摘要:
The improvement of accuracy is provided in extracting a rule in customers. A customer database DB1 is constructed by storing customer inner information concerning the mental side, which includes a value sense of each customer, and customer outer information which includes basic attributes consisting of at least sexuality and age of each customer.
摘要:
An information processing apparatus includes reproduction control means for controlling reproduction of a first parameter in order to reproduce an edit applied to a first image, generation means for generating a second parameter from a plurality of first parameters reproduced by the reproduction control means, and edit means for editing the first image based on the second parameter generated by the generation means, and generating a second image.
摘要:
An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods.A flip chip packaging structure is formed by directly connecting a first semiconductor chip (101) reduced in thickness by back grinding and a substrate (105) via a bump electrode (102) to a wiring pattern (106). Also, a second semiconductor chip (103) is formed with an electrode (104) that is higher than the sum of the thickness of the first semiconductor chip (101) and the height of the electrode (102), and the electrode (104) is directly connected to the wiring pattern (106) on the substrate (105), whereby the most-compact three-dimensional semiconductor packaged device is produced.
摘要:
An information processing apparatus includes a pattern extraction unit, a rule extraction unit, and a reflection information generation unit. The pattern extraction unit is configured to extract an operation pattern of each of users from operation history information obtained from a plurality of devices to be operated, the operation history information at least including information regarding operation histories of the users and device states. The rule extraction unit is configured to extract incorrect operation patterns from the operation patterns extracted by the pattern extraction unit, the incorrect operation patterns being operation patterns caused by incorrect operations performed by the users. The reflection information generation unit is configured to identify a cause of the incorrect operations from types of the incorrect operation patterns and generate, based on the cause of the incorrect operations, reflection information configured to be reflected in functions of the devices to be operated.
摘要:
An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods.A flip chip packaging structure is formed by directly connecting a first semiconductor chip (101) reduced in thickness by back grinding and a substrate (105) via a bump electrode (102) to a wiring pattern (106). Also, a second semiconductor chip (103) is formed with an electrode (104) that is higher than the sum of the thickness of the first semiconductor chip (101) and the height of the electrode (102), and the electrode (104) is directly connected to the wiring pattern (106) on the substrate (105), whereby the most-compact three-dimensional semiconductor packaged device is produced.
摘要:
A small-sized audio signal reproducing apparatus for hearing reproduced audio signals with the aid of a headphone is disclosed. Digitized and compression encoded audio signals, stored in a semiconductor memory, are read out so as to undergo a decoding operation, which is an inverse operation to compression encoding, to reproduce the audio signals, and the reproduced signals are heard by the headphone. The apparatus may be significantly reduced in size and weight as compared to the apparatus in which a tape or a disk is used as the recording medium.
摘要:
A small-sized audio signal reproducing apparatus for hearing reproduced audio signals with the aid of a headphone is disclosed. Digitized and compression encoded audio signals, stored in a semiconductor memory, are read out so as to undergo a decoding operation, which is an inverse operation to compression encoding, to reproduce the audio signals, and the reproduced signals are heard by the headphone. The apparatus may be significantly reduced in size and weight as compared to the apparatus in which a tape or a disk is used as the recording medium.
摘要:
A signal encoding apparatus for cutting out blocks of an input signal waveform at a predetermined time interval and converting the in-block signal by mutually independent conversion axes for encoding, wherein the waveform cutting block length along the time axis is changed according to the input signal.
摘要:
An information processing apparatus includes a pattern extraction unit configured to extract operation patterns from operation history information at least including an operation history of a user and information on a device state obtained from a plurality of operation target devices, a defined pattern database configured to previously register a defined pattern which is a pattern of a combination of defined operations in accordance with the operation target devices, a rule extraction unit configured to extract an unexpected operation pattern from the operation patterns extracted by the pattern extraction unit with reference to the defined pattern database, and a reflection information generation unit configured to generate reflection information to be reflected on a function of the operation target devices from the unexpected operation pattern.
摘要:
The present invention provides a circuit board connecting structure enabled to obtain the reliable connection between circuit patterns by restricting the elongation of a flexible base material even when connecting portions are arranged in a face-to-face configuration and are press-contacted with each other.A circuit board connecting structure 10 includes a first circuit board 11, and a second circuit board 12. The circuit board connecting structure 10 is configured so that when a first connecting portion 13 and a second connecting portion 14 are sandwiched by a pair of pressing jigs 18, 19 and are press-contacted with each other, one 23 of first outer dummy terminals is accommodated between columns of ones 33, 33 of second outer dummy terminals, while the other first outer dummy terminal 24 is accommodated between columns of the other ones 34, 34 of the second outer dummy terminals.