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42 条记录 (耗时 0.026 秒)

    Printed circuit board
    1.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US07551452B2

    公开(公告)日：2009-06-23

    申请号：US11427448

    申请日：2006-06-29

    申请人： Yasuto Ishimaru ,  Kei Nakamura

    发明人： Yasuto Ishimaru ,  Kei Nakamura

    IPC分类号： H05K7/00

    CPC分类号： H05K1/0271 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/118 ,  H05K3/0061 ,  H05K2201/09663 ,  H05K2201/2009 ,  H01L2924/00

    摘要： In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings are not provided on the areas on the surface opposite to the areas on the other surface of the base insulating layer on which the slits are provided between the metal substrates. Metals such as stainless steel, copper or copper alloy can be used for the metal substrates. Coefficient of linear expansion of each metal substrate is preferably equal to that of the base insulating layer.

    摘要翻译： 在外部引线部分中，外部引线布线设置在基底绝缘层的一个表面上，并且在其相对表面上设置多个金属基板。 多个金属基板之间具有预定间隔。 外引线配线不设置在与在金属基板之间设置狭缝的基极绝缘层的另一面的区域相对的面上的区域。 金属如不锈钢，铜或铜合金可用于金属基板。 每个金属基底的线性膨胀系数优选等于基底绝缘层的线膨胀系数。

    Tab tape carrier
    2.
    发明申请
    Tab tape carrier 审中-公开
    标签带载体

    公开(公告)号：US20070023876A1

    公开(公告)日：2007-02-01

    申请号：US11492036

    申请日：2006-07-25

    申请人： Kei Nakamura ,  Yasuto Ishimaru

    发明人： Kei Nakamura ,  Yasuto Ishimaru

    IPC分类号： H01L23/495

    CPC分类号： H01L23/4985 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/73204

    摘要： To provide a TAB tape carrier that can provide improved adhesion of a conductive pattern to an insulating base layer, while strengthening a connection between gold terminals of a semiconductor device and connection terminals covered with a tin plating layer, and can prevent the conductive pattern from sinking into the insulating base layer. In the TAB tape carrier, an insulating base layer is formed by laminating a thermoplastic polyimide resin layer of 4 μm thick or less on a thermosetting polyimide resin layer, and a conductive pattern having inner leads covered with a tin plating layer is formed on a surface of the thermoplastic polyimide resin layer. In this TAB tape carrier, even when the gold terminals of the semiconductor device are press-bonded to the inner leads covered with the tin plating layer at high temperatures and pressures, the conductive pattern can be prevented from sinking into the insulating base layer.

    摘要翻译： 为了提供一种TAB带载体，其能够提供导电图案与绝缘基底层的改善的粘附性，同时加强半导体器件的金端子和覆盖有镀锡层的连接端子之间的连接，并且可以防止导电图案下沉 进入绝缘基层。 在TAB带载体中，通过在热固性聚酰亚胺树脂层上层叠4μm以下的热塑性聚酰亚胺树脂层，形成绝缘基层，在表面形成具有被锡镀层覆盖的内部引线的导体图案 的热塑性聚酰亚胺树脂层。 在这种TAB带载体中，即使在高温高压下将半导体器件的金端子压接在被镀锡层覆盖的内部引线上的情况下，也可以防止导体图案沉入绝缘基底层。

    Optical sensor module
    3.
    发明授权
    Optical sensor module 失效
    光学传感器模块

    公开(公告)号：US08452138B2

    公开(公告)日：2013-05-28

    申请号：US13361230

    申请日：2012-01-30

    申请人： Ryusuke Naito ,  Emiko Tani ,  Masayuki Hodono ,  Yusuke Shimizu ,  Kei Nakamura

    发明人： Ryusuke Naito ,  Emiko Tani ,  Masayuki Hodono ,  Yusuke Shimizu ,  Kei Nakamura

    IPC分类号： G02B6/10 ,  G02B6/42

    CPC分类号： G02B6/423

    摘要： An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.

    摘要翻译： 提供一种光传感器模块，其中板单元的接合部分装配在光波导单元的凹槽中，并且即使具有单个接合部分，板单元也被稳定地支撑。 光传感器模块包括光波导单元和安装有光学元件并耦合到光波导单元的板单元。 光波导单元包括沿着上包层的一个侧边缘轴向延伸的单个边缘延伸部分，设置在单个边缘延伸部分中的基板单元接合槽，以及设置在垂直槽的侧壁上并保持的突起 与基板单元的接合部抵接。 板单元包括装配在垂直槽中的接合部分，其垂直于垂直槽内的突起。

    Mounted structure of circuit board and multi-layer circuit board therefor
    6.
    发明授权
    Mounted structure of circuit board and multi-layer circuit board therefor 失效
    电路板和多层电路板的安装结构

    公开(公告)号：US06310391B1

    公开(公告)日：2001-10-30

    申请号：US09334631

    申请日：1999-06-17

    申请人： Megumu Nagasawa ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Kei Nakamura

    发明人： Megumu Nagasawa ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Kei Nakamura

    IPC分类号： H01L23053

    CPC分类号： H05K3/462 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K1/0206 ,  H05K1/0207 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/0401

    摘要： The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other. The mounted structure of circuit board comprises a 6-layer circuit board 2 having a laminate of three sheets of double-sided circuit boards 1 and a chip 13 connected to a circuit 5 on the uppermost layer. The core material 3 embedded in the intraboard insulating layer 4 in various double-sided circuit board 1 comprises a copper layer 3a having a heat conductivity of 393 W/·K provided on at least one side of an Ni—Fe alloy foil 25. The chip 13 and the underlying core material 3 are connected to each other with a solder metal member 10. The core material 3 on the horizontally adjacent double-sided circuit boards 1 are similarly connected to each other with the solder metal member 10.

    摘要翻译： 本发明提供了一种电路板的安装结构，其可以通过简单的方法制备，并且显示出来自芯片的良好散热并经受松弛的热应力，并且将多层电路板并入安装的结构中。 提供一种电路板的新型安装结构，其包括嵌入绝缘层中的芯材，所述芯材具有设置在Ni-Fe合金的至少一侧上的导热率不小于100W / mK的金属层 箔，所述绝缘层包括设置的导线导体和安装在其至少一侧上的半导体元件，其特征在于，设置用于导热的焊料金属构件插入在所述半导体元件和所述芯材之间，使得所述半导体元件和所述 芯材彼此连接。 电路板的安装结构包括具有三片双面电路板1和连接到最上层电路5的芯片13的叠层的6层电路板2。 在各种双面电路板1中嵌入在内部绝缘层4中的芯材3包括设置在Ni-Fe合金箔25的至少一侧上的导热率为393W / K.的铜层3a。 芯片13和下面的芯材3通过焊料金属部件10彼此连接。水平相邻的双面电路板1上的芯材3类似地用焊料金属部件10彼此连接。

    Printed circuit board and magnetic head driving device including the same
    8.
    发明授权
    Printed circuit board and magnetic head driving device including the same 有权
    印刷电路板和包括其的磁头驱动装置

    公开(公告)号：US08330054B2

    公开(公告)日：2012-12-11

    申请号：US12771500

    申请日：2010-04-30

    申请人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    发明人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    IPC分类号： H05K1/16

    CPC分类号： G11B5/4846 ,  G11B5/484 ,  H05K1/0245 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2201/2009

    摘要： A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 Ω and not more than 50 Ω.

    摘要翻译： 在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。 两个相邻的布线迹线构成传输线对。 布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。 选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个

    Fixing device and image forming apparatus including fixing device
    10.
    发明授权
    Fixing device and image forming apparatus including fixing device 有权
    固定装置和包括定影装置的图像形成装置

    公开(公告)号：US07787788B2

    公开(公告)日：2010-08-31

    申请号：US11936444

    申请日：2007-11-07

    申请人： Kei Nakamura

    发明人： Kei Nakamura

    IPC分类号： G03G15/20

    CPC分类号： G03G15/2039 ,  G03G15/2032 ,  G03G2215/2016

    摘要： A fixing device includes a fixing member, pressure member, first temperature detector, and pressure adjustment mechanism. The pressure member presses against the fixing member to form a nip though which a recording medium bearing a toner image thereon is conveyed. The first temperature detector detects a temperature of the fixing member. The pressure adjustment mechanism performs an adjustment to contact pressure between the fixing and pressure members to be lower than an appropriate pressure for image fixing at the detected temperature of the fixing roller or separation of the pressure roller from the fixing member for a part of a period between a time at which a tailing end of a precedent recording medium is conveyed out from the nip and a time at which a leading end of a following recording medium is conveyed into the nip when a plurality of recording media are successively conveyed through the nip.

    摘要翻译： 定影装置包括固定构件，压力构件，第一温度检测器和压力调节机构。 压力构件压靠固定构件以形成辊隙，通过该辊隙传送其上具有调色剂图像的记录介质。 第一温度检测器检测固定部件的温度。 压力调节机构进行调整，以使固定部件和压力部件之间的接触压力低于在定影辊的检测温度下进行图像定影的适当压力，或者将压力辊与固定部件分离一段时间 在先前的记录介质的拖尾端从辊隙输送出来的时间与当多个记录介质被连续地通过辊隙传送到后一个记录介质的前端到达辊隙的时间之间。