公开(公告)号：US20130240841A1

公开(公告)日：2013-09-19

申请号：US13424221

申请日：2012-03-19

申请人： Yiliang WU ,  Anthony J. Wigglesworth ,  Ping Liu

发明人： Yiliang WU ,  Anthony J. Wigglesworth ,  Ping Liu

IPC分类号： H01L51/30

CPC分类号： H01L51/0558 ,  H01L51/0026 ,  H01L51/0036

摘要： A method including activating an electronic device, such as an organic thin film transistor, by exposing the device to non-ionizing radiation while the device is under an electrical field. Activation of the transistor increases the field effect mobility of the transistor.

摘要翻译： 一种方法，包括通过在器件处于电场的情况下将器件暴露于非电离辐射而激活诸如有机薄膜晶体管的电子器件。 晶体管的激活增加了晶体管的场效应迁移率。

公开(公告)号：US20110135808A1

公开(公告)日：2011-06-09

申请号：US12631153

申请日：2009-12-04

申请人： Ping LIU ,  Yiliang WU ,  Anthony J. WIGGLESWORTH ,  Nan-Xing HU

发明人： Ping LIU ,  Yiliang WU ,  Anthony J. WIGGLESWORTH ,  Nan-Xing HU

IPC分类号： B05D5/12 ,  H01B1/12

CPC分类号： H01B1/22 ,  B22F1/0022 ,  B22F1/0074 ,  B82Y30/00 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2203/122

摘要： A method of forming conductive features on a substrate, the method includes reacting a metal compound with a reducing agent in the presence of a stabilizer in a reaction mixture comprising the metal compound, the reducing agent, and the stabilizer, wherein the reaction mixture is substantially free of solvent, to form a plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles. After isolating the plurality of metal nanoparticles, a liquid composition that includes a polymeric binder, a liquid and the plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles is deposited on a substrate by a liquid deposition technique to form a deposited composition. The deposited composition is then heated to form conductive features on the substrate.

摘要翻译： 一种在基材上形成导电特征的方法，所述方法包括使金属化合物与还原剂在稳定剂存在下在包含金属化合物，还原剂和稳定剂的反应混合物中反应，其中反应混合物基本上 不含溶剂，在金属纳米颗粒的表面上形成多个具有稳定剂分子的金属纳米颗粒。 在分离多个金属纳米颗粒之后，通过液体沉积技术将包含聚合物粘合剂，液体和金属纳米颗粒表面上的稳定剂分子的多种金属纳米颗粒的液体组合物通过液体沉积技术沉积在基底上，形成 沉积组成。 然后将沉积的组合物加热以在基底上形成导电特征。

公开(公告)号：US20110050803A1

公开(公告)日：2011-03-03

申请号：US12551779

申请日：2009-09-01

申请人： Yiliang WU ,  Ping LIU ,  Nan-Xing HU

发明人： Yiliang WU ,  Ping LIU ,  Nan-Xing HU

IPC分类号： B41J2/135

CPC分类号： B41J2/1433 ,  B41J2/1606 ,  B41J2/1642 ,  B41J2/1646

摘要： Described herein are printheads for inkjet printing and, more specifically, printheads modified with a self-assembly monolayer (SAM). Also described are processes for making and using the printheads as well as processes for forming patterns and images on a substrate including jetting inkjet inks or jettable materials using a printhead for inkjet printing that has been modified with a self-assembly monolayer.

摘要翻译： 这里描述了用于喷墨打印的打印头，更具体地，用自组装单层（SAM）修改的打印头。 还描述了用于制造和使用打印头的方法以及用于在基材上形成图案和图像的方法，包括使用已经用自组装单层改性的用于喷墨印刷的打印头的喷射喷墨油墨或可喷射材料。

公开(公告)号：US20090181177A1

公开(公告)日：2009-07-16

申请号：US12013643

申请日：2008-01-14

申请人： Yuning LI ,  Hadi K. MAHABADI ,  Hualong PAN ,  Yiliang WU ,  Ping LIU ,  Paul F. Smith

发明人： Yuning LI ,  Hadi K. MAHABADI ,  Hualong PAN ,  Yiliang WU ,  Ping LIU ,  Paul F. Smith

IPC分类号： B05D5/12 ,  B41F31/00

CPC分类号： C23C18/00 ,  B82Y30/00 ,  C09D11/30 ,  C09D11/52 ,  C09D11/54 ,  C23C18/08 ,  H01L27/124 ,  H01L27/1292 ,  H05K1/097 ,  H05K3/125 ,  H05K3/1283 ,  H05K2203/013 ,  H05K2203/1163

摘要： A method of forming conductive features on a substrate, the method comprising: providing two or more solutions, wherein a metal nanoparticle solution contains metal nanoparticles with a stabilizer and a destabilizer solution contains a destabilizer that destabilizes the stabilizer, liquid depositing the metal nanoparticle solution and the destabilizer solution onto the substrate, wherein during deposition or following the deposition of the metal nanoparticle solution onto the substrate, the metal nanoparticle and the destabilizer are combined with each other, destabilizing the stabilizer from the surface of the metal nanoparticles with the destabilizer and removing the stabilizer and destabilizer from the substrate by heating the substrate to a temperature below about 180° C. or by washing with the solvent

摘要翻译： 一种在基底上形成导电特征的方法，所述方法包括：提供两种或更多种溶液，其中金属纳米颗粒溶液含有金属纳米颗粒与稳定剂，去稳定剂溶液含有使稳定剂不稳定的去稳定剂，液体沉积金属纳米颗粒溶液和 所述去稳定剂溶液在所述基材上，其中在沉积期间或在将所述金属纳米颗粒溶液沉积到所述基材上之后，所述金属纳米颗粒和所述去稳定剂彼此组合，使所述稳定剂从所述不稳定剂的表面不稳定化并除去 通过将基底加热到低于约180℃的温度或通过用溶剂洗涤来从基底上的稳定剂和去稳定剂

公开(公告)号：US20120070570A1

公开(公告)日：2012-03-22

申请号：US12883936

申请日：2010-09-16

申请人： Woo Soo KIM ,  Ping LIU ,  Yiliang WU ,  Nan-Xing HU

发明人： Woo Soo KIM ,  Ping LIU ,  Yiliang WU ,  Nan-Xing HU

IPC分类号： B05D3/02 ,  B05D5/00

CPC分类号： H05K3/1275 ,  H01B1/02 ,  H01B1/22 ,  H05K2203/0113

摘要： A method of forming conductive features on a substrate, the method includes, filling a flexible stamp with a metal nanoparticle composition, depositing the metal nanoparticle composition onto the substrate, and heating the deposited metal nanoparticle composition during or after the depositing to form the conductive features.

摘要翻译： 一种在衬底上形成导电特征的方法，所述方法包括：用金属纳米颗粒组合物填充柔性印模，将金属纳米颗粒组合物沉积到衬底上，以及在沉积期间或之后加热沉积的金属纳米颗粒组合物以形成导电特征 。

公开(公告)号：US20100233361A1

公开(公告)日：2010-09-16

申请号：US12402950

申请日：2009-03-12

申请人： Nan-Xing HU ,  Ping LIU ,  Yiliang WU

发明人： Nan-Xing HU ,  Ping LIU ,  Yiliang WU

IPC分类号： B05D5/12 ,  H01B1/22

CPC分类号： B22F1/0022 ,  B22F1/0074 ,  B22F2998/00 ,  B82Y30/00 ,  C09D11/52 ,  H05K1/097 ,  H05K3/389 ,  H05K2203/122 ,  B22F2301/25 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/20

摘要： A composition that may be as an electronic circuit element includes a metal nanoparticle, an adhesion promoter compound and a solvent. The adhesion promoter compound may be a hydrolytic silane with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, an adhesion promoter compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C.

摘要翻译： 可以作为电子电路元件的组合物包括金属纳米颗粒，粘合促进剂化合物和溶剂。 粘合促进剂化合物可以是具有至少一个有机官能部分的水解硅烷。 在衬底上形成导电特征的方法包括将含有金属纳米颗粒，粘合促进剂化合物和溶剂的组合物沉积到衬底上，并将沉积的组合物加热至约100℃至约200℃的温度。

公开(公告)号：US20090181509A1

公开(公告)日：2009-07-16

申请号：US12013700

申请日：2008-01-14

申请人： Hualong PAN ,  Yiliang WU ,  Ping LIU ,  Yuning LI ,  Paul F. SMITH ,  Hadi K. MAHABADI

发明人： Hualong PAN ,  Yiliang WU ,  Ping LIU ,  Yuning LI ,  Paul F. SMITH ,  Hadi K. MAHABADI

IPC分类号： H01L21/336 ,  C08G75/00

CPC分类号： H01L51/0036 ,  C08G61/02 ,  C08G61/12 ,  C08G61/124 ,  C08G61/125 ,  C08G61/126 ,  C08G2261/124 ,  C08G2261/141 ,  C08G2261/3223 ,  C08G2261/3243 ,  C08G2261/92 ,  H01L51/0037 ,  H01L51/0545

摘要： A polymer semiconductor compound of the below formula, wherein the side chains, R1, R2, R3 and R4, are arranged in a manner that promotes high mobility and to provide a weak side chain interaction.

摘要翻译： 下式的聚合物半导体化合物，其中侧链R1，R2，R3和R4以促进高迁移率并提供弱侧链相互作用的方式排列。

公开(公告)号：US20130344232A1

公开(公告)日：2013-12-26

申请号：US13530861

申请日：2012-06-22

申请人： Naveen CHOPRA ,  Yiliang WU ,  Ping LIU ,  Barkev KEOSHKERIAN ,  Michelle CHRETIEN

发明人： Naveen CHOPRA ,  Yiliang WU ,  Ping LIU ,  Barkev KEOSHKERIAN ,  Michelle CHRETIEN

IPC分类号： H05K3/00 ,  H01G13/00 ,  B82Y40/00

CPC分类号： H01C17/06506 ,  B82Y30/00 ,  H01C17/06 ,  H01G13/00 ,  H05K1/0284 ,  H05K1/097 ,  H05K1/119 ,  H05K3/125

摘要： A method of forming a conductive feature on a three-dimensional object may include depositing a composition comprising nanoparticles onto a portion of the three-dimensional object, and annealing the composition to form the conductive feature. In another embodiment, a method of forming a conductive feature on a three-dimensional object may include printing a composition comprising nanoparticles to produce a contiguous line over a non-planar portion of the three-dimensional object, and heating the composition to form a conductive feature that has conductivity throughout.

摘要翻译： 在三维物体上形成导电特征的方法可以包括将包含纳米颗粒的组合物沉积到三维物体的一部分上，并退火组合物以形成导电特征。 在另一个实施例中，在三维物体上形成导电特征的方法可以包括印刷包含纳米颗粒的组合物以在三维物体的非平面部分上产生连续的线，并加热组合物以形成导电 具有导电性的特征。

公开(公告)号：US20090181183A1

公开(公告)日：2009-07-16

申请号：US12013539

申请日：2008-01-14

申请人： Yuning LI ,  Yiliang WU ,  Hualong PAN ,  Ping LIU ,  Paul F. SMITH ,  Hadi K. MAHABADI

发明人： Yuning LI ,  Yiliang WU ,  Hualong PAN ,  Ping LIU ,  Paul F. SMITH ,  Hadi K. MAHABADI

IPC分类号： H05K3/12 ,  C22C5/02 ,  C22C5/04 ,  C22C5/08 ,  C22C5/06 ,  C22C9/00 ,  C22C19/07 ,  C22C27/06 ,  C22C19/03

CPC分类号： H05K1/097 ,  B82Y30/00 ,  C23C24/087 ,  H05K2203/122

摘要： A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180° C. to form conductive features on the substrate.

摘要翻译： 金属纳米颗粒组合物包括可热分解或可分解UV稳定剂。 一种在基底上形成导电特征的方法，包括提供含有金属纳米粒子的溶液与稳定剂; 并将溶液液体沉积到基底上，其中在沉积期间或在溶液沉积到基底上之后，通过热处理或通过UV处理在低于约180℃的温度下分解和除去稳定剂，以形成导电 特征在基板上。

公开(公告)号：US20090142482A1

公开(公告)日：2009-06-04

申请号：US11948509

申请日：2007-11-30

申请人： Yuning LI ,  Ping LIU ,  Yiliang WU ,  Hualong PAN ,  Paul F. SMITH ,  Hadi K. MAHABADI

发明人： Yuning LI ,  Ping LIU ,  Yiliang WU ,  Hualong PAN ,  Paul F. SMITH ,  Hadi K. MAHABADI

IPC分类号： B05D5/12

CPC分类号： B41M3/001 ,  B41M3/006 ,  B41M3/008 ,  D06P1/0048 ,  D06P1/445 ,  D06P1/67308 ,  H05K3/105 ,  H05K3/182 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/121 ,  H05K2203/125

摘要： A method of forming a conductive ink silver features on a substrate by printing a silver compound solution and a hydrazine compound reducing agent solution on the surface of a substrate with a printhead. The silver compound solution and the hydrazine compound reducing agent solution are mixed just before, during, or following the printing of both solutions on the surface of the substrate, and the silver compound is then reduced to form conductive silver ink features on the substrate.

摘要翻译： 通过用印刷头在基板的表面上印刷银化合物溶液和肼化合物还原剂溶液，在基板上形成导电油墨银的方法。 将银化合物溶液和肼化合物还原剂溶液在两种溶液在基材表面上印刷之前，之中或之后混合，然后还原银化合物以在基材上形成导电银墨。