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公开(公告)号：US06930380B2
公开(公告)日：2005-08-16
申请号：US10860072
申请日：2004-06-04
IPC分类号： H01L21/60 , H01L23/12 , H01L23/485 , H01L23/495 , H01L23/528 , H01L23/538 , H01L29/73
CPC分类号： H01L24/85 , H01L23/4952 , H01L23/5286 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48624 , H01L2224/48699 , H01L2224/48724 , H01L2224/48824 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49171 , H01L2224/49173 , H01L2224/73265 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/014 , H01L2924/05042 , H01L2924/12044 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/30105 , H01L2224/78 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.
摘要翻译： 半导体器件包括半导体芯片，形成在半导体芯片的主表面上的多个接合焊盘，包括第一电源接合焊盘，第二电源焊盘和多个信号焊盘，多个引线， 布置在半导体芯片的周围，并且包括第一电源引线和多个信号引线，多个接合线，包括用于将第一电源接合焊盘与第一电源引线连接的第一接合线，用于连接 具有第二接合焊盘的第一接合焊盘和用于将多个信号接合焊盘与多个信号引线连接的第三接合线，以及密封半导体芯片，多个接合线和多个引线中的一些引线的密封体。
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公开(公告)号：US07078824B2
公开(公告)日：2006-07-18
申请号：US11203963
申请日：2005-08-16
CPC分类号： H01L24/85 , H01L23/4952 , H01L23/5286 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48624 , H01L2224/48699 , H01L2224/48724 , H01L2224/48824 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49171 , H01L2224/49173 , H01L2224/73265 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/014 , H01L2924/05042 , H01L2924/12044 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/30105 , H01L2224/78 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.
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公开(公告)号：US20060060965A1
公开(公告)日：2006-03-23
申请号：US11203963
申请日：2005-08-16
IPC分类号： H01L23/34
CPC分类号： H01L24/85 , H01L23/4952 , H01L23/5286 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48624 , H01L2224/48699 , H01L2224/48724 , H01L2224/48824 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/49171 , H01L2224/49173 , H01L2224/73265 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2924/00014 , H01L2924/014 , H01L2924/05042 , H01L2924/12044 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/30105 , H01L2224/78 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.
摘要翻译： 半导体器件包括半导体芯片，形成在半导体芯片的主表面上的多个接合焊盘，包括第一电源接合焊盘，第二电源焊盘和多个信号焊盘，多个引线， 布置在半导体芯片的周围，并且包括第一电源引线和多个信号引线，多个接合线，包括用于将第一电源接合焊盘与第一电源引线连接的第一接合线，用于连接 具有第二接合焊盘的第一接合焊盘和用于将多个信号接合焊盘与多个信号引线连接的第三接合线，以及密封半导体芯片，多个接合线和多个引线中的一些引线的密封体。
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