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公开(公告)号：US20090212399A1
公开(公告)日：2009-08-27
申请号：US12388215
申请日：2009-02-18
申请人： Yasufumi Kaneda , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
发明人： Yasufumi Kaneda , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
IPC分类号： H01L23/538 , H01L21/70
CPC分类号： H03H9/059 , H01L2924/0002 , H03H3/08 , H03H9/1092 , H01L2924/00
摘要： An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.
摘要翻译： 电子部件包括基板，形成在基板上的功能元件，多个端子，包括连接到功能元件的第一端子电极和层叠在第一端子电极上的第二端子电极，以及馈电线路，其一端 电连接到第一端子电极并且其另一端到达基板的边缘，其中馈电线包括直接到达边缘的第一部分和从第一部分分支然后到达边缘的第二部分。
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公开(公告)号：US20110156265A1
公开(公告)日：2011-06-30
申请号：US13040793
申请日：2011-03-04
申请人： Yasufumi KANEDA , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
发明人： Yasufumi KANEDA , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
IPC分类号： H01L23/48
CPC分类号： H03H9/059 , H01L2924/0002 , H03H3/08 , H03H9/1092 , H01L2924/00
摘要： An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.
摘要翻译： 电子部件包括基板，形成在基板上的功能元件，多个端子，包括连接到功能元件的第一端子电极和层叠在第一端子电极上的第二端子电极，以及馈电线路，其一端 电连接到第一端子电极并且其另一端到达基板的边缘，其中馈电线包括直接到达边缘的第一部分和从第一部分分支然后到达边缘的第二部分。
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公开(公告)号：US08153476B2
公开(公告)日：2012-04-10
申请号：US13040793
申请日：2011-03-04
申请人： Yasufumi Kaneda , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
发明人： Yasufumi Kaneda , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
CPC分类号： H03H9/059 , H01L2924/0002 , H03H3/08 , H03H9/1092 , H01L2924/00
摘要： An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.
摘要翻译： 电子部件包括基板，形成在基板上的功能元件，多个端子，包括连接到功能元件的第一端子电极和层叠在第一端子电极上的第二端子电极，以及馈电线路，其一端 电连接到第一端子电极并且其另一端到达衬底的边缘，其中馈电线包括直接到达边缘的第一部分和从第一部分分支然后到达边缘的第二部分。
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公开(公告)号：US20080111247A1
公开(公告)日：2008-05-15
申请号：US11598816
申请日：2006-11-14
IPC分类号： H01L23/488 , B23K31/02 , H01L21/60
CPC分类号： B23K1/0016 , H01L23/10 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01079 , H03H9/059 , H03H9/1078 , H03H9/1085 , H01L2224/81 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要翻译： 提供了一种制造电子器件的方法，该电子器件包括将器件芯片安装在衬底上的倒装芯片，以及通过在器件芯片上提供焊料并在焊料上施加热和压力来在相邻器件芯片之间提供焊料，以及接触角 的焊料熔化时，器件芯片和焊料大于90°。
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公开(公告)号：US08093101B2
公开(公告)日：2012-01-10
申请号：US11598816
申请日：2006-11-14
IPC分类号： H01L21/00
CPC分类号： B23K1/0016 , H01L23/10 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01079 , H03H9/059 , H03H9/1078 , H03H9/1085 , H01L2224/81 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要翻译： 提供了一种制造电子器件的方法，该电子器件包括将器件芯片安装在衬底上的倒装芯片，以及通过在器件芯片上提供焊料并在焊料上施加热和压力来在相邻器件芯片之间提供焊料，以及接触角 的焊料熔化时，器件芯片和焊料大于90°。
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公开(公告)号：US07816794B2
公开(公告)日：2010-10-19
申请号：US11314007
申请日：2005-12-22
IPC分类号： H01L23/29
CPC分类号： H03H9/1085 , H01L2224/97 , H03H9/1078 , H01L2224/81
摘要： An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.
摘要翻译： 电子装置包括由绝缘体制成的封装基板，在封装基板上安装倒装芯片的器件芯片和密封器件芯片的密封部分。 密封部分包括由焊料制成的侧壁。 包括侧壁的整个密封部分可以由焊料制成。 电子设备可以包括设置在密封部分上的金属层。
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公开(公告)号：US20060138672A1
公开(公告)日：2006-06-29
申请号：US11314007
申请日：2005-12-22
CPC分类号： H03H9/1085 , H01L2224/97 , H03H9/1078 , H01L2224/81
摘要： An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.
摘要翻译： 电子装置包括由绝缘体制成的封装基板，在封装基板上安装倒装芯片的器件芯片和密封器件芯片的密封部分。 密封部分包括由焊料制成的侧壁。 包括侧壁的整个密封部分可以由焊料制成。 电子设备可以包括设置在密封部分上的金属层。
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公开(公告)号：US20080122314A1
公开(公告)日：2008-05-29
申请号：US11987268
申请日：2007-11-28
IPC分类号： H01L41/08
CPC分类号： H03H9/1092 , H01L2224/11 , H01L2924/16235 , H03H9/059
摘要： An acoustic wave device includes an acoustic wave element provided on a substrate, a wiring that is provided on the substrate and is electrically connected to the acoustic wave element, a sealing portion that is provided on the substrate so as to cover the acoustic wave element and the wiring, and an insulating layer that is provided on a whole area between the substrate and the sealing portion and between the wiring and the sealing portion.
摘要翻译： 声波装置包括：设置在基板上的声波元件，设置在基板上并与声波元件电连接的布线;密封部，其设置在基板上以覆盖声波元件;以及 布线和设置在基板和密封部分之间以及布线和密封部分之间的整个区域上的绝缘层。
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公开(公告)号：US07586240B2
公开(公告)日：2009-09-08
申请号：US12018460
申请日：2008-01-23
申请人： Keiji Tsuda , Jyouji Kimura , Shunichi Aikawa , Kazunori Inoue , Takashi Matsuda
发明人： Keiji Tsuda , Jyouji Kimura , Shunichi Aikawa , Kazunori Inoue , Takashi Matsuda
IPC分类号： H01L41/08
CPC分类号： H03H3/08 , H01L2224/11
摘要： An acoustic wave device includes an acoustic wave element formed on a substrate, a first seal portion provided on the substrate so as to form a cavity above the acoustic wave element, and a second seal portion provided on the first seal portion, the first seal portion having a step so that the first seal portion has a width on a first side and another width on a second side arranged so that the first side is closer than the second side to the substrate, and the width on the first side is greater than the another width on the second side.
摘要翻译： 声波装置包括形成在基板上的声波元件，设置在基板上以在声波元件上方形成空腔的第一密封部分和设置在第一密封部分上的第二密封部分，第一密封部分 具有使所述第一密封部在第一侧具有宽度，在所述第二侧具有第二侧的另一宽度，使得所述第一侧比所述基板的所述第二侧更靠近，所述第一侧的宽度大于所述第一侧的宽度 第二侧的另一个宽度。
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公开(公告)号：US20080125662A1
公开(公告)日：2008-05-29
申请号：US11987173
申请日：2007-11-28
申请人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
发明人： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
CPC分类号： H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
摘要翻译： 一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分， 用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分 密封部分，使得第二未覆盖部分被分割。
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