摘要:
A semiconductor memory device having a burn-in test capability. The semiconductor memory device includes a detection circuit, which is connected to the plurality of word lines. The detection circuit detects whether a stress voltage for a burn-in test has been applied to all of the word lines along their entire lengths in the burn-in test.
摘要:
The first switching circuit selects data of a predetermined bit from the input/output data in accordance with each of a plurality of testing modes and outputs the selected data as testing data. The second switching circuits receive the testing data and each bit of the input/output data, and select one of the input/output data and the testing data in accordance with the operation mode. In detail, each bit of the input/output data is respectively outputted to the memory cells during normal operation mode, and during testing mode the testing data is selected to be outputted to the memory cells as the common input/output data. Thus, write control for multiple kinds of data compressing test can be performed by using the simple first and second switching circuits. As a result, the control circuit for the data compressing test can be reduced in layout size.
摘要:
It is an object to provide a semiconductor memory device that can conduct the equalizing operation of bit lines with a low current consumption while maintaining a normal accessing speed and the chip area, and a control method thereof. In a semiconductor memory device of the shared sense amplification system, in a predetermined number of times which is (k−1) times or less among k-times of continuous word line selections of a selected memory block, the bit line separation gate of the unselected memory block is rendered conductive in the active period of the equalizing unit after the word line selection. Also, a circuit that equalizes a wiring higher in the capacity component is driven by a higher voltage level according to the wiring capacity component of the sense amplification power supply line and the bit lines, to thereby equalize the power supply line and the bit line in the equal time, thereby being capable of preventing the short-circuiting within the sense amplifier.
摘要:
The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor Substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second Semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.
摘要:
The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.
摘要:
It is an object to provide a semiconductor memory device that can conduct the equalizing operation of bit lines with a low current consumption while maintaining a normal accessing speed and the chip area, and a control method thereof. In a semiconductor memory device of the shared sense amplification system, in a predetermined number of times which is (k−1) times or less among k-times of continuous word line selections of a selected memory block, the bit line separation gate of the unselected memory block is rendered conductive in the active period of the equalizing unit after the word line selection. Also, a circuit that equalizes a wiring higher in the capacity component is driven by a higher voltage level according to the wiring capacity component of the sense amplification power supply line and the bit lines, to thereby equalize the power supply line and the bit line in the equal time, thereby being capable of preventing the short-circuiting within the sense amplifier.
摘要:
A semiconductor memory device, in which a cell plate potential does not fluctuate even when the device state is changed from a state without stored charge in all charge storage nodes of the cell capacitors at power-on to an access operation state, comprises NMOS transistors M1 to Mk for connecting a line VPR as a feeder for a reference voltage VPR from a reference voltage generation circuit with a line VCP as a feeder for a reference voltage VCP from the reference voltage generation circuit in each of cell blocks B1 to Bk. Gate terminals of the NMOS transistors M1 to Mk are connected to a common signal φCPR. The signal φCPR outputs a positive logical level at a predetermined time after power-on. By providing the NMOS transistors M1 to Mk for short-circuiting the line VPR with the line VCP in each of the cell blocks B1 to Bk, both lines are short-circuited in each of the cell blocks B1 to Bk.
摘要:
A semiconductor memory device having a burn-in test capability. The semiconductor memory device includes a detection circuit, which is connected to the plurality of word lines. The detection circuit detects whether a stress voltage for a burn-in test has been applied to all of the word lines along their entire lengths in the burn-in test.
摘要:
A semiconductor memory device, in which a cell plate potential does not fluctuate even when the device state is changed from a state without stored charge in all charge storage nodes of the cell capacitors at power-on to an access operation state, comprises NMOS transistors M1 to Mk for connecting a line VPR as a feeder for a reference voltage VPR from a reference voltage generation circuit with a line VCP as a feeder for a reference voltage VCP from the reference voltage generation circuit in each of cell blocks B1 to Bk. Gate terminals of the NMOS transistors M1 to Mk are connected to a common signal &phgr;CPR. The signal &phgr;CPR outputs a positive logical level at a predetermined time after power-on. By providing the NMOS transistors M1 to Mk for short-circuiting the line VPR with the line VCP in each of the cell blocks B1 to Bk, both lines are short-circuited in each of the cell blocks B1 to Bk.
摘要:
The present invention provides a semiconductor memory device that performs a burn-in test. The device includes word lines, pairs of bit lines, memory cells, sense amplifiers connected to the pairs of bit lines for amplifying a potential difference between the associated pair of bit lines, and a burn-in test control circuit for providing a stress voltage to the plurality of word lines and the pairs of bit lines to perform a burn-in test based on the burn-in control signal The burn-in test control circuit includes a potential difference setting circuit for selecting one of the first word lines so to generate a potential difference between at least one of the pairs of bit lines. The sense amplifiers amplify the potential difference to provide the stress voltage between the word lines and the associated pair of bit lines and between the bit lines of that pair.