Integrated circuit capacitor
    6.
    发明授权

    公开(公告)号:US06653676B2

    公开(公告)日:2003-11-25

    申请号:US09918228

    申请日:2001-07-30

    IPC分类号: H01L27108

    摘要: The present invention discloses a novel integrated circuit capacitor and a method of forming such a capacitor. The capacitor formation begins with a base electrode 18 adjacent an insulating region 26. This base electrode 18 can comprise either polysilicon or a metal. A layer 28 of a first material, such as a siliciding metal, is formed over the base electrode 18 as well as the adjacent insulating region. A self-aligned capacitor electrode 12 can then be formed by reacting the first material 28 with the base electrode 18 and removing unreacted portions of the first material 28 from the insulating region 26. The capacitor is then completed by forming a dielectric layer 16 over the self-aligned capacitor electrode 12 and a second capacitor electrode 14 over the dielectric layer 16.

    Integrated circuit capacitor
    7.
    发明授权
    Integrated circuit capacitor 失效
    集成电路电容

    公开(公告)号:US06294420B1

    公开(公告)日:2001-09-25

    申请号:US09014724

    申请日:1998-01-28

    IPC分类号: H01L218242

    摘要: The present invention discloses a novel integrated circuit capacitor and a method of forming such a capacitor. The capacitor formation begins with a base electrode 18 adjacent an insulating region 26. This base electrode 18 can comprise either polysilicon or a metal. A layer 28 of a first material, such as a siliciding metal, is formed over the base electrode 18 as well as the adjacent insulating region. A self-aligned capacitor electrode 12 can then be formed by reacting the first material 28 with the base electrode 18 and removing unreacted portions of the first material 28 from the insulating region 26. The capacitor is then completed by forming a dielectric layer 16 over the self-aligned capacitor electrode 12 and a second capacitor electrode 14 over the dielectric layer 16.

    摘要翻译: 本发明公开了一种新颖的集成电路电容器及其形成方法。 电容器形成从邻近绝缘区域26的基极18开始。该基极18可以包括多晶硅或金属。 诸如硅化金属的第一材料的层28形成在基极电极18上以及相邻的绝缘区域上。 然后可以通过使第一材料28与基底电极18反应并从绝缘区域26去除第一材料28的未反应部分来形成自对准电容器电极12.然后通过在电容器电极12上形成介电层16来完成电容器 自对准电容器电极12和在电介质层16上的第二电容器电极14。

    Method of manufacturing semiconductor device
    8.
    发明授权
    Method of manufacturing semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US07071071B2

    公开(公告)日:2006-07-04

    申请号:US10801003

    申请日:2004-03-16

    IPC分类号: H01L21/8242

    CPC分类号: H01L28/91 H01L27/10852

    摘要: A lower electrode of a capacitor element is formed by manufacturing a crown structure while using a first conducting material such as titanium nitride or the like excellent in mechanical strength as a base material and by forming a film of a second conducting material such as ruthenium or the like, which is comparatively difficult to be oxidized, on a surface of the crown structure. First, ruthenium is deposited on a surface of the crown structure by using a sputtering method. Thereafter, the ruthenium (sputtered ruthenium) placed in a peripheral region of the crown structure is removed by etching, and a film of ruthenium is further formed on a surface of the crown structure by using a CVD method while using the sputtered ruthenium as a seed layer.

    摘要翻译: 电容器元件的下电极通过在使用作为基材的机械强度优异的第一导电材料(例如氮化钛等)并通过形成第二导电材料如钌或者 在冠状结构的表面上相当难以被氧化。 首先,使用溅射法将钌沉积在表冠结构的表面上。 此后,通过蚀刻去除放置在冠结构的周边区域中的钌(溅射钌),并且使用溅射钌作为种子,通过使用CVD法在冠结构的表面上进一步形成钌膜 层。

    Semiconductor device having a stacked capacitor
    9.
    发明申请
    Semiconductor device having a stacked capacitor 审中-公开
    具有层叠电容器的半导体装置

    公开(公告)号:US20060086961A1

    公开(公告)日:2006-04-27

    申请号:US11253628

    申请日:2005-10-20

    IPC分类号: H01L27/108

    摘要: A capacitor formed in a deep-hole has a bottom electrode, a capacitor insulator film and a top electrode. The bottom electrode includes a sidewall conductive film formed on the sidewall of a top portion of the deep-hole, and an inner conductive film formed on the sidewall conductive film and the sidewall and bottom of the through-hole. The inner conductive film is in contact with the underlying contact plug.

    摘要翻译: 形成在深孔中的电容器具有底部电极,电容器绝缘膜和顶部电极。 底部电极包括形成在深孔顶部的侧壁上的侧壁导电膜和形成在侧壁导电膜上的内部导电膜以及通孔的侧壁和底部。 内部导电膜与下面的接触插塞接触。