公开(公告)号：US07078824B2

公开(公告)日：2006-07-18

申请号：US11203963

申请日：2005-08-16

申请人： Yoshihiko Shimanuki ,  Hisashi Hasunuma

发明人： Yoshihiko Shimanuki ,  Hisashi Hasunuma

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L27/10

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/5286 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.

公开(公告)号：US20060060965A1

公开(公告)日：2006-03-23

申请号：US11203963

申请日：2005-08-16

申请人： Yoshihiko Shimanuki ,  Hisashi Hasunuma

发明人： Yoshihiko Shimanuki ,  Hisashi Hasunuma

IPC分类号： H01L23/34

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/5286 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.

摘要翻译： 半导体器件包括半导体芯片，形成在半导体芯片的主表面上的多个接合焊盘，包括第一电源接合焊盘，第二电源焊盘和多个信号焊盘，多个引线， 布置在半导体芯片的周围，并且包括第一电源引线和多个信号引线，多个接合线，包括用于将第一电源接合焊盘与第一电源引线连接的第一接合线，用于连接 具有第二接合焊盘的第一接合焊盘和用于将多个信号接合焊盘与多个信号引线连接的第三接合线，以及密封半导体芯片，多个接合线和多个引线中的一些引线的密封体。

公开(公告)号：US06930380B2

公开(公告)日：2005-08-16

申请号：US10860072

申请日：2004-06-04

申请人： Yoshihiko Shimanuki ,  Hisashi Hasunuma

发明人： Yoshihiko Shimanuki ,  Hisashi Hasunuma

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H01L23/495 ,  H01L23/528 ,  H01L23/538 ,  H01L29/73

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/5286 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second power source bonding pads and a plurality of signal bonding pads, a plurality of leads which are arranged around the semiconductor chip and include first power source leads and a plurality of signal leads, a plurality of bonding wires which include first bonding wires for connecting the first power source bonding pads with the first power source leads, second bonding wires for connecting the first bonding pads with second bonding pads and third bonding wires for connecting the plurality of signal bonding pads with the plurality of signal leads, and a sealing body which seals the semiconductor chip, the plurality of bonding wires and some of the plurality of leads.

摘要翻译： 半导体器件包括半导体芯片，形成在半导体芯片的主表面上的多个接合焊盘，包括第一电源接合焊盘，第二电源焊盘和多个信号焊盘，多个引线， 布置在半导体芯片的周围，并且包括第一电源引线和多个信号引线，多个接合线，包括用于将第一电源接合焊盘与第一电源引线连接的第一接合线，用于连接 具有第二接合焊盘的第一接合焊盘和用于将多个信号接合焊盘与多个信号引线连接的第三接合线，以及密封半导体芯片，多个接合线和多个引线中的一些引线的密封体。

公开(公告)号：US08222720B2

公开(公告)日：2012-07-17

申请号：US12953499

申请日：2010-11-24

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装有半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3），多个引线（1a），其具有安装表面 （1d）暴露于密封部分（3）的后表面（3a）的周边部分和设置在其相对侧上的密封部分形成表面（1g）和用于连接焊盘（4）的焊丝（4） 2a）和引线（1a）之间的长度（M），其中引线（1a）的密封部分形成表面（1g）的内端（1h）之间的长度（M）设置为与 彼此形成为大于安装面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。

公开(公告)号：US20110018122A1

公开(公告)日：2011-01-27

申请号：US12897221

申请日：2010-10-04

申请人： Yoshihiko Shimanuki

发明人： Yoshihiko Shimanuki

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012

摘要： A semiconductor device is disclosed which includes a tab (5) for use in supporting a semiconductor chip (8), a seal section (12) as formed by sealing the semiconductor chip (8) with a resin material, more than one tab suspension lead (4) for support of the tab (5), a plurality of electrical leads (2) which have a to-be-connected portion as exposed to outer periphery on the back surface of the seal section (12) and a thickness reduced portion as formed to be thinner than said to-be-connected portion and which are provided with an inner groove (2e) and outer groove (2f) in a wire bonding surface (2d) as disposed within the seal section (12) of said to-be-connected portion, and wires (10) for electrical connection between the leads (2) and pads (7) of the semiconductor chip (8), wherein said thickness reduced portion of the leads (2) is covered by or coated with a sealing resin material while causing the wires (10) to be contacted with said to-be-connected portion at specified part lying midway between the outer groove (2f) and inner groove (2e) to thereby permit said thickness reduced portion of leads (2) and the outer groove (2f) plus the inner groove (2e) to prevent occurrence of any accidental lead drop-down detachment.

摘要翻译： 公开了一种半导体器件，其包括用于支撑半导体芯片（8）的突片（5），通过用树脂材料密封半导体芯片（8）形成的密封部分（12），多于一个突片悬挂引线 （4），用于支撑突片（5），多个电引线（2），其具有暴露于密封部分（12）的背面上的外周的待连接部分和厚度减小部分 形成为比所述待连接部分薄，并且在设置在所述待连接部分的密封部分（12）内的引线接合表面（2d）中设置有内槽（2e）和外槽（2f） 以及用于在所述引线（2）和所述半导体芯片（8）的焊盘（7）之间电连接的导线（10），其中所述引线（2）的所述厚度减小部分被覆盖或涂覆 密封树脂材料，同时使导线（10）在指定部分放置时与所述待连接部分接触 在外槽（2f）和内槽（2e）之间的中间，从而允许引线（2）和外槽（2f）加上内槽（2e）的所述厚度减小部分，以防止任何意外的铅下降 分离。

公开(公告)号：US20080268578A1

公开(公告)日：2008-10-30

申请号：US12213779

申请日：2008-06-24

申请人： Yoshihiko Shimanuki ,  Masayuki Suzuki

发明人： Yoshihiko Shimanuki ,  Masayuki Suzuki

IPC分类号： H01L21/56

CPC分类号： H01L24/32 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/3512

摘要： A non-leaded resin-sealed semiconductor device is manufactured by the steps of providing a conductive flat substrate (metal plate) of copper plate or the like, fixing semiconductor elements respectively to predetermined positions on the principal surface of the substrate by an insulating adhesive, electrically connecting electrodes on the surfaces of the semiconductor elements with predetermined partition parts of the substrate separate from the semiconductor elements by conductive wires, forming an insulating resin layer on the principal surface of the substrate to cover the semiconductor elements and wires, selectively removing the substrate from the rear of said substrate to form electrically independent partition parts whereof at least some are external electrode terminals, and selectively removing said resin layer to fragment the device into regions containing the semiconductor elements and the plural partition parts around the semiconductor elements. Thus, there is provided a compact non-leaded semiconductor device having a large number of electrode terminals.

公开(公告)号：US20070108563A1

公开(公告)日：2007-05-17

申请号：US11653402

申请日：2007-01-16

申请人： Yoshihiko Shimanuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Koji Tsuchiya

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper surface, and side faces which connect the upper and lower surfaces with each other; an electrically conductive tab sealed within the sealing body; tab suspending leads contiguous to the tab and partially exposed to the lower surface and the side faces of the sealing body; a semiconductor chip fixed to a lower surface of the tab; a plurality of electrically conductive leads, the electrically conductive leads each having an inner end portion positioned within the sealing body, an outer end portion exposed to the lower surface and a side face of the sealing body, and a projecting portion projecting into the sealing body from a side face of each of the electrically conductive leads; a projecting portion projecting from a side face of each of the tab suspending leads and positioned within the sealing body; and electrically conductive wires positioned within the sealing body and connecting electrodes formed on a lower surface of the semiconductor chip with the projecting portions of the electrically conductive leads and the tab suspending leads.

摘要翻译： 提供了允许减少引脚数和尺寸的半导体器件。 半导体器件包括由绝缘树脂形成的密封体，密封体具有上表面，与上表面相对的下表面和将上下表面相互连接的侧面; 密封在密封体内的导电片; 突片悬挂引线邻接突片并且部分地暴露于密封体的下表面和侧面; 固定在突片的下表面的半导体芯片; 多个导电引线，所述导电引线各自具有位于所述密封体内的内端部，暴露于所述下表面的外端部和所述密封体的侧面，以及突出部，所述突出部突出到所述密封体 从每个导电引线的侧面; 突出部分，其从每个突片悬挂引线的侧面突出并定位在密封体内; 以及定位在密封体内的导电线和形成在半导体芯片的下表面上的电极与导电引线和突片悬挂引线的突出部分。

公开(公告)号：US07176557B2

公开(公告)日：2007-02-13

申请号：US11038070

申请日：2005-01-21

申请人： Yoshihiko Shimanuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Koji Tsuchiya

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper surface, and side faces which connect the upper and lower surfaces with each other; an electrically conductive tab sealed within the sealing body; tab suspending leads contiguous to the tab and partially exposed to the lower surface and the side faces of the sealing body; a semiconductor chip fixed to a lower surface of the tab; a plurality of electrically conductive leads, the electrically conductive leads each having an inner end portion positioned within the sealing body, an outer end portion exposed to the lower surface and a side face of the sealing body, and a projecting portion projecting into the sealing body from a side face of each of the electrically conductive leads; a projecting portion projecting from a side face of each of the tab suspending leads and positioned within the sealing body; and electrically conductive wires positioned within the sealing body and connecting electrodes formed on a lower surface of the semiconductor chip with the projecting portions of the electrically conductive leads and the tab suspending leads.

公开(公告)号：US20060091523A1

公开(公告)日：2006-05-04

申请号：US11260084

申请日：2005-10-28

申请人： Yoshihiko Shimanuki

发明人： Yoshihiko Shimanuki

IPC分类号： H01L21/44 ,  H01L23/04

CPC分类号： H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/4554

摘要： A first solder resist section and a second solder resist section are formed over an upper surface of a wiring board. A semiconductor chip is bonded onto the first solder resist section via an adhesive interposed therebetween. Electrodes of the semiconductor chip are respectively electrically connected to connecting terminals exposed through openings of the second solder resist section via bonding wires. An encapsulating resin is formed over the upper surface of the wiring board so as to cover the semiconductor chip and the bonding wires. A plane dimension of the first solder resist section is smaller than that of the semiconductor chip, and the encapsulating resin is filled even below an outer peripheral portion of a back surface of the semiconductor chip.

公开(公告)号：US06700193B2

公开(公告)日：2004-03-02

申请号：US09988645

申请日：2001-11-20

申请人： Yoshihiko Shimanuki

发明人： Yoshihiko Shimanuki

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The semiconductor device includes tub 5 that is smaller than semiconductor chip 8, and which supports semiconductor chip 8; molded section 12 that is formed by resin-molding around semiconductor chip 8; suspension leads 4, including supporting portions 4a that support tub 5 and exposed portions 4b that are connected to supporting portions 4a and are exposed on back surface 12a of molded section 12, and are elevation processed in supporting portions 4a; leads 2 that are located around tub 5; and wires 10 that connect pads 7 of semiconductor chip 8 with the corresponding leads 2; wherein the thickness of tub 5 and supporting portions 4a of suspension leads 4 is less than the thickness of exposed portions 4b, and back surface 8b of semiconductor chip 8 is firmly in contact with molding resin 11.

摘要翻译： 半导体装置包括比半导体芯片8小的半导体装置，并且其支撑半导体芯片8;通过在半导体芯片8周围树脂模制而形成的模制部分12;包括支撑桶5和支撑桶5的支撑部分4a的暴露部分 4b，其连接到支撑部分4a并暴露在模制部分12的背表面12a上，并且在支撑部分4a，位于桶5周围的引线2上进行升高处理; 将半导体芯片8的焊盘7与对应的引线2连接的导线10;其中，悬挂引线4的槽5和支撑部4a的厚度小于露出部4b的厚度，半导体芯片8的背面8b牢固 与模塑树脂11接触。