公开(公告)号：US08331649B2

公开(公告)日：2012-12-11

申请号：US12630448

申请日：2009-12-03

申请人： Won Soo Ji ,  Wook Hee Lee ,  Ho Young Song ,  Chong Wook Cho ,  Sung Jae Kim ,  Young Su Yun ,  Hong Min Kim

发明人： Won Soo Ji ,  Wook Hee Lee ,  Ho Young Song ,  Chong Wook Cho ,  Sung Jae Kim ,  Young Su Yun ,  Hong Min Kim

IPC分类号： G06K9/00

CPC分类号： G06K9/2018 ,  G01R31/2635 ,  G01R31/2656 ,  G06T7/0004 ,  G06T2207/30148

摘要： There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit.

摘要翻译： 提供了LED测试装置。 根据本发明的一个LED测试装置可以包括：第一照明单元，其产生第一光并将第一光照射到具有包含由第一光激发的荧光材料的密封剂的LED上，以发射具有比第 第一光; 第二照明单元产生具有比第一光更长的波长的第二光，以将第二光照射到LED上; 接收从荧光材料发射的光和从LED反射的第二光的图像获取单元，以获取LED的图像; 以及LED状态确定单元，使用由图像获取单元获取的LED的图像确定LED是否可接受或有缺陷。

公开(公告)号：US08610154B2

公开(公告)日：2013-12-17

申请号：US12479436

申请日：2009-06-05

申请人： Ho Young Song ,  Sung Min Yang ,  Yong Chun Kim ,  Won Soo Ji

发明人： Ho Young Song ,  Sung Min Yang ,  Yong Chun Kim ,  Won Soo Ji

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.

摘要翻译： 一种侧视型发光器件包括封装体，引线框和发光二极管（LED）。 包装体具有设置为安装表面的第一表面，设置在与第一表面相对的一侧的第二表面和设置在第一表面和第二表面之间的侧表面。 包装体包括设置在与侧表面的发光表面相对应的侧表面上的凹部。 引线框架设置在封装主体中。 LED芯片安装在凹部的底面上。 分别朝向LED芯片突出的突出部分分别设置在与凹部的相对的内侧壁的LED芯片相邻的区域中。

公开(公告)号：US08057084B2

公开(公告)日：2011-11-15

申请号：US12397893

申请日：2009-03-04

申请人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

发明人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

IPC分类号： F21V17/00

CPC分类号： H01L33/486 ,  G02B6/0023 ,  G02B6/0046 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

摘要翻译： 侧视型发光器件包括封装体，第一引线框架和第二引线框架，发光二极管芯片，树脂覆盖部分和至少一个间隔件部分。 包装体具有设置为安装表面的第一表面，与第一表面相对的第二表面，位于第一表面和第二表面之间的侧表面，以及形成在与光对应的一个侧表面处的凹部 发射面。

公开(公告)号：US20100085772A1

公开(公告)日：2010-04-08

申请号：US12397893

申请日：2009-03-04

申请人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

发明人： Ho Young Song ,  Won Soo Ji ,  Won Ho Jung ,  Young Jin Cho ,  Hyun Kyung Kim

IPC分类号： H01L33/00 ,  F21V8/00

CPC分类号： H01L33/486 ,  G02B6/0023 ,  G02B6/0046 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface. The first and second lead frames are formed at the package body to be exposed to the bottom of the concave portion. The light emitting diode chip is mounted on the bottom of the concave portion to be electrically connected to each of the first and second lead frames. The resin covering portion is formed in the concave portion to enclose the light emitting diode chip. The spacer portion is formed at the side surface around the concave portion to maintain a constant distance from a light irradiation target without reducing the view angle of light emitted from the light emitting diode chip in the major-axis direction of the concave portion.

摘要翻译： 侧视型发光器件包括封装体，第一引线框架和第二引线框架，发光二极管芯片，树脂覆盖部分和至少一个间隔件部分。 包装体具有设置为安装表面的第一表面，与第一表面相对的第二表面，位于第一表面和第二表面之间的侧表面，以及形成在与光对应的一个侧表面处的凹部 发射面。 第一引线框架和第二引线框架形成在封装主体处以暴露于凹部的底部。 发光二极管芯片安装在凹部的底部，以电连接到第一引线框架和第二引线框架中的每一个。 树脂覆盖部分形成在凹部中以包围发光二极管芯片。 间隔部分形成在凹部周围的侧表面，以保持与光照射目标的距离恒定，而不会减小从凹部的长轴方向从发光二极管芯片发出的光的视角。

公开(公告)号：US09841161B2

公开(公告)日：2017-12-12

申请号：US14637666

申请日：2015-03-04

申请人： Won Soo Ji ,  Sung A Choi ,  Sang Woo Ha ,  Tetsuo Ariyoshi

发明人： Won Soo Ji ,  Sung A Choi ,  Sang Woo Ha ,  Tetsuo Ariyoshi

IPC分类号： F21V5/04 ,  H05B33/08 ,  H01L33/58 ,  G02B19/00 ,  F21V23/04 ,  F21V29/507 ,  F21V29/76 ,  F21V29/77 ,  F21Y105/10 ,  F21K9/23 ,  F21K9/27 ,  F21K9/60 ,  F21Y115/10 ,  F21Y113/10

CPC分类号： F21V5/04 ,  F21K9/23 ,  F21K9/27 ,  F21K9/60 ,  F21V23/0442 ,  F21V23/045 ,  F21V29/507 ,  F21V29/763 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2113/10 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0057 ,  G02B19/0071 ,  H01L33/58 ,  H05B33/0803 ,  H05B33/0872

摘要： There is provided a lens for a light emitter which includes: a bottom surface; an incident surface connected to the bottom surface at a central region of the bottom surface and disposed on or above a light source to allow light emitted from the light source to be made incident thereto and travel in an interior of the lens; and an output surface connected to the bottom surface at an edge of the bottom surface and configured to allow the light which has traveled in the interior of the lens to be emitted outwardly therefrom, wherein the central region of the bottom surface protrudes with respect to the other region of the bottom surface.

公开(公告)号：US08922643B2

公开(公告)日：2014-12-30

申请号：US13412197

申请日：2012-03-05

申请人： Won Soo Ji ,  Oh Seok Kwon ,  Choo Ho Kim

发明人： Won Soo Ji ,  Oh Seok Kwon ,  Choo Ho Kim

IPC分类号： H04N7/18 ,  G01N21/00 ,  G01N21/88 ,  G01N21/956

CPC分类号： G01N21/8806 ,  G01N21/956 ,  G01N2021/8845

摘要： A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.

摘要翻译： 发光二极管（LED）检查装置包括至少一个LED，其包括施加在发射表面上的荧光体，向LED发射可见光的第一照明单元，向LED发射紫外线（UV）光的第二照明单元， 拍摄单元，通过拍摄从LED反射的可见光来生成至少一个第一图像数据，并且通过拍摄从LED反射的UV光来生成至少一个第二图像数据;以及确定单元，用于确定外观缺陷，以及 使用所述至少一个第一图像数据和第二图像数据的LED的发射特性。

公开(公告)号：US20110128004A1

公开(公告)日：2011-06-02

申请号：US12957931

申请日：2010-12-01

申请人： Ssang Gun LIM ,  Seung Gyu Ko ,  Dae Kab Kwon ,  Ju Hun An ,  Won Soo Ji

发明人： Ssang Gun LIM ,  Seung Gyu Ko ,  Dae Kab Kwon ,  Ju Hun An ,  Won Soo Ji

IPC分类号： G01R31/00

CPC分类号： H01L21/67271 ,  G09G3/14 ,  H01L21/67259 ,  H01L21/67282 ,  H01L21/67294 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

摘要： An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.

摘要翻译： 提供了用于检查发光二极管（LED）封装的装置以检查LED以确定其是否有缺陷，并且当LED发生故障时丢弃LED。 用于检查LED封装的装置包括：检查单元，通过目视检查来检查LED，以确定LED是否有缺陷; 以及当从所述检查单元提供的LED中的所述检查单元的检查结果，当所述LED被确定为有缺陷时，丢弃所述LED的缺陷产品拒绝单元。 由于检查LED和丢弃有缺陷的LED的操作是自动化的，并且可以作为顺序处理快速处理，因此可以提高生产率。

公开(公告)号：US08890533B2

公开(公告)日：2014-11-18

申请号：US12957931

申请日：2010-12-01

申请人： Ssang Gun Lim ,  Seung Gyu Ko ,  Dae Kab Kwon ,  Ju Hun An ,  Won Soo Ji

发明人： Ssang Gun Lim ,  Seung Gyu Ko ,  Dae Kab Kwon ,  Ju Hun An ,  Won Soo Ji

IPC分类号： H01L21/00 ,  H01L21/67 ,  G09G3/14

CPC分类号： H01L21/67271 ,  G09G3/14 ,  H01L21/67259 ,  H01L21/67282 ,  H01L21/67294 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

摘要： An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.

摘要翻译： 提供了用于检查发光二极管（LED）封装的装置以检查LED以确定其是否有缺陷，并且当LED发生故障时丢弃LED。 用于检查LED封装的装置包括：检查单元，通过目视检查来检查LED，以确定LED是否有缺陷; 以及当从所述检查单元提供的LED中的所述检查单元的检查结果，当所述LED被确定为有缺陷时，丢弃所述LED的缺陷产品拒绝单元。 由于检查LED和丢弃有缺陷的LED的操作是自动化的，并且可以作为顺序处理快速处理，因此可以提高生产率。