公开(公告)号：US5288237A

公开(公告)日：1994-02-22

申请号：US979005

申请日：1992-11-19

申请人： Yoshitaka Mizutani ,  Shigeo Onoda ,  Hajime Maeda

发明人： Yoshitaka Mizutani ,  Shigeo Onoda ,  Hajime Maeda

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01R12/71 ,  H01R4/58

CPC分类号： G06K19/07743

摘要： A connector-supporting element of a main frame of an IC card and a sub-frame receive holding parts of a connector. The connector-supporting element has barriers having a height of at least one-half that of the holding parts for receiving the barriers and a force applied in the direction along bonded surfaces of the connector-supporting element and the sub-frame. Oblique surfaces are respectively provided on each of the barriers and there is a positional deviation in the parts.

摘要翻译： IC卡的主框架和子框架的连接器支撑元件接收连接器的保持部件。 连接器支撑元件具有高度为用于容纳障碍物的保持部分的高度的至少一半的阻挡层以及沿着连接器支撑元件和子框架的接合表面的方向施加的力。 在每个挡板上分别设置倾斜表面，并且部件中存在位置偏差。

公开(公告)号：US5173841A

公开(公告)日：1992-12-22

申请号：US674167

申请日：1991-03-25

申请人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

发明人： Takeshi Uenaka ,  Jun Ohbuchi ,  Hajime Maeda ,  Toru Tachikawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  B42D15/00 ,  G06K19/077 ,  H05K5/02 ,  H05K7/14

CPC分类号： H05K7/1417 ,  H05K5/0256 ,  Y10S439/946

摘要： A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.

摘要翻译： 半导体器件卡和制造该卡的方法。 框架包括一个整体间隔件，其填充电路板上的死空间，以消除将电路板上的死空间中的单独间隔件定位并且用隔离片等固定隔离件的需要。 在将用于填充电路板上的死空间的间隔物接合到相应面板的半导体器件卡中，在与正面或反面板接合的间隔物的表面上形成凹部，以减少在面板表面中发生的起伏 。

公开(公告)号：US5047894A

公开(公告)日：1991-09-10

申请号：US514933

申请日：1990-04-26

申请人： Shigeo Onoda ,  Hajime Maeda

发明人： Shigeo Onoda ,  Hajime Maeda

IPC分类号： G06K19/077

CPC分类号： G06K19/07743

摘要： An IC card having a shutter, in which the right and left sides of the shutter are bent to form L-shaped flanges enclosing the sides of an electrode terminal board, the shutter sliding over the electrode terminal board.

公开(公告)号：US5327010A

公开(公告)日：1994-07-05

申请号：US553459

申请日：1990-07-17

申请人： Takeshi Uenaka ,  Jun Ohbuchi ,  Shigeo Onoda ,  Makoto Omori ,  Hajime Maeda ,  Toru Tachikawa

发明人： Takeshi Uenaka ,  Jun Ohbuchi ,  Shigeo Onoda ,  Makoto Omori ,  Hajime Maeda ,  Toru Tachikawa

IPC分类号： G06K19/077 ,  H01L23/538 ,  H01L25/10 ,  H05K3/28 ,  H01L23/02 ,  G06K19/00 ,  H01L23/12

CPC分类号： H05K3/284 ,  G06K19/07745 ,  H01L23/5388 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/1627 ,  H01L2924/3511

摘要： An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

摘要翻译： IC卡包括基板，安装在基板的至少一个主表面上的半导体器件和安装有安装有半导体器件的基板的壳体。 壳体包括框架和通过粘合剂层在框架的相对侧上结合到框架的面板。 防止半导体器件在面向半导体器件的粘合剂层上的位置处经由粘合剂层粘合到面板上。

公开(公告)号：US5299940A

公开(公告)日：1994-04-05

申请号：US913042

申请日：1992-07-14

申请人： Takeshi Uenaka ,  Hajime Maeda ,  Yasumori Ikeda ,  Toru Tachikawa ,  Shigeo Onoda

发明人： Takeshi Uenaka ,  Hajime Maeda ,  Yasumori Ikeda ,  Toru Tachikawa ,  Shigeo Onoda

IPC分类号： G06K19/077 ,  H05K5/02 ,  H01R7/10

CPC分类号： H05K5/0269 ,  G06K19/077

摘要： An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.

摘要翻译： 公开了不会变形的IC卡，因此保持其质量可靠性。 提供了一个框架来容纳安装IC的基板。 用于保护IC的面板通过第一粘合材料层固定在框架上。 连接器设置在面板之间与基板接触。 连接器通过第二粘合材料层固定到框架。 这就禁止在将IC卡插入和从外部设备插入和拆卸时作用在连接器上的外力作用在第一粘合材料层上。 因此，IC卡的插入和拆卸不会导致面板和框架之间的粘附性降低。 因此，防止了由于外力引起的IC的变形，从而更好地保持了IC卡的质量可靠性。

公开(公告)号：US5926374A

公开(公告)日：1999-07-20

申请号：US61869

申请日：1998-04-17

申请人： Shigeo Onoda ,  Tomomi Morii ,  Kiyotaka Nishino

发明人： Shigeo Onoda ,  Tomomi Morii ,  Kiyotaka Nishino

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14 ,  B65D85/86

CPC分类号： H05K5/0269

摘要： There is provided an IC card where a pair of, upper and lower metal panels are respectively fixed to the frame; edge portions of the metal panel are provided with bend portions; grooves each of which comprises a pair of uneven vertical walls having a plurality of depressions and projections extending in the direction of the width of the frame are provided on the top and bottom surfaces of the frame; the distance between the projections on both the uneven vertical walls in the direction of the width of the frame is set so as to be smaller than the thickness of the bend portions by a given amount; and the metal panel is fixed to the frame with the bend portions press-fitted into the grooves along the projections. The IC card is advantageous in the manufacturing cost and is capable of stably providing a fixing force sufficient to withstand a long-term use, with regard to the fixation of upper and lower panel members to a frame.

摘要翻译： 提供了一个IC卡，其中一对上，下金属板分别固定在框架上; 金属面板的边缘部分设有弯曲部分; 在框架的顶表面和底表面上设置有包括一对不平坦的垂直壁，其具有在框架的宽度方向上延伸的多个凹陷和突起; 将两个不平坦的垂直壁上的凸起在框架的宽度方向上的距离设定为小于弯曲部分的厚度一定量; 并且金属板固定到框架上，其中弯曲部分沿着凸起压配合到凹槽中。 IC卡在制造成本方面是有利的，并且能够稳定地提供足以承受长期使用的固定力，关于将上板和下板构件固定到框架上。

公开(公告)号：US5578868A

公开(公告)日：1996-11-26

申请号：US449431

申请日：1995-05-24

申请人： Jun Obuchi ,  Hiroshi Miura ,  Tomomi Morii ,  Shigeo Onoda

发明人： Jun Obuchi ,  Hiroshi Miura ,  Tomomi Morii ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/538 ,  H01L23/02

CPC分类号： H01L23/5388 ,  G06K19/077 ,  H01L2924/0002

摘要： An IC memory card has a connector that cannot warp during the manufacturing process even if the connector is long, such as a connector at one longer side of the IC memory card with an increased number of poles. The IC memory card has grooves in the surfaces of a flange portion of the connector body opposing a surface with which the connection with an external unit is established, the grooves being adjacent the connector body and extending lengthwise along all of the longer side of the IC memory card for preventing warping.

摘要翻译： IC存储卡具有在制造过程中即使连接器较长也不会翘曲的连接器，例如具有增加的极数的IC存储卡的一个较长侧的连接器。 IC存储卡在连接器主体的凸缘部分的与形成与外部单元的连接的表面相对的表面中具有凹槽，凹槽与连接器主体相邻并且沿IC的所有长边沿纵向延伸 用于防止翘曲的存储卡。

公开(公告)号：US4905124A

公开(公告)日：1990-02-27

申请号：US174955

申请日：1988-03-29

申请人： Toshinobu Banjo ,  Shigeo Onoda ,  Makoto Omori

发明人： Toshinobu Banjo ,  Shigeo Onoda ,  Makoto Omori

IPC分类号： B42D15/10 ,  G06K19/077 ,  G11C5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC分类号： H05K1/117 ,  G06K19/07743 ,  H05K1/141 ,  H05K2201/049 ,  H05K3/368

摘要： An IC card having a circuit board provided with wiring formed on at least one of two surfaces of the circuit board, a terminal base fixed to one surface of a front portion of the circuit board and having a multiplicity of electrode terminals disposed on its upper surface, a plurality of electronic parts mounted on the two surfaces of the circuit board, and a package in which the circuit board on which the electronic parts are mounted is incorporated while exposing the electrode terminals to the outside of the package.

摘要翻译： 一种IC卡，其具有电路板，该电路板设置有形成在所述电路板的两个表面中的至少一个表面上的布线，固定在所述电路板的前部的一个表面上并具有多个电极端子的端子基座， ，安装在电路板的两个表面上的多个电子部件和其中安装有电子部件的电路板的封装，同时将电极端子暴露于封装的外部。

公开(公告)号：US4890197A

公开(公告)日：1989-12-26

申请号：US175212

申请日：1988-03-30

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/077 ,  G11C5/00 ,  H05K5/02

CPC分类号： H05K5/0269 ,  G06K19/077

摘要： A memory card comprises a plastic outer package which houses a semiconductor device and an electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. At least one of the connecting surface of each pair of adjoining package sections has an overflow groove for bonding agent formed therein which prevents the bonding agent from being forced to the outside of the outer package when the package sections are bonded together.

摘要翻译： 存储卡包括容纳半导体器件和电连接器的塑料外包装。 外包装包括多个包装部分，这些包装部分彼此堆叠并且沿着形成在包装部分的外周上的连接表面粘合在一起。 每对相邻包装部分的连接表面中的至少一个具有用于在其中形成的粘合剂的溢流槽，当封装部分结合在一起时，防止粘合剂被迫到外部包装的外部。

公开(公告)号：US5719746A

公开(公告)日：1998-02-17

申请号：US587928

申请日：1996-01-17

申请人： Jun Ohbuchi ,  Shigeo Onoda ,  Katsunori Ochi ,  Makoto Omori ,  Tetsuro Washida ,  Kiyotaka Nishino

发明人： Jun Ohbuchi ,  Shigeo Onoda ,  Katsunori Ochi ,  Makoto Omori ,  Tetsuro Washida ,  Kiyotaka Nishino

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14

CPC分类号： H05K5/026 ,  G06K19/07745 ,  H01L2924/0002

摘要： An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used. In a still different way, all the space inside the IC card is filled, or a sufficient amount of an adhesive is filled in a space between the two panels around a peripheral thereof. In a further way, the panels are adhered in a thermostat. In a still further way, the panels are adhered with melting at a peripheral thereof.

摘要翻译： IC卡包括具有电路的模块和彼此粘附的两个面板以覆盖它们之间的模块。 两个面板用粘合剂粘附，具有足够的粘附强度，并将模块没有空气通道密封到IC卡的外部。 IC卡的密封密封以各种方式实现。 例如，具有变化的宽度的凹槽设置在用于施加粘合剂的一个面板中，而在另一个面板中设置与凹槽接合的凹槽。 当两个板彼此粘合时，可以在槽中形成具有较窄宽度的部分的气体通道，而具有较宽宽度的部分中的沟槽中的粘合剂由于粘度而填充气体通道。 另一方面，设置在一个面板中的突起具有与设置在另一个面板中的凹槽相对的边缘。 因此，凹槽保持气密。 以不同的方式，使用在固化温度下具有高粘度的粘合剂。 以不同的方式，填充IC卡内的所有空间，或者在两个面板周围的周围的空间中填充足够量的粘合剂。 另一方面，面板被粘附在恒温器中。 在另一方面，面板在其周边处熔化粘附。