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    Chip card and a method for producing it
    1.
    发明授权
    Chip card and a method for producing it 失效
    芯片卡及其制造方法

    公开(公告)号：US5677524A

    公开(公告)日：1997-10-14

    申请号：US548417

    申请日：1995-10-26

    申请人： Yahya Haghiri-Tehrani

    发明人： Yahya Haghiri-Tehrani

    IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G06K19/06

    CPC分类号： G06K19/07739 ,  G06K19/077 ,  G06K19/07701

    摘要： On a check card having a mini chip card disposed detachably in an adapted recess the mini chip card is fixed in position by at least one fastening element provided on the card surface. After a first punching operation in which the mini chip card is still connected with the card body by bridges the fastening element is preferably placed on the card in such a way that it bridges the areas between the mini chip card and the card body. In a second punching operation the bridges are removed, after which the mini chip card is held in its original position on the card body only by the fastening element.

    摘要翻译： 在具有可拆卸地设置在适合的凹部中的小型芯片卡的支票卡上，通过设置在卡表面上的至少一个紧固元件将迷你芯片卡固定在适当的位置。 在小型芯片卡仍然通过桥接器与卡体连接的第一冲压操作之后，紧固元件优选地以这样的方式放置在卡上，使得桥接小型芯片卡和卡体之间的区域。 在第二冲压操作中，移除桥，之后，微型芯片卡仅通过紧固元件保持在卡体上的原始位置。

    Carrier element to be incorporated into an identity card
    2.
    发明授权
    Carrier element to be incorporated into an identity card 失效
    运输单位要纳入身份证

    公开(公告)号：US5027190A

    公开(公告)日：1991-06-25

    申请号：US581394

    申请日：1990-09-12

    申请人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    发明人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/077

    CPC分类号： G06K19/07747 ,  G06K19/07745 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01004 ,  H01L2924/01079

    摘要： A carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

    摘要翻译： 描述了具有要包含在身份证或信用卡中的一个或多个IC的载体元件。 载体元件包括在其表面上具有多个接触区域的基板，该多个接触区域经由连接器路径连接到设置在基板上的IC的相应端子。 包括与导体路径的连接的IC被保护而不被固化的浇注化合物的机械应力。 为了防止浇注混合物在施加期间不受控制地流出，在施加到基材的一侧的热固性粘合剂层中设置有开口，所述开口在其应用期间阻止液体树脂并用作限制框架 。 粘合剂层中的开口至少位于要放置IC的位置。

    Carrier element for an IC module
    4.
    发明授权
    Carrier element for an IC module 失效
    IC模块的载体元件

    公开(公告)号：US4617605A

    公开(公告)日：1986-10-14

    申请号：US726818

    申请日：1985-04-24

    申请人： Werner Obrecht ,  Yahya Haghiri-Tehrani ,  Joachim Hoppe

    发明人： Werner Obrecht ,  Yahya Haghiri-Tehrani ,  Joachim Hoppe

    IPC分类号： B65D85/86 ,  B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H01L23/498 ,  H01L23/60 ,  H05K1/18

    CPC分类号： G06K19/07747 ,  G06K19/07743 ,  G06K19/07745 ,  H01L23/49855 ,  H01L23/60 ,  H01L2224/16225

    摘要： A carrier element for an IC module for incorporation into data carriers, in which the IC module is connectd with contact surfaces by means of leads, and the contact surfaces are designed for direct contacting.In order to protect the Integrated Circuit against destruction due to static charges, measures are provided to dissipate outside the circuit any portions of charge that may occur. In one embodiment, all terminals of the circuit have a low resistance connection with each other. The connection is suspended during each operational phase and is then restored. In a further embodiment, the terminals are bridged by spark gaps. This protective step is advantageous in that it is not necessary to remove and then restore the bridging.

    摘要翻译： 用于结合到数据载体中的IC模块的载体元件，其中IC模块通过引线与接触表面连接，并且接触表面被设计用于直接接触。 为了保护集成电路不受静电引起的破坏，提供措施来消除电路外部任何可能发生的电荷部分。 在一个实施例中，电路的所有端子彼此具有低电阻连接。 连接在每个操作阶段暂停，然后恢复。 在另一个实施例中，端子由火花间隙桥接。 该保护步骤的优点在于不需要去除并恢复桥接。

    IC-module identification card
    5.
    发明授权
    IC-module identification card 失效
    IC模块识别卡

    公开(公告)号：US4587413A

    公开(公告)日：1986-05-06

    申请号：US773417

    申请日：1985-09-06

    申请人： Joachim Hoppe ,  Yahya Haghiri-Tehrani

    发明人： Joachim Hoppe ,  Yahya Haghiri-Tehrani

    IPC分类号： G06K19/077 ,  H01L23/498 ,  G06K19/06

    CPC分类号： H01L23/49855 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10S283/904

    摘要： An identification card having an IC module for the processing of electrical signals. The IC module (9) and the leads (6) and contact surfaces (5, 20) necessary for the operation of the module are attached to a separate carrier (7, 17) and embedded in the identification card in such a way that the IC module is located in an area (4) of the card having the maximally permitted thickness, whereas the contact surfaces are arranged outside this area. The placement of the IC module in the elevated card area (e.g. the impressing area) allows for a thicker encapsulation of the module and correspondingly better protection against mechanical stress. On the other hand, the area of the carrier element with the contact surfaces is arranged outside the elevated area of the card, for example in the magnetic stripe area (2). As the carrier element can be designed so as to be very thin in the area of the contact surfaces, its incorporation in the area of the magnetic stripe (3) of the card presents no problems of production whatsoever. This unproblematic incorporation of the thinly designed contact surface or lead area, which is arranged on the carrier element separated from the IC module, finally allows for a very variable design of the contact surfaces, as far as their dimensions and their position on the identification card are concerned.

    摘要翻译： 具有用于处理电信号的IC模块的识别卡。 模块操作所需的IC模块（9）和引线（6）和接触表面（5,20）被附接到单独的载体（7,17）上，并以这样一种方式嵌入识别卡中 IC模块位于具有最大允许厚度的卡的区域（4）中，而接触表面布置在该区域的外部。 将IC模块放置在升高的卡区域（例如，打印区域）中允许模块更厚的封装并且相应地更好地防止机械应力。 另一方面，具有接触表面的载体元件的区域布置在卡的升高区域的外部，例如在磁条区域（2）中。 由于载体元件可以被设计为在接触表面的区域中非常薄，所以在卡片的磁条（3）的区域中的结合不会产生生产的问题。 布置在与IC模块分离的载体元件上的薄设计的接触表面或引线区域的这种无问题的结合最终允许接触表面的非常可变的设计，只要其尺寸及其在识别卡上的位置即可 关心的

    Identification card having an IC module
    6.
    发明授权
    Identification card having an IC module 失效
    具有IC模块的识别卡

    公开(公告)号：US4552383A

    公开(公告)日：1985-11-12

    申请号：US439218

    申请日：1982-11-04

    申请人： Joachim Hoppe ,  Yahya Haghiri-Tehrani

    发明人： Joachim Hoppe ,  Yahya Haghiri-Tehrani

    IPC分类号： H05K1/00 ,  B42D15/10 ,  G01N29/40 ,  G01S7/52 ,  G01S7/529 ,  G06K19/077 ,  G06Q40/00 ,  G09F1/02 ,  H05K3/00 ,  B42D15/00 ,  G06K7/06 ,  G06K19/00

    CPC分类号： G06K19/07745 ,  G01S7/529 ,  H01L24/50 ,  H01L2924/14 ,  Y10S283/904

    摘要： A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot laminating temperatures. This prevents the recess from becomming filled up with fluid card material during the hot laminating process, during which the card layers will soften and eventually become fluid. Thus, the IC module can advantageously give way within the recess when the card is bent. Further, the supporting layers have a stabilizing effect on the adjacent card layers and thereby prevent irregularities caused by incorporation of the carrier element from being passed onto the card surface. For these reasons, it is also possible to arrange the IC module or the carrier element which bears the module in the area of a magnetic stripe while preventing reading or writing processes from being disturbed by irregularities which would otherwise appear on the surface of the stripe.

    摘要翻译： 多层识别卡配有IC模块。 模块布置在位于多层卡中的凹槽中的载体元件上。 与凹陷接触的卡层承受在热层压温度范围内具有耐热性的支撑层。 这样可防止在热层压过程期间凹槽被流体卡材料充满，在此期间卡层将软化并最终变成流体。 因此，当卡弯曲时，IC模块可以有利地在凹槽内放置。 此外，支撑层对相邻的卡层具有稳定作用，从而防止由载体元件的引入引起的不规则性被传递到卡表面上。 由于这些原因，也可以将IC模块或承载模块的载体元件布置在磁条的区域中，同时防止读取或写入过程被否则将出现在条纹表面上的不规则性的干扰。

    Identification card having an IC module
    7.
    发明授权
    Identification card having an IC module 失效
    具有IC模块的识别卡

    公开(公告)号：US4550248A

    公开(公告)日：1985-10-29

    申请号：US637683

    申请日：1984-08-02

    申请人： Joachim Hoppe ,  Yahya Haghiri-Tehrani

    发明人： Joachim Hoppe ,  Yahya Haghiri-Tehrani

    IPC分类号： G06K19/077 ,  H01L23/498 ,  G06K19/06

    CPC分类号： H01L23/49855 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10S283/904

    摘要： An identification card having an IC module for the processing of electrical signals. The IC module (9) and the leads (6) and contact surfaces (5,20) necessary for the operation of the module are attached to a separate carrier (7,17) and embedded in the identification card in such a way that the IC module is located in an area (4) of the card having the maximally permitted thickness, whereas the contact surfaces are arranged outside this area. The placement of the IC module in the elevated card area (e.g. the impressing area) allows for a thicker encapsulation of the module and correspondingly better protection against mechanical stress. On the other hand, the area of the carrier element with the contact surfaces is arranged outside the elevated area of the card, for example in the magnetic stripe area (2). As the carrier element can be designed so as to be very thin in the area of the contact surfaces, its incorporation in the area of the magnetic stripe (3) of the card presents no problems of production whatsoever. This unproblematic incorporation of the thinly designed contact surface or lead area, which is arranged on the carrier element separated from the IC module, finally allows for a very variable design of the contact surfaces, as far as their dimensions and their position on the identification card are concerned.

    摘要翻译： 具有用于处理电信号的IC模块的识别卡。 模块操作所需的IC模块（9）和引线（6）和接触表面（5,20）被附接到单独的载体（7,17）上，并以这样一种方式嵌入识别卡中 IC模块位于具有最大允许厚度的卡的区域（4）中，而接触表面布置在该区域的外部。 将IC模块放置在升高的卡区域（例如，打印区域）中允许模块更厚的封装并且相应地更好地防止机械应力。 另一方面，具有接触表面的载体元件的区域布置在卡的升高区域的外部，例如在磁条区域（2）中。 由于载体元件可以被设计为在接触表面的区域中非常薄，所以在卡的磁条（3）的区域中的结合不会产生生产的问题。 布置在与IC模块分离的载体元件上的薄设计的接触表面或引线区域的这种无问题的结合最终允许接触表面的非常可变的设计，只要其尺寸及其在识别卡上的位置即可 关心的

    Method for making IC card having severable mini chip card
    9.
    发明授权
    Method for making IC card having severable mini chip card 失效
    用于制造具有可分开的迷你芯片卡的IC卡的方法

    公开(公告)号：US5531145A

    公开(公告)日：1996-07-02

    申请号：US289191

    申请日：1994-08-11

    申请人： Yahya Haghiri-Tehrani

    发明人： Yahya Haghiri-Tehrani

    IPC分类号： G06K17/00 ,  B26D7/01 ,  B32B27/00 ,  G01R31/26 ,  G06K19/077 ,  G06K21/02 ,  H01L21/66 ,  B26D5/32

    CPC分类号： G06K19/07739 ,  B26D7/01 ,  G06K19/077 ,  Y10T83/0467 ,  Y10T83/0534 ,  Y10T83/06 ,  Y10T83/536 ,  Y10T83/543

    摘要： A method for producing a mini chip card out of a standard card having an embedded semiconductor chip uses a punching die with cutting edges defining the outer contour of the mini chip card. The punching die is adjusted relative to the standard card and with respect to contact surfaces of the embedded semiconductor chip so that the edges of the punching die are at a predetermined distance from the contact surfaces. The punching of the standard card is performed in this adjusted position so that the contact surfaces are in a reference position with respect to the outer contour of the mini chip card. The punching forms the mini chip card in the correct position in the standard card. The mini chip card may initially remain connected to the standard card by thin bars between the cards.

    摘要翻译： 从具有嵌入式半导体芯片的标准卡中制造微型芯片卡的方法使用具有限定微型芯片卡的外轮廓的切削刃的冲压模具。 相对于标准卡和相对于嵌入式半导体芯片的接触表面调整冲压模，使得冲压模的边缘距接触表面预定距离。 在该调整位置执行标准卡的冲压，使得接触面相对于迷你芯片卡的外轮廓处于基准位置。 冲孔将微型芯片卡形成标准卡中的正确位置。 迷你芯片卡最初可以通过卡之间的细条保持连接到标准卡。