公开(公告)号：US20060249397A1

公开(公告)日：2006-11-09

申请号：US11482586

申请日：2006-07-06

申请人： Whonchee Lee ,  Scott Moore ,  Scott Meikle

发明人： Whonchee Lee ,  Scott Moore ,  Scott Meikle

IPC分类号： B23H7/14

CPC分类号： C25F7/00 ,  B23H5/08 ,  C25F3/14

摘要： Methods and apparatuses for detecting characteristics of a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from the first and second spaced apart electrodes, contacting the microelectronic substrate with a polishing surface of a polishing medium, removing conductive material from the microelectronic substrate by moving the substrate and/or the electrodes relative to each other while passing a variable electrical signal through the electrodes and the substrate, and detecting a change in the variable electrical signal or a supplemental electrical signal passing through the microelectronic substrate. The rate at which material is removed from the microelectronic substrate can be changed based at least in part on the change in the electrical signal.

公开(公告)号：US20050034999A1

公开(公告)日：2005-02-17

申请号：US10926202

申请日：2004-08-24

申请人： Whonchee Lee ,  Scott Meikle ,  Scott Moore

发明人： Whonchee Lee ,  Scott Meikle ,  Scott Moore

IPC分类号： B23H3/00 ,  B23H5/08 ,  B24B1/00 ,  B24B7/19 ,  H01L21/8242 ,  H01L29/00

CPC分类号： B23H5/08 ,  B24B1/002

摘要： A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal medium, which can include first and second electrodes and a polishing pad. One or more electrolytes are disposed between the electrodes and the microelectronic substrate to electrically link the electrodes to the microelectronic substrate. The electrodes are then coupled to a source of varying current that electrically removes the conductive material from the substrate. The microelectronic substrate and/or the electrodes can be moved relative to each other to position the electrodes relative to a selected portion of the microelectronic substrate, and/or to polish the microelectronic substrate. The material removal medium can remove gas formed during the process from the microelectronic substrate and/or the electrodes. The medium can also have different first and second electrical characteristics to provide different levels of electrical coupling to different regions of the microelectronic substrate.

摘要翻译： 一种用于从微电子衬底去除导电材料的方法和装置。 在一个实施例中，支撑构件相对于材料去除介质支撑微电子衬底，其可以包括第一和第二电极以及抛光垫。 一个或多个电解质设置在电极和微电子衬底之间以将电极电连接到微电子衬底。 然后将电极耦合到电流从基板电除去导电材料的变化的电流源。 微电子衬底和/或电极可以相对于彼此移动以相对于微电子衬底的选定部分定位电极，和/或抛光微电子衬底。 材料去除介质可以从微电子衬底和/或电极去除在该过程期间形成的气体。 介质还可以具有不同的第一和第二电特性，以提供与微电子衬底的不同区域的不同水平的电耦合。

公开(公告)号：US20070111641A1

公开(公告)日：2007-05-17

申请号：US11616683

申请日：2006-12-27

申请人： Whonchee Lee ,  Scott Moore ,  Scott Meikle

发明人： Whonchee Lee ,  Scott Moore ,  Scott Meikle

IPC分类号： B24B7/30 ,  B24B51/00

CPC分类号： B23H5/08 ,  B24B37/042 ,  C25F3/02 ,  C25F7/00

摘要： Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate.

摘要翻译： 从微电子衬底机电和/或电化学机械去除导电材料的方法和装置。 根据一个实施例的装置包括被配置为可释放地携带微电子衬底和彼此间隔开的微电子衬底的第一和第二电极的支撑构件。 抛光介质位于电极和支撑构件之间，并且具有定位成接触微电子衬底的抛光表面。 第一和第二电极的至少一部分可以从抛光表面凹陷。 诸如电解液体的液体可以例如通过电极和/或抛光介质中的流动通道设置在凹部中。 可变电信号从至少一个电极通过电解质并传递到微电子衬底以从衬底去除材料。

公开(公告)号：US20060234604A1

公开(公告)日：2006-10-19

申请号：US11451723

申请日：2006-06-12

申请人： Whonchee Lee ,  Scott Meikle ,  Scott Moore ,  Trung Doan

发明人： Whonchee Lee ,  Scott Meikle ,  Scott Moore ,  Trung Doan

IPC分类号： B24B1/00

CPC分类号： C25F7/00 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  B24B37/20 ,  H01L21/32125

摘要： A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad, electrically coupling a conductive material of the microelectronic substrate to a source of electrical potential, and oxidizing at least a portion of the conductive material by passing an electrical current through the conductive material from the source of electrical potential. For example, the method can include positioning first and second electrodes apart from a face surface of the microelectronic substrate and disposing an electrolytic fluid between the face surface and the electrodes with the electrodes in fluid communication with the electrolytic fluid. The method can further include removing the portion of conductive material from the microelectronic substrate by moving at least one of the microelectronic and the polishing pad relative to the other. Accordingly, metals such as platinum can be anisotropically removed from the microelectronic substrate. The characteristics of the metal removal can be controlled by controlling the characteristics of the electrical signal applied to the microelectronic substrate, and the characteristics of a liquid disposed between the microelectronic substrate and the polishing pad.

公开(公告)号：US20050035000A1

公开(公告)日：2005-02-17

申请号：US10928022

申请日：2004-08-27

申请人： Whonchee Lee ,  Scott Meikle ,  Scott Moore

发明人： Whonchee Lee ,  Scott Meikle ,  Scott Moore

IPC分类号： B23H3/00 ,  B23H5/08 ,  B24B1/00 ,  B24B7/19 ,  H01L21/8242 ,  H01L29/00

CPC分类号： B23H5/08 ,  B24B1/002

摘要： A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal medium, which can include first and second electrodes and a polishing pad. One or more electrolytes are disposed between the electrodes and the microelectronic substrate to electrically link the electrodes to the microelectronic substrate. The electrodes are then coupled to a source of varying current that electrically removes the conductive material from the substrate. The microelectronic substrate and/or the electrodes can be moved relative to each other to position the electrodes relative to a selected portion of the microelectronic substrate, and/or to polish the microelectronic substrate. The material removal medium can remove gas formed during the process from the microelectronic substrate and/or the electrodes. The medium can also have different first and second electrical characteristics to provide different levels of electrical coupling to different regions of the microelectronic substrate.

公开(公告)号：US20070037490A1

公开(公告)日：2007-02-15

申请号：US11585740

申请日：2006-10-23

申请人： Whonchee Lee ,  Scott Moore ,  Scott Meikle

发明人： Whonchee Lee ,  Scott Moore ,  Scott Meikle

IPC分类号： B24B1/00

CPC分类号： B24B37/12 ,  B23H3/00 ,  B23H3/02 ,  B23H5/08 ,  B24B37/046 ,  B24B37/30 ,  C25F3/14 ,  C25F7/00

摘要： Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

摘要翻译： 用于从微电子衬底选择性去除导电材料的方法和装置。 根据本发明的实施例的方法包括将微电子基板定位在靠近并与电极对间隔开的位置，电极对包括第一电极和与第一电极间隔开的第二电极。 电解液可以通过第一流动通道引导到微电子衬底和电极对之间的界面区域。 可以将变化的电信号通过电极对和电解液体以从微电子衬底去除导电材料。 可以通过靠近第一流动通道和电极对的第二流动通道去除电解液体。

公开(公告)号：US20060208322A1

公开(公告)日：2006-09-21

申请号：US11413286

申请日：2006-04-28

申请人： Whonchee Lee ,  Scott Meikle ,  Guy Blalock

发明人： Whonchee Lee ,  Scott Meikle ,  Guy Blalock

IPC分类号： H01L21/20

CPC分类号： H01L21/31053 ,  H01L21/3212 ,  H01L21/32125 ,  H01L28/65 ,  H01L28/91

摘要： A microelectronic substrate and method for removing adjacent conductive and nonconductive materials from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a substrate material (such as borophosphosilicate glass) having an aperture with a conductive material (such as platinum) disposed in the aperture and a fill material (such as phosphosilicate glass) in the aperture adjacent to the conductive material. The fill material can have a hardness of about 0.04 GPa or higher, and a microelectronics structure, such as an electrode, can be disposed in the aperture, for example, after removing the fill material from the aperture. Portions of the conductive and fill material external to the aperture can be removed by chemically-mechanically polishing the fill material, recessing the fill material inwardly from the conductive material, and electrochemically-mechanically polishing the conductive material. The hard fill material can resist penetration by conductive particles, and recessing the fill material can provide for more complete removal of the conductive material external to the aperture.

摘要翻译： 一种用于从微电子衬底去除相邻的导电和非导电材料的微电子衬底和方法。 在一个实施例中，微电子衬底包括具有设置在孔中的导电材料（例如铂）的孔的衬底材料（例如硼磷硅酸盐玻璃）和邻近导电的孔中的填充材料（例如磷硅玻璃） 材料。 填充材料可以具有约0.04GPa或更高的硬度，并且例如在从孔中去除填充材料之后，诸如电极的微电子结构可以设置在孔中。 孔的外部的导电和填充材料的部分可以通过化学机械抛光填充材料，将填充材料从导电材料向内凹陷，以及电化学机械抛光导电材料来去除。 硬填充材料可以抵抗导电颗粒的渗透，并且凹陷填充材料可以提供更全面地去除孔的外部的导电材料。

公开(公告)号：US06867448B1

公开(公告)日：2005-03-15

申请号：US09653411

申请日：2000-08-31

申请人： Whonchee Lee ,  Scott Meikle

发明人： Whonchee Lee ,  Scott Meikle

IPC分类号： B23H5/08 ,  H01L21/288 ,  H01L21/321 ,  H01L21/3213 ,  H01L27/108 ,  H01L23/48

CPC分类号： B23H5/08 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32134

摘要： A method of patterning a metal surface by electro-mechanical polishing is disclosed. A metal surface is placed in fluid communication with an abrasive surface of a pad. The two surfaces are moved relative to each other, in acidic fluid which contains abrasive particles. An electrical circuit is formed between the metal surface and abrasive pad and a current is supplied to the circuit. The patterned surface then is processed into a useful feature such as a bottom electrode for a DRAM capacitor.

摘要翻译： 公开了一种通过机电抛光图案化金属表面的方法。 金属表面被放置成与垫的研磨表面流体连通。 两个表面在含有磨料颗粒的酸性流体中相对于彼此移动。 在金属表面和研磨垫之间形成电路，并向电路供给电流。 然后，图案化表面被处理成有用的特征，例如用于DRAM电容器的底部电极。

公开(公告)号：US20050020192A1

公开(公告)日：2005-01-27

申请号：US10923127

申请日：2004-08-20

申请人： Whonchee Lee ,  Scott Meikle

发明人： Whonchee Lee ,  Scott Meikle

IPC分类号： B24B37/04 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/321 ,  B24B1/00

CPC分类号： C09G1/02 ,  B24B37/044 ,  B24B37/046 ,  C09K3/1463 ,  H01L21/3212 ,  H01L21/32125

摘要： Method and apparatus for chemically, mechanically and/or electrolytically removing material from microelectronic substrates. A polishing medium for removing material can include a liquid carrier, an electrolyte disposed in the liquid carrier, and abrasives disposed in the liquid carrier, with the abrasives forming up to about 1% of the polishing liquid by weight. The polishing medium can further include a chelating agent. An electrical current can be selectively applied to the microelectronic substrate via the polishing liquid, and a downforce applied to the microelectronic substrate can be selected based on the level of current applied electrolytically to the microelectronic substrate. The microelectronic substrate can undergo an electrolytic and nonelectrolytic processing on the same polishing pad, or can be moved from one polishing pad to another while being supported by a single substrate carrier.

摘要翻译： 用于从微电子基板化学，机械和/或电解去除材料的方法和装置。 用于除去材料的抛光介质可以包括液体载体，设置在液体载体中的电解质和布置在液体载体中的研磨剂，其中研磨剂以重量计最多为抛光液的约1％。 抛光介质还可以包括螯合剂。 可以通过抛光液体将电流选择性地施加到微电子衬底，并且可以基于电解施加到微电子衬底的电流水平来选择施加到微电子衬底的下压力。 微电子衬底可以在相同的抛光垫上进行电解和非电解处理，或者可以在由单个衬底载体支撑的同时从一个抛光垫移动到另一个抛光垫。

公开(公告)号：US06605539B2

公开(公告)日：2003-08-12

申请号：US09994668

申请日：2001-11-28

申请人： Whonchee Lee ,  Scott Meikle

发明人： Whonchee Lee ,  Scott Meikle

IPC分类号： H01L2348

CPC分类号： B23H5/08 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32134

摘要： A method of patterning a metal surface by electro-mechanical polishing is described. A metal surface is placed in fluid communication with an abrasive surface of a pad. The two surfaces are moved relative to each other, in acidic fluid which contains abrasive particles. An electrical circuit is formed between the metal surface and abrasive pad and a current is supplied to the circuit. The patterned surface then is processed into a useful feature such as a bottom electrode for a DRAM capacitor.

摘要翻译： 描述了通过机电抛光图案化金属表面的方法。 金属表面被放置成与垫的研磨表面流体连通。 两个表面在含有磨料颗粒的酸性流体中相对于彼此移动。 在金属表面和研磨垫之间形成电路，并向电路供给电流。 然后，图案化表面被处理成有用的特征，例如用于DRAM电容器的底部电极。