公开(公告)号：US5390132A

公开(公告)日：1995-02-14

申请号：US981378

申请日：1992-11-25

申请人： Yasuhiko Shioe ,  Chuji Akiyama ,  Toshiaki Shirai ,  Hideyuki Sakamoto ,  Hitoshi Yasui ,  Makio Ishikawa ,  Hideo Matsukawa

发明人： Yasuhiko Shioe ,  Chuji Akiyama ,  Toshiaki Shirai ,  Hideyuki Sakamoto ,  Hitoshi Yasui ,  Makio Ishikawa ,  Hideo Matsukawa

IPC分类号： G05B19/042 ,  G06F11/00 ,  G06F11/14 ,  G06K15/00

CPC分类号： G06F11/0757 ,  G05B19/0428 ,  G06F11/1417

摘要： A distributed control system comprising a control station and a remote input/output device interconnected by a bus, wherein the system is provided with a continuation transmission service which first transmits an urgent output only and then performs cyclic scan transmission; an initialization start transmission service which first performs cyclic scan transmission for input only; an interruption duration measuring feature which measures the period of transmission interruption; and a control feature which activates the continuation transmission service when the result of the measurement is shorter than a predetermined period of time, and which activates the initialization start transmission service when the result of the measurement is longer than the predetermined period of time. Thus, for example, after a power supply failure, the system can rapidly recover and shift to normal process controlling operation without the delays normally experienced by prior control systems.

摘要翻译： 一种分布式控制系统，包括控制站和通过总线互连的远程输入/输出设备，其中系统设置有继续传输服务，其首先发送紧急输出，然后执行循环扫描传输; 初始化开始传输服务，其首先执行用于输入的循环扫描传输; 测量传输中断周期的中断持续时间测量特征; 以及当测量结果短于预定时间段时激活连续传输服务的控制特征，并且当测量结果长于预定时间段时激活初始化开始传输服务。 因此，例如，在电源故障之后，系统可以快速恢复并转移到正常的过程控制操作，而不会由现有控制系统通常遇到的延迟。

公开(公告)号：US08107255B2

公开(公告)日：2012-01-31

申请号：US12239256

申请日：2008-09-26

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.

摘要翻译： 本发明提供一种电路装置及其制造方法，其特征在于，能够使由树脂构成的多个电路基板与树脂密封而形成。 在混合集成电路装置中，第一电路板与第二电路板重叠，并且两个板都装配到壳体中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体构件的侧壁部设置有开口，壳体的内部空间通过该开口与外部连通。 因此，在树脂密封工序中，能够通过该开口从外部将密封树脂注入到壳体的内部空间。

公开(公告)号：US08102655B2

公开(公告)日：2012-01-24

申请号：US12837078

申请日：2010-07-15

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/20

CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

摘要翻译： 提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体内设置有未填充有密封树脂的中空部。 这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。

公开(公告)号：US07782628B2

公开(公告)日：2010-08-24

申请号：US12239250

申请日：2008-09-26

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/20

CPC分类号： H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K5/065 ,  H05K2201/042 ,  H05K2201/10318 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

摘要翻译： 提供了能够增加封装密度并防止引入电路元件之间的热干扰的电路装置。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式装配到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 此外，在壳体内设置有未填充有密封树脂的中空部。 这样的结构防止作为微型计算机的第二电路元件例如由于在作为功率晶体管的第一电路元件中产生的热而不稳定地运行。

公开(公告)号：US07152316B2

公开(公告)日：2006-12-26

申请号：US10905259

申请日：2004-12-22

申请人： Haruhiko Mori ,  Masaru Kanakubo ,  Hideyuki Sakamoto

发明人： Haruhiko Mori ,  Masaru Kanakubo ,  Hideyuki Sakamoto

IPC分类号： H05K3/30

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/13 ,  H01L23/4334 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/056 ,  H05K3/284 ,  H05K3/386 ,  H05K3/4092 ,  H05K2201/1034 ,  H05K2201/10924 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a hybrid integrated circuit device includes the steps of forming an electric circuit which includes a conductive pattern formed on a surface of a circuit board and a circuit element electrically connected to the conductive pattern, fixing a lead to a pad formed of the conductive pattern, housing the circuit board in a cavity of molds, and fixedly supporting the lead by clamping the lead between the molds, and performing sealing by filling inside of the cavity with sealing resin with the rear surface of the circuit board made in contact with an inside bottom surface of the molds.

摘要翻译： 为了提供将电路板的后表面暴露于外部的混合集成电路装置及其制造方法。 这里，引线沿其一侧固定到电路板的表面。 一种制造混合集成电路器件的方法包括以下步骤：形成电路，该电路包括形成在电路板的表面上的导电图案和与导电图案电连接的电路元件，将引线固定到由 导电图案，将电路板容纳在模具的空腔中，并且通过将引线夹在模具之间来固定地支撑引线，并且通过用与树脂接触的电路板的后表面的密封树脂填充空腔来进行密封 模具的内底表面。

公开(公告)号：US09777667B2

公开(公告)日：2017-10-03

申请号：US13700009

申请日：2011-05-26

申请人： Takao Fukuda ,  Hideyuki Sakamoto

发明人： Takao Fukuda ,  Hideyuki Sakamoto

IPC分类号： F02D41/32 ,  F02D41/20 ,  F02D41/38

CPC分类号： F02D41/32 ,  F02D41/20 ,  F02D41/38 ,  F02D2041/2006 ,  F02D2041/201

摘要： A fuel injection control system for an internal combustion engine includes a plurality of first energy storage elements each for supplying a high voltage to a fuel injection solenoid valve, boosting circuits each for boosting a battery voltage and electrically charging one of the first energy storage elements, a second energy storage element for accumulating electrical energy of the battery voltage, and a switching circuit for transferring the electrical energy between the plurality of first energy storage elements via the second energy storage element. This configuration enables the fuel injection control system for an internal combustion engine to implement stabilized supply of a fuel by obtaining within a short time the high voltage needed to operate the fuel injector both accurately and reliably, and to contribute to cost reduction by, for example, alleviating capability requirements and part performance requirements of the individual boosting circuits.

公开(公告)号：US20130052440A1

公开(公告)日：2013-02-28

申请号：US13579671

申请日：2011-02-17

申请人： Hideyuki Sakamoto ,  Keisuke Hatano ,  Kouji Morita ,  Yukihiro Shimamoto

发明人： Hideyuki Sakamoto ,  Keisuke Hatano ,  Kouji Morita ,  Yukihiro Shimamoto

IPC分类号： B32B27/08 ,  C08F220/22 ,  B32B27/30

CPC分类号： B32B27/28 ,  B32B27/08 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/365 ,  B32B2250/24 ,  B32B2270/00 ,  C08F220/22 ,  C08F220/24 ,  Y10T428/24967 ,  Y10T428/3154 ,  C08F2220/1808

摘要： Provided are a fluorine-containing (meth)acrylic (co)polymer that scarcely generates gas when subjected to molding process, and is capable of supplying a molded body excellent in external appearance and transparency; a fluorine-containing (meth)acrylic resin film thereof; and a fluororesin laminated resin film having the same properties. The (co)polymer is a fluorine-containing (meth)acrylic (co)polymer obtained by polymerizing a monomer component including 100 to 70% by weight of a fluoroalkyl(meth)acrylate monomer, and 0 to 30% by weight of a different monomer copolymerizable therewith by effect of a radical polymerization initiator having a solubility in water of 0.1% or less by weight at 25 C, and having 8 to 14 carbon atoms.

摘要翻译： 提供在进行成型时几乎不产生气体的含氟（甲基）丙烯酸（共）聚合物，能够提供外观和透明性优异的成型体; 含氟（甲基）丙烯酸树脂膜; 和具有相同特性的氟树脂层压树脂膜。 （共）聚合物是通过聚合包含100至70重量％的（甲基）丙烯酸氟烷基酯单体和0至30重量％的不同的（甲基）丙烯酸酯单体的单体组分而获得的含氟（甲基）丙烯酸（共）聚合物 通过自由基聚合引发剂在25℃下在水中的溶解度为0.1重量％以下且具有8〜14个碳原子的单体可共聚合的单体。

公开(公告)号：US08102670B2

公开(公告)日：2012-01-24

申请号：US12239407

申请日：2008-09-26

申请人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

发明人： Hideyuki Sakamoto ,  Hidefumi Saito ,  Yasuhiro Koike ,  Masao Tsukizawa

IPC分类号： H05K7/14 ,  H05K7/18

CPC分类号： H05K1/144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3447 ,  H05K7/1432 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10689 ,  H05K2201/2018 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.

摘要翻译： 提供了一种电路装置，其中并入的电路元件经由引线彼此电连接，以便实现增强的功能和小型化两者。 在混合集成电路装置中，第一电路板和第二电路板以第一电路板与第二电路板重叠的方式结合到壳体构件中。 第一电路元件布置在第一电路板的上表面上，第二电路元件布置在第二电路板的上表面上。 在混合集成电路装置中提供的引线包括仅连接到安装在第一电路板上的第一电路元件的引线，仅连接到安装在第二电路板上的第二电路元件的引线，以及连接到第一 电路元件和第二电路元件。

公开(公告)号：US07746214B2

公开(公告)日：2010-06-29

申请号：US11328452

申请日：2006-01-10

申请人： Hideyuki Sakamoto ,  Mitsuyoshi Kanai

发明人： Hideyuki Sakamoto ,  Mitsuyoshi Kanai

IPC分类号： H01C10/32

CPC分类号： G05G1/08 ,  A61B5/0006 ,  A61B5/0008 ,  A61B5/02405 ,  A61B5/04087 ,  A61B5/08 ,  A61B5/7232 ,  A61B2560/0412 ,  G05G5/04 ,  H01C10/32

摘要： A rotary variable resistor includes a variable resistor body mounted to a console panel, a rotor shaft protruding outward from the variable resistor body, and a control knob coupled to an outer end of the rotor shaft. A single plate-shaped stopper is projectingly provided, along a rotational direction of the rotor shaft, on a front face of the variable resistor body from which the rotor shaft protrudes. First and second restricting portions are provided on the control knob side-by-side along the rotational direction of the rotor shaft to alternately abut against the stopper in defining an actual rotational angle of the rotor shaft.

摘要翻译： 旋转可变电阻器包括安装到控制面板的可变电阻器主体，从可变电阻器主体向外突出的转子轴和连接到转子轴的外端的控制旋钮。 沿着转子轴的旋转方向突出地设置有单个板状止动件，该转子轴在转子轴突出的可变电阻体的前表面上突出设置。 第一和第二限制部分沿着转子轴的旋转方向并排地设置在控制旋钮上，以在确定转子轴的实际旋转角度时交替地抵靠止动件。

公开(公告)号：US20060116496A1

公开(公告)日：2006-06-01

申请号：US10530358

申请日：2003-10-28

申请人： Takenobu Sunagawa ,  Hiroshi Tone ,  Hideyuki Sakamoto ,  Yasushi Nakanishi ,  Mamoru Kadokura

发明人： Takenobu Sunagawa ,  Hiroshi Tone ,  Hideyuki Sakamoto ,  Yasushi Nakanishi ,  Mamoru Kadokura

IPC分类号： C08F118/02

CPC分类号： C08F220/18 ,  C08F220/32 ,  C08L33/14 ,  C08L67/02 ,  C08L2666/04

摘要： 0.1 to 50 parts of a viscosity modifier for thermoplastic polyester resin comprising (a) 15 to 95% by weight alkyl (meth)acrylate containing an epoxy group, (b) 5 to 85% by weight of another alkyl (meth)acrylate and (c) 0 to 80% by weight of another vinyl monomer copolymerizable therewith and having weight average molecular weight of 1,000 to 400,000 is compounded, based on 100 parts by weight of a thermoplastic polyester resin. As a result, melt viscosity of thermoplastic polyester resin can be efficiently improved, stable processability is exhibited in extrusion molding, blow molding and calender molding, particularly profile extrusion and extrusion molding of boards and pipes which are extremely difficult, and a molded article having favorable surface properties is obtained.

摘要翻译： 0.1〜50份热塑性聚酯树脂用粘度调节剂，其含有（a）15〜95重量％的含有环氧基的（甲基）丙烯酸烷基酯，（b）5〜85重量％的其它（甲基）丙烯酸烷基酯和（甲基） c）基于100重量份的热塑性聚酯树脂，混合0-80重量％的可与其共聚并且重均分子量为1,000至400,000的其它乙烯基单体。 结果，可以有效地提高热塑性聚酯树脂的熔融粘度，在挤出成型，吹塑成型和压延成型，特别是非常困难的板和管的型材挤出和挤出成型中表现出稳定的加工性， 获得表面性质。