公开(公告)号：US20070222008A1

公开(公告)日：2007-09-27

申请号：US11616766

申请日：2006-12-27

申请人： Jung-Tai Chen ,  Wen-Yang Chang ,  Yii-Tay Chiou ,  Chun-Hsun Chu

发明人： Jung-Tai Chen ,  Wen-Yang Chang ,  Yii-Tay Chiou ,  Chun-Hsun Chu

IPC分类号： H01L29/84 ,  H01L21/00

CPC分类号： B81C1/00896 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A plastic packaging of MEMS device and a method therefore are provided. The method includes the steps of: provide a carrier having a surface; provide at least one MEMS device having an active surface with a sensitive area and bonding pads thereon and a back surface; proceed a photoresist process to form a sacrificial layer on the sensitive area; bind and electrically connect the MEMS device to the surface of the carrier; form at least one molding compound, to which the upper surface of the sacrificial layer is exposed. Finally, decompose the sacrificial layer by a solvent to expose the MEMS device on the sensitive area, so as to let the sensitive area contact with ambient atmosphere.

摘要翻译： 提供了MEMS器件的塑料封装及其方法。 该方法包括以下步骤：提供具有表面的载体; 提供至少一个MEMS器件，其具有活性表面和敏感区域及其上的接合焊盘和背面; 进行光致抗蚀剂处理以在敏感区域上形成牺牲层; 将MEMS器件绑定并电连接到载体的表面; 形成至少一个模塑料，牺牲层的上表面暴露于该模塑料。 最后，通过溶剂分解牺牲层，使敏感区域上的MEMS器件暴露，使敏感区域与环境大气接触。

公开(公告)号：US20060110106A1

公开(公告)日：2006-05-25

申请号：US11105514

申请日：2005-04-14

申请人： Ming-Lang Tsai ,  Ming-Jie Chou ,  Bor-Chen Tsai ,  Zong-Yuan Wu ,  Chih-Hsiang Ko ,  Chin-Sheng Chang ,  Yii-Tay Chiou ,  Chun-Hsun Chu ,  Jung-Tai Chen

发明人： Ming-Lang Tsai ,  Ming-Jie Chou ,  Bor-Chen Tsai ,  Zong-Yuan Wu ,  Chih-Hsiang Ko ,  Chin-Sheng Chang ,  Yii-Tay Chiou ,  Chun-Hsun Chu ,  Jung-Tai Chen

IPC分类号： G02B6/36

CPC分类号： G02B6/4246

摘要： A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

摘要翻译： 光纤波导光学子组件使用多模光纤来增加有源光学元件与波导之间的对准公差。 由于光耦合间隙，滤光片较薄以降低色散。 该子组件进一步组合光学台以实现被动定位。 因此降低成本，提高传输速率。

公开(公告)号：US08472646B2

公开(公告)日：2013-06-25

申请号：US11690842

申请日：2007-03-25

申请人： Jung-Tai Chen ,  Chun-Hsun Chu

发明人： Jung-Tai Chen ,  Chun-Hsun Chu

IPC分类号： H04R25/00

CPC分类号： H04R19/005 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/10155 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16195 ,  H04R1/2819 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

摘要： An inversed microphone module is provided. The module includes a substrate, a microphone chip, a back acoustic cavity cover, and a sealing material. The substrate has a plurality of connection pads and an acoustic hole. The microphone chip has a first surface and an opposite second surface. A plurality of electrically bonding portions and an acoustic sensing are disposed on the first surface. The microphone chip is electrically coupled to the connection pads of the substrate through the electrically bonding portions, and the acoustic hole corresponds to the acoustic sensing portion. The back acoustic cavity cover is fixed to the second surface and defines a back acoustic cavity with the acoustic sensing portion and the microphone chip. The sealing material encapsulates the microphone chip and covers the substrate, so that the sealing material, the substrate, the acoustic sensing portion, and the first surface define a front acoustic cavity.

摘要翻译： 提供反向麦克风模块。 该模块包括基底，麦克风芯片，背部声腔盖和密封材料。 基板具有多个连接垫和声孔。 麦克风芯片具有第一表面和相对的第二表面。 多个电接合部分和声学感测设置在第一表面上。 麦克风芯片通过电接合部分电耦合到基板的连接焊盘，并且声孔对应于声感测部分。 背部声腔盖被固定到第二表面并且限定具有声学感测部分和麦克风芯片的反向声腔。 密封材料封装麦克风芯片并覆盖基板，使得密封材料，基板，声学感测部分和第一表面限定前声学腔。

公开(公告)号：US20080083960A1

公开(公告)日：2008-04-10

申请号：US11759940

申请日：2007-06-08

申请人： Jung-Tai Chen ,  Chun-Hsun Chu

发明人： Jung-Tai Chen ,  Chun-Hsun Chu

IPC分类号： H01L29/84 ,  H01L21/56

CPC分类号： H04R1/04 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H04R19/005 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package structure of a micro-electromechanical system (MEMS) type microphone is disclosed. The MEMS microphone comprises a substrate, a MEMS chip, an acoustic wave cover, and an encapsulant. The substrate has connection pads. The MEMS chip is electrically coupled to the connection pads. The MEMS chip includes an acoustic wave sensing portion. The acoustic wave cover is fixed on the MEMS chip for covering without contacting the acoustic wave sensing portion and defining an acoustic wave cavity space. The acoustic wave cover has an opening for allowing an acoustic wave to enter or exit out of the acoustic cavity space. The encapsulant encapsulates the substrate, the MEMS chip, and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed. The exposed surface of the acoustic wave cover is along the same level as the surface of the encapsulant.

摘要翻译： 公开了一种微机电系统（MEMS）型麦克风的封装结构。 MEMS麦克风包括基板，MEMS芯片，声波盖和密封剂。 衬底具有连接焊盘。 MEMS芯片电耦合到连接焊盘。 MEMS芯片包括声波感测部分。 声波罩固定在MEMS芯片上用于覆盖而不接触声波感测部分并且限定声波腔空间。 声波罩具有用于允许声波进入或离开声腔空间的开口。 密封剂封装衬底，MEMS芯片和声波罩，其中声波罩的表面被暴露。 声波罩的暴露表面与密封剂表面的水平相同。

公开(公告)号：US07770449B2

公开(公告)日：2010-08-10

申请号：US11808660

申请日：2007-06-12

申请人： Jung-Tai Chen ,  Chia-Yen Lee ,  Yii-Tay Chiou ,  Chun-Hsun Chu

发明人： Jung-Tai Chen ,  Chia-Yen Lee ,  Yii-Tay Chiou ,  Chun-Hsun Chu

IPC分类号： G01N27/12

CPC分类号： G01N27/048 ,  Y10T29/49101

摘要： A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.

摘要翻译： 具有微桥的电阻型湿度检测结构包括基板，感测部分和两个测量电极。 在基板上分别形成隔离层和桥。 感测部分包括电阻和湿度感测层。 在与电桥相对应的电阻感测层上形成两个测量电极，以将感测部分固定在第一隔离层上，以测量电阻感测层的电阻值。 湿度传感层的材料根据湿度改变其体积，由湿度感测层覆盖的电阻感测层的长度变形，并且电阻感测层的材料长度的变化导致电阻值的变化 。 最后，使用两个测量电极来测量湿度值。

公开(公告)号：US07409124B2

公开(公告)日：2008-08-05

申请号：US11105514

申请日：2005-04-14

申请人： Ming-Lang Tsai ,  Ming Jie Chou ,  Bor-Chen Tsai ,  Zong-Yuan Wu ,  Chih-Hsiang Ko ,  Chin-Sheng Chang ,  Yii-Tay Chiou ,  Chun-Hsun Chu ,  Jung-Tai Chen

发明人： Ming-Lang Tsai ,  Ming Jie Chou ,  Bor-Chen Tsai ,  Zong-Yuan Wu ,  Chih-Hsiang Ko ,  Chin-Sheng Chang ,  Yii-Tay Chiou ,  Chun-Hsun Chu ,  Jung-Tai Chen

IPC分类号： G02B6/30 ,  G02B6/36

CPC分类号： G02B6/4246

摘要： A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

摘要翻译： 光纤波导光学子组件使用多模光纤来增加有源光学元件与波导之间的对准公差。 由于光耦合间隙，滤光片较薄以降低色散。 该子组件进一步组合光学台以实现被动定位。 因此降低成本，提高传输速率。

公开(公告)号：US20070188974A1

公开(公告)日：2007-08-16

申请号：US11647216

申请日：2006-12-29

申请人： Jung-Tai Chen ,  Chia-Yen Lee ,  Yii-Tay Chiou ,  Chun-Hsun Chu

发明人： Jung-Tai Chen ,  Chia-Yen Lee ,  Yii-Tay Chiou ,  Chun-Hsun Chu

IPC分类号： H01G5/012

CPC分类号： H01G5/18 ,  H01C10/14 ,  Y10T29/49099

摘要： A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.

摘要翻译： 公开了一种具有悬臂电阻的湿度检测结构及其制造方法。 该方法包括提供具有第一表面和第二表面的基底; 在所述第一表面和所述第二表面上进行氧化处理以分别形成第一氧化物层和第二氧化物层; 在所述第一氧化物层上形成电阻感测层; 在电阻感测层上形成湿度感测层; 在基板上形成穿透第一氧化物层和第二氧化物层的通孔; 并且在通孔中形成悬臂，使得湿度感测层和电阻感测层都固定在悬臂上的适当位置。 响应于湿度变化，湿度感测层的体积变化，因此电阻感测层的长度变化，允许测量环境湿度。

公开(公告)号：US20090014847A1

公开(公告)日：2009-01-15

申请号：US11968982

申请日：2008-01-03

申请人： Jung-Tai Chen ,  Chun-Hsun Chu ,  Wood-Hi Cheng

发明人： Jung-Tai Chen ,  Chun-Hsun Chu ,  Wood-Hi Cheng

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit (IC) package structure with an electromagnetic interference (EMI) shielding structure utilizes double-layer successive cladding process. A dielectric coating layer and an EMI shielding layer material are sequentially coated on surface of a carrying substrate, an IC on the carrying substrate, and all the other devices. The EMI shielding layer is closely adhered to and bonded on a ground metal area exposed on an upper surface of the carrying substrate, the EMI shielding layer on the package is connected to a ground plane under the carrying substrate in series, so as to form a protection cover having a closed EMI shielding space to isolate the interference of electromagnetic waves from outside.

摘要翻译： 具有电磁干扰（EMI）屏蔽结构的集成电路（IC）封装结构采用双层连续包层工艺。 电介质涂层和EMI屏蔽层材料依次涂覆在承载基板的表面，载体基板上的IC以及所有其它装置上。 EMI屏蔽层紧密地粘接在暴露在承载基板的上表面上的接地金属区域上，封装上的EMI屏蔽层与承载基板下的接地平面连接，形成一个 保护盖具有闭合的EMI屏蔽空间，以隔离电磁波与外部的干扰。

公开(公告)号：US20080315433A1

公开(公告)日：2008-12-25

申请号：US11946814

申请日：2007-11-28

申请人： Jung-Tai Chen ,  Tzong-Che Ho ,  Chun-Hsun Chu

发明人： Jung-Tai Chen ,  Tzong-Che Ho ,  Chun-Hsun Chu

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L23/66 ,  H01L24/11 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/2518 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30107 ,  H01L2224/05552

摘要： A self-aligned wafer or chip structure including a substrate, at least one first concave base, at least one second concave base, at least one connecting structure and at least one bump is provided. The substrate has a first surface and a second surface, and at least one pad is formed on the first surface. The first concave base is disposed on the first surface and electrically connected to the pad. The second concave base is disposed on the second surface. The connecting structure passes through the substrate and disposed between the first and second concave bases so as to be electrically connected to the first and second concave bases. The bump is filled in the second concave base and protrudes out of the second surface.

摘要翻译： 提供了包括衬底，至少一个第一凹入基底，至少一个第二凹形基底，至少一个连接结构和至少一个凸块的自对准晶片或芯片结构。 衬底具有第一表面和第二表面，并且在第一表面上形成至少一个衬垫。 第一凹形基底设置在第一表面上并电连接到垫。 第二凹形基底设置在第二表面上。 连接结构通过基板并且设置在第一和第二凹形基座之间，以便电连接到第一和第二凹形基部。 凸块被填充在第二凹入基底中并突出到第二表面之外。

公开(公告)号：US07969016B2

公开(公告)日：2011-06-28

申请号：US11946814

申请日：2007-11-28

申请人： Jung-Tai Chen ,  Tzong-Che Ho ,  Chun-Hsun Chu

发明人： Jung-Tai Chen ,  Tzong-Che Ho ,  Chun-Hsun Chu

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L23/66 ,  H01L24/11 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/2518 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30107 ,  H01L2224/05552

摘要： A self-aligned wafer or chip structure including a substrate, at least one first concave base, at least one second concave base, at least one connecting structure and at least one bump is provided. The substrate has a first surface and a second surface, and at least one pad is formed on the first surface. The first concave base is disposed on the first surface and electrically connected to the pad. The second concave base is disposed on the second surface. The connecting structure passes through the substrate and disposed between the first and second concave bases so as to be electrically connected to the first and second concave bases. The bump is filled in the second concave base and protrudes out of the second surface.

摘要翻译： 提供了包括衬底，至少一个第一凹入基底，至少一个第二凹形基底，至少一个连接结构和至少一个凸块的自对准晶片或芯片结构。 衬底具有第一表面和第二表面，并且在第一表面上形成至少一个衬垫。 第一凹形基底设置在第一表面上并电连接到垫。 第二凹形基底设置在第二表面上。 连接结构通过基板并且设置在第一和第二凹形基座之间，以便电连接到第一和第二凹形基部。 凸块被填充在第二凹入基底中并突出到第二表面之外。