition at atmospheric pressure.

    Abstract translation: 半导体处理反应器部件中的孔的尺寸适于促进保护涂层的沉积,例如通过大气压下的化学气相沉积。 在一些实施例中,孔各自具有流动收缩部,其使一部分中的孔变窄,并且还将孔分成一个或多个其它部分。 在一些实施例中,一个或多个其它部分的长宽比为约15:1或更小,或约7:1或更小,并且具有圆柱形或圆锥形横截面形状。 通过化学气相沉积(包括大气压下的化学气相沉积),用诸如碳化硅涂层的保护涂层涂覆孔。

    Temperature control for single substrate semiconductor processing reactor
    3.
    发明授权
    Temperature control for single substrate semiconductor processing reactor 有权
    单基板半导体处理反应器的温度控制

    公开(公告)号:US07427329B2

    公开(公告)日:2008-09-23

    申请号:US10410699

    申请日:2003-04-08

    Abstract: A reactor for heat treatment of a substrate having a process chamber within a substrate enclosing structure, and a support structure configured to position a substrate at a predetermined spacing between the upper part and the bottom part within the process chamber during processing. Streams of gas may lift the substrate from the support structure so that the substrate floats. A plurality of heating elements is associated with at least one of the upper part and the bottom part and are arranged to define heating zones. A controller controls the heating elements individually so that each heating zone is configured to have a predetermined temperature determined by the controller. The heating zones provide for a non-uniform heating laterally across the substrate.

    Abstract translation: 一种用于热处理在衬底封闭结构内具有处理室的衬底的反应器,以及支撑结构,其被配置为在处理期间将衬底定位在处理室内的上部和底部之间的预定间隔处。 气流可以从支撑结构提起衬底,使得衬底漂浮。 多个加热元件与上部和底部中的至少一个相关联并且被布置成限定加热区。 控制器分别控制加热元件,使得每个加热区被配置成具有由控制器确定的预定温度。 加热区域横跨衬底提供不均匀的加热。

    Methods of forming silicide films in semiconductor devices
    5.
    发明申请
    Methods of forming silicide films in semiconductor devices 有权
    在半导体器件中形成硅化物膜的方法

    公开(公告)号:US20050017310A1

    公开(公告)日:2005-01-27

    申请号:US10866643

    申请日:2004-06-10

    CPC classification number: H01L21/28518 H01L29/665

    Abstract: A method of self-aligned silicidation involves interruption of the silicidation process prior to complete reaction of the blanket material (e.g., metal) in regions directly overlying patterned and exposed other material (e.g., silicon). Diffusion of excess blanket material from over other regions (e.g., overlying insulators) is thus prevented. Control and uniformity are insured by use of conductive rapid thermal annealing in hot wall reactors, with massive heated plates closely spaced from the substrate surfaces. Interruption is particularly facilitated by forced cooling, preferably also by conductive thermal exchange with closely spaced, massive plates.

    Abstract translation: 自对准硅化的方法包括在直接覆盖图案化和暴露的其它材料(例如硅)的区域中的覆盖材料(例如金属)完全反应之前中断硅化工艺。 从而防止了过量的覆盖材料从其它区域扩散(例如,覆盖绝缘体)。 通过在热壁反应器中使用导电快速热退火来保护控制和均匀性,其中大量加热板与基板表面紧密地间隔开。 通过强制冷却特别容易地破坏中断,优选也通过与间隔紧密的块状板进行导电热交换。

    Method and system for distributed computing interface
    6.
    发明授权
    Method and system for distributed computing interface 有权
    分布式计算接口的方法和系统

    公开(公告)号:US08689115B2

    公开(公告)日:2014-04-01

    申请号:US12564010

    申请日:2009-09-21

    CPC classification number: G06F3/0486 H04L12/1827

    Abstract: A method and system for distributed computing interface are disclosed. According to one embodiment, a computer implemented method comprises accessing a collaborative interface, wherein the collaborative interface comprises persistent shared space, wherein visual representation of the collaborative interface is identical for each client accessing the collaborative interface. In a single action, an object is dragged into the collaborative interface and the object is displayed in real time in the collaborative interface. The object is accessible to other clients in the collaborative interface and the state of the object is continuously synchronized. The object is manipulated in the collaborative interface and other clients accessing the collaborative interface are viewed.

    Abstract translation: 公开了一种用于分布式计算接口的方法和系统。 根据一个实施例,计算机实现的方法包括访问协作界面,其中协作接口包括持久共享空间,其中协作接口的视觉表示对于访问协作界面的每个客户端是相同的。 在单个动作中,将对象拖入协作界面,并在对象在协作界面中实时显示。 对象可以在协作界面中访问其他客户端,并且对象的状态是持续同步的。 在协作界面中操纵该对象,并查看访问协作界面的其他客户端。

    Semiconductor processing parts having apertures with deposited coatings and methods for forming the same
    7.
    发明授权
    Semiconductor processing parts having apertures with deposited coatings and methods for forming the same 有权
    具有沉积涂层的孔的半导体加工部件及其形成方法

    公开(公告)号:US08118941B2

    公开(公告)日:2012-02-21

    申请号:US12881634

    申请日:2010-09-14

    Abstract: Holes in semiconductor processing reactor parts are sized to facilitate deposition of protective coatings, such as by chemical vapor deposition at atmospheric pressure. In some embodiments, the holes each have a flow constriction that narrows the holes in one part and that also divides the holes into one or more other portions. In some embodiments, the aspect ratios of the one or more other portions are about 15:1 or less, or about 7:1 or less, and have a cylindrical or conical cross-sectional shape. The holes are coated with a protective coating, such as a silicon carbide coating, by chemical vapor deposition, including chemical vapor deposition at atmospheric pressure.

    Abstract translation: 半导体处理反应器部件中的孔的尺寸适于促进保护涂层的沉积,例如通过大气压下的化学气相沉积。 在一些实施例中,孔各自具有流动收缩部,其使一部分中的孔变窄,并且还将孔分成一个或多个其它部分。 在一些实施例中,一个或多个其它部分的长宽比为约15:1或更小,或约7:1或更小,并且具有圆柱形或圆锥形横截面形状。 通过化学气相沉积(包括大气压下的化学气相沉积),用诸如碳化硅涂层的保护涂层涂覆孔。

    Methods of forming films in semiconductor devices with solid state reactants
    8.
    发明申请
    Methods of forming films in semiconductor devices with solid state reactants 有权
    在具有固态反应物的半导体器件中形成膜的方法

    公开(公告)号:US20070059932A1

    公开(公告)日:2007-03-15

    申请号:US11595441

    申请日:2006-11-09

    CPC classification number: H01L21/28518 H01L29/665

    Abstract: A method of self-aligned silicidation involves interruption of the silicidation process prior to complete reaction of the blanket material (e.g., metal) in regions directly overlying patterned and exposed other material (e.g., silicon). Diffusion of excess blanket material from over other regions (e.g., overlying insulators) is thus prevented. Control and uniformity are insured by use of conductive rapid thermal annealing in hot wall reactors, with massive heated plates closely spaced from the substrate surfaces. Interruption is particularly facilitated by forced cooling, preferably also by conductive thermal exchange with closely spaced, massive plates.

    Abstract translation: 自对准硅化的方法包括在直接覆盖图案化和暴露的其它材料(例如硅)的区域中的覆盖材料(例如金属)完全反应之前中断硅化工艺。 从而防止了过量的覆盖材料从其它区域扩散(例如,覆盖绝缘体)。 通过在热壁反应器中使用导电快速热退火来保护控制和均匀性,其中大量加热板与基板表面紧密地间隔开。 通过强制冷却特别容易地破坏中断,优选也通过与间隔紧密的块状板进行导电热交换。

    Method for the heat treatment of substrates
    9.
    发明申请
    Method for the heat treatment of substrates 失效
    基板热处理方法

    公开(公告)号:US20050095873A1

    公开(公告)日:2005-05-05

    申请号:US10700298

    申请日:2003-10-31

    CPC classification number: H01L21/67109 H01L21/324 H01L21/6838

    Abstract: A substrate undergoes a semiconductor fabrication process at different temperatures in a reactor without changing the temperature of the reactor. The substrate is held suspended by flowing gas between two heated surfaces of the reactor. Moving the two heated surfaces in close proximity with the substrate for a particular time duration heats the substrate to a desired temperature. The desired temperature is then maintained by distancing the heated surfaces from the substrate and holding the heated surface at the increased distance to minimize further substrate heating.

    Abstract translation: 衬底在反应器中在不改变反应器温度的情况下在不同温度下进行半导体制造工艺。 通过在反应器的两个加热表面之间流动气体将基板保持悬浮。 将两个加热的表面紧邻衬底移动特定的持续时间将衬底加热到​​所需的温度。 然后通过将加热的表面与衬底隔开并将加热的表面保持在增加的距离来保持所需的温度,以使进一步的衬底加热最小化。

    Temperature control for single substrate semiconductor processing reactor
    10.
    发明授权
    Temperature control for single substrate semiconductor processing reactor 有权
    单基板半导体处理反应器的温度控制

    公开(公告)号:US06843201B2

    公开(公告)日:2005-01-18

    申请号:US10141517

    申请日:2002-05-08

    Abstract: A reactor for heat treatment of a substrate having a process chamber within a substrate enclosing structure, and a support structure configured to position a substrate at a predetermined spacing between the upper part and the bottom part within the process chamber during processing. Streams of gas may lift the substrate from the support structure so that the substrate floats. A plurality of heating elements is associated with at least one of the upper part and the bottom part and are arranged to define heating zones. A controller controls the heating elements individually so that each heating zone is configured to have a predetermined temperature determined by the controller. The heating zones provide for a non-uniform heating laterally across the substrate.

    Abstract translation: 一种用于热处理在衬底封闭结构内具有处理室的衬底的反应器,以及支撑结构,其被配置为在处理期间将衬底定位在处理室内的上部和底部之间的预定间隔处。 气流可以从支撑结构提起衬底,使得衬底漂浮。 多个加热元件与上部和底部中的至少一个相关联并且被布置成限定加热区。 控制器分别控制加热元件,使得每个加热区被配置成具有由控制器确定的预定温度。 加热区域横跨衬底提供不均匀的加热。

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