摘要:
A reflection-type light emitting apparatus has an excellent heat radiation property and allows the use of a high-power light emitting element, the minimization of a reduction in radiation efficiency of reflected light, and the focused radiation of high-output light at high efficiency. The apparatus has: a case 10 of metallic material and with an excellent heat radiation property; a reflection mirror section 11 formed fitted to the lower portion of case 10; a transparent plate 12 to cover the upper surface of case 10; heat radiation plates 13, 14 of metallic material with excellent heat conductivity and inserted inside the case 10; an LED element 2 mounted on the heat radiation plate 13; lead sections 15A, 15B fixed through an insulating layer 15a to the heat radiation plate 13 to serve as a power supply member to supply power to the LED element 2; and a spacer 16 of an insulating material to insulate the lead sections 15A, 15B from the case 10.
摘要:
A reflection-type light emitting apparatus has an excellent heat radiation property and allows the use of a high-power light emitting element, the minimization of a reduction in radiation efficiency of reflected light, and the focused radiation of high-output light at high efficiency. The apparatus has: a case 10 of metallic material and with an excellent heat radiation property; a reflection mirror section 11 formed fitted to the lower portion of case 10; a transparent plate 12 to cover the upper surface of case 10; heat radiation plates 13, 14 of metallic material with excellent heat conductivity and inserted inside the case 10; an LED element 2 mounted on the heat radiation plate 13; lead sections 15A, 15B fixed through an insulating layer 15a to the heat radiation plate 13 to serve as a power supply member to supply power to the LED element 2; and a spacer 16 of an insulating material to insulate the lead sections 15A, 15B from the case 10.
摘要:
A light emitting device has a light emitting element portion that radiates light with a predetermined wavelength, and a wavelength conversion portion that surrounds a phosphor to be excited by the light with the predetermined wavelength with a transparent and non-moisture permeability material in the form of laminae. Further, a light emitting device has a plurality of LED elements disposed on a same plane, and a wavelength conversion portion that comprises a flat transparent base member that is disposed opposite to the plurality of LED elements and a phosphor layer that is of a phosphor to be excited by light emitted from the LED element and is formed like a film on the base member. The phosphor layer includes part with no phosphor in plane.
摘要:
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.
摘要:
A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.
摘要翻译:固体元件装置包括固体元件,用于从固体元件接收电力并向其提供电力的电力接收和供应部件,以及用于密封固体元件的无机密封材料。 无机密封材料包括选自SiO 2-Nb 2 O 5系,B 2 O 3 -F系,P 2 O 5 -F系,P 2 O 5·ZnO系,SiO2-B2O3-La2O3系,SiO2-B2O3系低 熔化眼镜。
摘要:
An LED lighting apparatus has a plurality of reflection-type LED lamps. The lamps each have an LED, a reflector portion to reflect a light emitted from the LED, and a case portion having a radiation fin that is formed along a vertical section of the case portion to pass through a center of the case portion. The LED is mounted on an end of the radiation fin.
摘要:
A light emitting element has: a semiconductor layer having a light-emitting layer; a first electrode; a second electrode; an insulation layer that is formed on a mounting face side of the semiconductor layer; and a first terminal and a second terminal that are formed on a surface of the insulation layer corresponding to the first electrode and the second electrode, respectively. The first electrode and the second electrode are formed on the mounting face side of the semiconductor layer. The insulation layer has a first opening and a second opening, and the first electrode and the second electrode are electrically connected through the first hole and the second hole, respectively, to the first terminal and the second terminal.
摘要:
A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.
摘要翻译:一种固体元件器件的制造方法,其特征在于,提供具有GaN基LED元件(2)的含有玻璃的Al 2 O 3衬底(3),设置与所述衬底平行的P2O5-ZnO系低熔点玻璃,以及 在氮气气氛下,在60kgf的压力下进行在415℃以上的温度下的加压。 在这些条件下,低熔点玻璃的粘度为109泊,并且通过形成在含玻璃Al 2 O 3衬底(3)的表面上的氧化物粘合。 通过上述方法制造的固体元件装置可以通过在低温下工作的玻璃密封来制造,并且还具有高度可靠的密封结构。
摘要:
A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.
摘要翻译:一种固体元件器件的制造方法,其特征在于,提供具有GaN基LED元件(2)的含有玻璃的Al 2 O 3 N 3衬底(3) 设置与基板平行的P sub> 2 sub> 5 sub> 5 sub> 5 sub> 5 sub> 5 sub> 在氮气气氛中压力为60kgf。 在这些条件下,低熔点玻璃的粘度为10泊,并通过形成在含玻璃Al 2 O 2的表面上的氧化物粘合, (3)。 通过上述方法制造的固体元件装置可以通过在低温下工作的玻璃密封来制造,并且还具有高度可靠的密封结构。
摘要:
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.