摘要:
A non-blocking load buffer is provided for use in a high-speed microprocessor and memory system. The non-blocking load buffer interfaces a high-speed processor/cache bus, which connects a processor and a cache to the non-blocking load buffer, with a lower speed peripheral bus, which connects to peripheral devices. The non-blocking load buffer allows data to be retrieved from relatively low bandwidth peripheral devices directly from programmed I/O of the processor at the maximum rate of the peripherals so that the data may be processed and stored without unnecessarily idling the processor. I/O requests from several processors within a multiprocessor may simultaneously be buffered so that a plurality of non-blocking loads may be processed during the latency period of the device. As a result, a continuous maximum throughput from multiple I/O devices by the programmed I/O of the processor is achieved and the time required for completing tasks and processing data may be reduced. Also, a multiple priority non-blocking load buffer is provided for serving a multiprocessor running real-time processes of varying deadlines by prioritization-based scheduling of memory and peripheral accesses.
摘要:
A non-blocking load buffer is provided for use in a high-speed microprocessor and memory system. The non-blocking load buffer interfaces a high-speed processor/cache bus, which connects a processor and a cache to the non-blocking load buffer, with a lower speed peripheral bus, which connects to peripheral devices. The non-blocking load buffer allows data to be retrieved from relatively low bandwidth peripheral devices directly from programmed I/O of the processor at the maximum rate of the peripherals so that the data may be processed and stored without unnecessarily idling the processor. I/O requests from several processors within a multiprocessor may simultaneously be buffered so that a plurality of non-blocking loads may be processed during the latency period of the device. As a result, a continuous maximum throughput from multiple I/O devices by the programmed I/O of the processor is achieved and the time required for completing tasks and processing data may be reduced. Also, a multiple priority non-blocking load buffer is provided for serving a multiprocessor running real-time processes of varying deadlines by prioritization-based scheduling of memory and peripheral accesses.
摘要:
A non-blocking load buffer for use in a high-speed microprocessor and memory system. The non-blocking load buffer interfaces a high-speed processor/cache bus, which connects a processor and a cache to the non-blocking load buffer, with a lower speed peripheral bus, which connects to peripheral devices. The non-blocking load buffer allows data to be retrieved from relatively low bandwidth peripheral devices directly from programmed I/O of the processor at the maximum rate of the peripherals so that the data may be processed and stored without unnecessarily idling the processor. I/O requests from several processors within a multiprocessor may simultaneously be buffered so that a plurality of non-blocking loads may be processed during the latency period of the device. As a result, a continuous maximum throughput from multiple I/O devices by the programmed I/O of the processor is achieved and the time required for completing tasks and processing data may be reduced. Also, a multiple priority non-blocking load buffer is provided for serving a multiprocessor running real-time processes of varying deadlines by prioritization-based scheduling of memory and peripheral accesses.
摘要:
The present invention provides a means for operating the CPU in a single chip microprocessor at a multipe of the cycle speed of the memory bus. With the present invention, first and second timing signals are provided. The frequency of the second timing signal is a multiple of the frequency of the first timing signal. The second or fast timing signal is provided to the CPU and the first or slower timing signal is provided to the memory subsystem. A bus interface unit is interposed between the CPU and the memory bus. This bus interface unit receives the RDY signal (i.e. the ready signal) from the memory subsystem and modifies it before it is provided to the CPU. The "ready" signal from the memory subsystem is in an undefined state for a significant portion of each bus cycle. Since at least two CPU cycles occur during each memory access, the bus interface unit must ensure that the CPU does not misinterpret the ready signal from the memory subsystem. The bus interface unit also must modify the ADS signal (i.e. the address status signal) generated by the CPU. The ADS and RDY signals must be modified in a first way if the CPU calls for a memory cycle at the beginning of a bus cycle and in a second way if the CPU calls for a memory cycle in the middle of a CPU cycle. The use of a CPU clock speed doubler in combination with a write-back cache achieves truly synergistic increases in system speed.
摘要:
A computer system architecture implementing multiple central processing units, each including a split instruction and operand cache, and that provides for the management of multiple copies (line pairs) of a memory line through the use of a line pair state is described. Systematic management of memory lines when transferred with respect to instruction and operand data cache memories allows the integrity of the system to be maintained at all times. The split cache architecture management determines whether a memory line having a first predetermined system address is present within both the instruction and operand cache memories or will be upon move-in of a memory line. Address tag line pair state information is maintained to allow determinations of whether and where the respective memory line pair members reside. The architecture implements the management of the line pairs on each transfer of a memory line to any of the split caches of the system. A line pair is allowed to exist whenever the same memory line exists in the same relative location in each of the instruction and operand cache buffers of a single central processor. The architecture further includes a data path selector for transferring operand data to either the instruction or operand data cache buffers, or both, depending on whether the operand buffer destination is a memory line that is a member of a line pair.
摘要:
The present invention provides a means for operating the CPU in a single chip microprocessor at a multipe of the cycle speed of the memory bus. With the present invention, first and second timing signals are provided. The frequency of the second timing signal is a multiple of the frequency of the first timing signal. The second or fast timing signal is provided to the CPU and the first or slower timing signal is provided to the memory subsystem. A bus interface unit is interposed between the CPU and the memory bus. This bus interface unit receives the RDY signal (i.e. the ready signal) from the memory subsystem and modifies it before it is provided to the CPU. The "ready" signal from the memory subsystem is in an undefined state for a significant portion of each bus cycle. Since at least two CPU cycles occur during each memory access, the bus interface unit must ensure that the CPU does not misinterpret the ready signal from the memory subsystem. The bus interface unit also must modify the ADS signal (i.e. the address status signal) generated by the CPU. The ADS and RDY signals must be modified in a first way if the CPU calls for a memory cycle at the beginning of a bus cycle and in a second way if the CPU calls for a memory cycle in the middle of a CPU cycle. The use of a CPU clock speed doubler in combination with a write-back cache achieves truly synergistic increases in system speed.
摘要:
A structure comprises a first die, a second die, an interposer, a third die, and a fourth die. The first die and the second die each have a first surface and a second surface. First conductive connectors are coupled to the first surfaces of the first and second dies, and second conductive connectors are coupled to the second surfaces of the first and second dies. The interposer is over the first and second dies. A first surface of the interposer is coupled to the first conductive connectors, and a second surface of the interposer is coupled to third conductive connectors. The third and fourth dies are over the interposer and are coupled to the third conductive connectors. The first die is communicatively coupled to the second die through the interposer, and/or the third die is communicatively coupled to the fourth die through the interposer.
摘要:
A structure comprises a first die, a second die, an interposer, a third die, and a fourth die. The first die and the second die each have a first surface and a second surface. First conductive connectors are coupled to the first surfaces of the first and second dies, and second conductive connectors are coupled to the second surfaces of the first and second dies. The interposer is over the first and second dies. A first surface of the interposer is coupled to the first conductive connectors, and a second surface of the interposer is coupled to third conductive connectors. The third and fourth dies are over the interposer and are coupled to the third conductive connectors. The first die is communicatively coupled to the second die through the interposer, and/or the third die is communicatively coupled to the fourth die through the interposer.