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    Apparatus and methods of packaging and testing die
    2.
    发明授权
    Apparatus and methods of packaging and testing die 有权
    包装和测试模具的装置和方法

    公开(公告)号：US06380631B2

    公开(公告)日：2002-04-30

    申请号：US09872221

    申请日：2001-05-31

    申请人： Leonard E. Mess ,  David J. Corisis ,  Walter L. Moden ,  Larry D. Kinsman

    发明人： Leonard E. Mess ,  David J. Corisis ,  Walter L. Moden ,  Larry D. Kinsman

    IPC分类号： H01L2348

    CPC分类号： H01L22/26 ,  H01L23/055 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099

    摘要： Apparatus and methods of packaging and testing die. In one embodiment, a stacked die package includes a packaging substrate having a first surface with a recess disposed therein and a plurality of conductive leads coupled thereto, a first die attached to the packaging substrate within the recess and having a plurality of first bond pads electrically coupled to at least some of the conductive leads, and a second die attached to the first die and having a plurality of second bond pads that are electrically coupled to at least some of the conductive leads. When the stacked die package is engaged with, for example, a circuit board, the first surface of the packaging substrate is proximate the circuit board so that the packaging substrate at least partially encloses and protects the first and second die. The properties and dimensions of the packaging substrate are tailored to optimize the operational environment of the die, including improving thermal dissipation and enhancing performance of the die. In an alternate embodiment, the packaging substrate comprises an electrically conductive substrate and an electrically insulative material is formed between the conductive leads and the packaging substrate. In another embodiment, the first bond pads are electrically coupled to the conductive leads by wire-bonding. Alternately, the first bond pads are in direct contact with the conductive leads in a flip chip arrangement. In another embodiment, the die is sealed within an encapsulating layer to protect the first and second die.

    摘要翻译： 包装和测试模具的装置和方法 在一个实施例中，堆叠的管芯封装包括具有设置在其中的凹部的第一表面和与其连接的多个导电引线的封装衬底，第一管芯附接到凹部内的封装衬底，并且具有多个第一接合焊盘， 耦合到至少一些导电引线，以及附接到第一管芯的第二管芯，并且具有电耦合到至少一些导电引线的多个第二接合焊盘。 当堆叠的管芯封装与例如电路板接合时，封装衬底的第一表面靠近电路板，使得封装衬底至少部分地包围并保护第一和第二管芯。 定制包装基材的性能和尺寸以优化模具的操作环境，包括改善热耗散和提高模具的性能。 在替代实施例中，封装衬底包括导电衬底，并且在导电引线和封装衬底之间形成电绝缘材料。 在另一个实施例中，第一接合焊盘通过引线接合电耦合到导电引线。 或者，第一接合焊盘以倒装芯片布置与导电引线直接接触。 在另一个实施例中，将管芯密封在封装层内以保护第一和第二管芯。