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公开(公告)号：US5421949A
公开(公告)日：1995-06-06
申请号：US86914
申请日：1993-07-07
CPC分类号： B42D25/318 , B26D7/1818 , B26D7/34 , B29C69/005 , B31D1/0087 , B42D25/00 , Y10T156/107 , Y10T156/1075 , Y10T156/1098 , Y10T156/1378 , Y10T156/17
摘要： The invention relates to a method and an apparatus for applying flat punched elements in the desired position to the surface of a carrier material, the elements being present in multiple copies on a sheet. The multiple copies are fed to an applying device and positioned therein. At the same time as individual elements are separated out or punched, these elements are fixed in position with respect to the carrier material.
摘要翻译： 本发明涉及一种用于将平切的元件施加到所需位置到载体材料的表面的方法和装置，所述元件以片材的多个拷贝存在。 多个副本被馈送到施加装置并定位在其中。 在单独元件分离或冲压的同时，这些元件相对于载体材料固定在适当位置。
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2.发明授权
公开(公告)号：US4792843A
公开(公告)日：1988-12-20
申请号：US106890
申请日：1987-10-13
IPC分类号： G06K19/077 , G06K19/00 , H01L23/498 , G06K19/06 , G11C11/34 , H01L23/30
CPC分类号： G06K19/07745 , H01L23/49855 , H01L2924/0002 , Y10S283/904 , Y10T428/239 , Y10T428/24868
摘要： A multilayer data carrier into which a carrier element supporting an IC module is incorporated comprises a flexible substrate on which contact surfaces are formed which are connected to the IC module via leads. The carrier element is deformed in such a way, when being incorporated into the data carrier, that the IC module, in the finished data carrier, is located in the center of the card protected by cover layers of the card and the contact surfaces are flush with the surface of the card. A method for producing the data carrier comprises laminating a substrate layer carrying an IC-module with its leads and contact pad surfaces on one surface thereof between outer protective layers and with a central core layer such that the IC-module is disposed centrally within the data carrier with the contact surfaces disposed in apertures in one of the outer protective layers flush with the surface of said one layer.
摘要翻译： 搭载有IC模块的载体元件的多层数据载体包括柔性基板，其上形成有通过引线连接到IC模块的接触表面。 载体元件以这种方式变形，当被并入数据载体中时，IC模块在成品数据载体中位于由卡的覆盖层保护的卡的中心，并且接触表面是齐平的 与卡的表面。 一种数据载体的制造方法，其特征在于，在外保护层与中心芯层之间，将其引线和接触焊盘表面承载IC模块的基板层叠在一起，使IC模块集中布置在数据中 载体，其中设置在一个外保护层中的孔中的接触表面与所述一层的表面齐平。
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公开(公告)号：US4709254A
公开(公告)日：1987-11-24
申请号：US649159
申请日：1984-09-10
IPC分类号： H01L21/56 , B42D15/02 , B42D15/10 , B44F1/12 , G06K19/077 , H01L21/60 , H01L23/28 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/538 , H01L21/283 , H01L23/08 , H01L23/12
CPC分类号： H01L23/28 , G06K19/07745 , H01L23/3107 , H01L23/3121 , H01L23/48 , H01L23/49855 , H01L23/5388 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要： A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.
摘要翻译： 用于集成到识别卡中的IC模块的载体元件。 该元件包括支撑导电引线和接触垫的柔性载体膜。 半导体芯片电连接到引线和焊盘。 浇铸树脂包围芯片和载体膜，包括载体垫，以形成能够抵抗机械应力的固体载体元件。
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公开(公告)号：US4457798A
公开(公告)日：1984-07-03
申请号：US379955
申请日：1982-05-19
CPC分类号： B42D25/22 , B42D25/40 , B42D25/45 , B42D25/46 , B42D25/465 , G06K19/07745 , H01L24/26 , H01L24/83 , B42D2033/30 , B42D2033/46 , B42D25/47 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/07802 , H01L2924/14 , H01L2924/3511 , Y10S283/904 , Y10T156/1082 , Y10T156/1961
摘要： A method of producing an identification card having an IC module arranged on a carrier element.The carrier element is inserted into a recess in the card. The card has a multilayer construction and bears a separation layer between at least two card layers in the area intended to take up the carrier element. The card is produced by the usual reliable methods. The recess for the carrier element in the form of a punched or blind hole is created by punching through the edge of the portion of the card to be removed up to the separation layer, and removing the severed plug-like element along with the separation layer from the recess. The carrier element is finally stuck into the recess. The production of the recess in the finished card by means of a punching or cutting device can be carried out completely free of dust and chips.The production of the identification card and the embedding of the IC module or carrier element are carried out independently of one another, so that the sensitive IC module is not subjected to the operational sequences of the production of the card.
摘要翻译： 一种制造具有布置在载体元件上的IC模块的识别卡的方法。 载体元件插入卡中的凹槽中。 卡具有多层结构，并且在用于吸收载体元件的区域中的至少两个卡层之间承载分离层。 该卡是通过可靠的方法生产的。 穿孔或盲孔形式的载体元件的凹槽是通过穿过待除去的卡的部分的边缘穿过分离层产生的，并且与分离层一起去除切断的塞状元件 从休息。 载体元件最后卡在凹槽中。 通过冲孔或切割装置在成品卡中制造凹槽可以完全没有灰尘和碎屑。 识别卡的生成和IC模块或载体元件的嵌入彼此独立地进行，使得敏感IC模块不受制造卡的操作顺序的影响。
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5.发明授权
公开(公告)号：US4417413A
公开(公告)日：1983-11-29
申请号：US444964
申请日：1982-11-29
CPC分类号： G06K19/07745 , H01L2924/0002 , Y10S283/904 , Y10T29/4913 , Y10T29/49144
摘要： An identification card incorporating an integrated circuit (IC) chip for processing electric signals incorporates a separate supporting element for the IC chip. The supporting element is mounted in a window of one corner of the identification card to avoid the principal axis of stress. The chip supporting element and the window are of the same general shape. However, the window is larger than the supporting element to provide a clearance area surrounding the supporting element. Resilient cover sheets are adhesively mounted to the identification card to fix the position of the supporting element within the window and maintain the clearance area surrounding the supporting element. The top cover sheet has a recess which is aligned with a portion of the supporting element to allow access to contacts mounted on that portion of the supporting element to provide electrical connections with the IC chip.
摘要翻译： 包含用于处理电信号的集成电路（IC）芯片的识别卡包括用于IC芯片的单独的支撑元件。 支撑元件安装在识别卡的一个角的窗口中，以避免主轴的应力。 芯片支撑元件和窗口具有相同的一般形状。 然而，窗口比支撑元件大，以提供围绕支撑元件的间隙区域。 弹性盖板被粘合地安装到识别卡上，以将支撑元件的位置固定在窗口内并保持支撑元件周围的间隙区域。 顶盖片具有与支撑元件的一部分对准的凹部，以允许接触安装在支撑元件的该部分上的触点，以提供与IC芯片的电连接。
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公开(公告)号：US4325196A
公开(公告)日：1982-04-20
申请号：US121886
申请日：1980-02-15
CPC分类号： B42D25/318 , B42D25/00 , B42D25/46 , B42D2033/28 , B42D2033/30 , B42D2035/02 , B42D2035/26 , B42D25/324 , B42D25/455 , Y10S283/904 , Y10S428/915 , Y10S428/916 , Y10T156/1023 , Y10T428/24479 , Y10T428/24736 , Y10T428/24934 , Y10T428/31 , Y10T428/31902
摘要： A laminated multi-layer identification card comprising a plurality of individual layers connected to one another and having at least one outer surface which is directly contactable. At least one additional outer layer is laminated to the outer surface and covers a portion of the outer surface. The outer layer has a surface relief pattern in the form of intaglio printing which is directly accessible. The outer laminated layer may be made of paper and the remaining exposed outer surface not covered by the outer layer may be given a texture similar to that of paper so that the entire surface of the card feels like a paper-rough surface.
摘要翻译： 一种层叠多层识别卡，包括彼此连接并具有至少一个可直接接触的外表面的多个单独的层。 至少一个额外的外层层压到外表面并覆盖外表面的一部分。 外层具有可以直接接近的凹版印刷形式的表面浮雕图案。 外层叠层可以由纸制成，而不被外层覆盖的剩余的外露表面可以具有类似于纸的外观，使得卡的整个表面感觉像纸粗糙的表面。
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公开(公告)号：US4803542A
公开(公告)日：1989-02-07
申请号：US51850
申请日：1987-05-18
IPC分类号： H01L21/56 , B42D15/02 , B42D15/10 , B44F1/12 , G06K19/077 , H01L21/60 , H01L23/28 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/538 , H01L23/30 , H01L23/14
CPC分类号： H01L23/28 , G06K19/07745 , H01L23/3107 , H01L23/3121 , H01L23/48 , H01L23/49855 , H01L23/5388 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/14
摘要： A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.
摘要翻译： 用于集成到识别卡中的IC模块的载体元件。 该元件包括支撑导电引线和接触垫的柔性载体膜。 半导体芯片电连接到引线和焊盘。 浇铸树脂包围芯片和载体膜，包括载体垫，以形成能够抵抗机械应力的固体载体元件。
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公开(公告)号：US4617605A
公开(公告)日：1986-10-14
申请号：US726818
申请日：1985-04-24
IPC分类号： B65D85/86 , B42D15/10 , G06K19/07 , G06K19/077 , H01L23/498 , H01L23/60 , H05K1/18
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07745 , H01L23/49855 , H01L23/60 , H01L2224/16225
摘要： A carrier element for an IC module for incorporation into data carriers, in which the IC module is connectd with contact surfaces by means of leads, and the contact surfaces are designed for direct contacting.In order to protect the Integrated Circuit against destruction due to static charges, measures are provided to dissipate outside the circuit any portions of charge that may occur. In one embodiment, all terminals of the circuit have a low resistance connection with each other. The connection is suspended during each operational phase and is then restored. In a further embodiment, the terminals are bridged by spark gaps. This protective step is advantageous in that it is not necessary to remove and then restore the bridging.
摘要翻译： 用于结合到数据载体中的IC模块的载体元件，其中IC模块通过引线与接触表面连接，并且接触表面被设计用于直接接触。 为了保护集成电路不受静电引起的破坏，提供措施来消除电路外部任何可能发生的电荷部分。 在一个实施例中，电路的所有端子彼此具有低电阻连接。 连接在每个操作阶段暂停，然后恢复。 在另一个实施例中，端子由火花间隙桥接。 该保护步骤的优点在于不需要去除并恢复桥接。
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公开(公告)号：US4587413A
公开(公告)日：1986-05-06
申请号：US773417
申请日：1985-09-06
IPC分类号： G06K19/077 , H01L23/498 , G06K19/06
CPC分类号： H01L23/49855 , G06K19/07743 , G06K19/07745 , H01L2924/0002 , Y10S283/904
摘要： An identification card having an IC module for the processing of electrical signals. The IC module (9) and the leads (6) and contact surfaces (5, 20) necessary for the operation of the module are attached to a separate carrier (7, 17) and embedded in the identification card in such a way that the IC module is located in an area (4) of the card having the maximally permitted thickness, whereas the contact surfaces are arranged outside this area. The placement of the IC module in the elevated card area (e.g. the impressing area) allows for a thicker encapsulation of the module and correspondingly better protection against mechanical stress. On the other hand, the area of the carrier element with the contact surfaces is arranged outside the elevated area of the card, for example in the magnetic stripe area (2). As the carrier element can be designed so as to be very thin in the area of the contact surfaces, its incorporation in the area of the magnetic stripe (3) of the card presents no problems of production whatsoever. This unproblematic incorporation of the thinly designed contact surface or lead area, which is arranged on the carrier element separated from the IC module, finally allows for a very variable design of the contact surfaces, as far as their dimensions and their position on the identification card are concerned.
摘要翻译： 具有用于处理电信号的IC模块的识别卡。 模块操作所需的IC模块（9）和引线（6）和接触表面（5,20）被附接到单独的载体（7,17）上，并以这样一种方式嵌入识别卡中 IC模块位于具有最大允许厚度的卡的区域（4）中，而接触表面布置在该区域的外部。 将IC模块放置在升高的卡区域（例如，打印区域）中允许模块更厚的封装并且相应地更好地防止机械应力。 另一方面，具有接触表面的载体元件的区域布置在卡的升高区域的外部，例如在磁条区域（2）中。 由于载体元件可以被设计为在接触表面的区域中非常薄，所以在卡片的磁条（3）的区域中的结合不会产生生产的问题。 布置在与IC模块分离的载体元件上的薄设计的接触表面或引线区域的这种无问题的结合最终允许接触表面的非常可变的设计，只要其尺寸及其在识别卡上的位置即可 关心的
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公开(公告)号：US4552383A
公开(公告)日：1985-11-12
申请号：US439218
申请日：1982-11-04
IPC分类号： H05K1/00 , B42D15/10 , G01N29/40 , G01S7/52 , G01S7/529 , G06K19/077 , G06Q40/00 , G09F1/02 , H05K3/00 , B42D15/00 , G06K7/06 , G06K19/00
CPC分类号： G06K19/07745 , G01S7/529 , H01L24/50 , H01L2924/14 , Y10S283/904
摘要： A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot laminating temperatures. This prevents the recess from becomming filled up with fluid card material during the hot laminating process, during which the card layers will soften and eventually become fluid. Thus, the IC module can advantageously give way within the recess when the card is bent. Further, the supporting layers have a stabilizing effect on the adjacent card layers and thereby prevent irregularities caused by incorporation of the carrier element from being passed onto the card surface. For these reasons, it is also possible to arrange the IC module or the carrier element which bears the module in the area of a magnetic stripe while preventing reading or writing processes from being disturbed by irregularities which would otherwise appear on the surface of the stripe.
摘要翻译： 多层识别卡配有IC模块。 模块布置在位于多层卡中的凹槽中的载体元件上。 与凹陷接触的卡层承受在热层压温度范围内具有耐热性的支撑层。 这样可防止在热层压过程期间凹槽被流体卡材料充满，在此期间卡层将软化并最终变成流体。 因此，当卡弯曲时，IC模块可以有利地在凹槽内放置。 此外，支撑层对相邻的卡层具有稳定作用，从而防止由载体元件的引入引起的不规则性被传递到卡表面上。 由于这些原因，也可以将IC模块或承载模块的载体元件布置在磁条的区域中，同时防止读取或写入过程被否则将出现在条纹表面上的不规则性的干扰。
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