公开(公告)号：US09049794B2

公开(公告)日：2015-06-02

申请号：US13075865

申请日：2011-03-30

申请人： Yoshihiro Morita ,  Takahiro Ooi ,  Tetsuro Yamada ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama

发明人： Yoshihiro Morita ,  Takahiro Ooi ,  Tetsuro Yamada ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama

IPC分类号： H05K1/09 ,  H05K7/00 ,  H05K1/03 ,  D03D15/00 ,  H05K1/02

CPC分类号： H05K1/0366 ,  D03D1/0088 ,  D03D15/0011 ,  D03D15/0088 ,  D10B2401/18 ,  D10B2505/02 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0248 ,  H05K2201/029 ,  H05K2201/091 ,  H05K2203/0195 ,  Y10T29/49124

摘要： A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

摘要翻译： 布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线 在绝缘层上。 第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。

公开(公告)号：US08648260B2

公开(公告)日：2014-02-11

申请号：US13075838

申请日：2011-03-30

申请人： Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Tetsuro Yamada ,  Mitsuhiko Sugane ,  Takahide Mukoyama

发明人： Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Tetsuro Yamada ,  Mitsuhiko Sugane ,  Takahide Mukoyama

IPC分类号： H05K1/09 ,  H05K7/00 ,  H05K1/03

CPC分类号： H05K1/0248 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0269 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09272 ,  H05K2203/166 ,  H05K2203/167

摘要： A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

摘要翻译： 布线基板包括差分布线; 与所述差分布线的一侧相邻的第一绝缘层，包括平行于所述差分布线的第一光纤束; 与所述差分布线的另一侧相邻的第二绝缘层，包括与所述差分布线平行并且以与所述第一纤维束相同的间距设置的第二纤维束; 在所述第一绝缘层上的与所述差分布线相反的一侧的第三绝缘层，包括与所述差分布线平行的第三纤维束; 以及在所述第二绝缘层上的与所述差分布线相反的一侧的第四绝缘层，包括与所述差分布线平行的第四纤维束。 第三和第四纤维束的间隔分别比第一和第二纤维束的间隔窄。 差分布线设置在相邻的第一纤维束之间以及相邻的第二纤维束之间。

公开(公告)号：US08513537B2

公开(公告)日：2013-08-20

申请号：US12859829

申请日：2010-08-20

申请人： Takahiro Ooi ,  Tetsuro Yamada ,  Yoshihiro Morita ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukouyama

发明人： Takahiro Ooi ,  Tetsuro Yamada ,  Yoshihiro Morita ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukouyama

IPC分类号： H05K1/11

CPC分类号： H05K1/025 ,  H05K1/024 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/029

摘要： A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

摘要翻译： 印刷电路板包括具有平坦表面的绝缘体，并且包括绝缘布，其包括第一纤维和第二纤维，所述第一纤维和第二纤维在平坦表面上与第一纤维成直角交叉;以及印刷布线，包括彼此平行延伸的多条信号线 并且布置在绝缘体的平坦表面上，使得信号线的方向以基于绝缘体的板切割效率确定的角度和预定的绝缘体的角度倾斜到第一或第二纤维的方向 信号线之间的延迟时间差。

公开(公告)号：US08631568B2

公开(公告)日：2014-01-21

申请号：US13046076

申请日：2011-03-11

申请人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

发明人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

IPC分类号： H05K3/02

CPC分类号： H05K1/0245 ,  H05K1/0248 ,  H05K1/0269 ,  H05K1/0366 ,  H05K3/4638 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/0969 ,  H05K2203/167

摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

摘要翻译： 一种印刷线路板的制造方法，其特征在于，以经纱和纬纱编织玻璃纤维布，使经纱和纬纱在至少一个区域上视觉区分。 玻璃纤维布被树脂浸渍以制造基材。 在基板的至少一个表面上形成铜箔以制造芯基板。 在芯基板上的区域内去除铜箔以形成开口。 检测出在经纱之间或介于纬纱之间的间距。 基于经纱之间或纬纱之间的间距来确定要被图案化的一对差动布线之间的间距。 根据所述一对差动配线之间的所确定的间距，在所述芯基板上图案化所述一对差分布线。

公开(公告)号：US08595926B2

公开(公告)日：2013-12-03

申请号：US13046076

申请日：2011-03-11

申请人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

发明人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

IPC分类号： H05K3/02

摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

公开(公告)号：US07755912B2

公开(公告)日：2010-07-13

申请号：US11882581

申请日：2007-08-02

申请人： Yoshihiro Morita

发明人： Yoshihiro Morita

IPC分类号： H05K1/11

CPC分类号： H05K1/0231 ,  H01L23/433 ,  H01L23/4338 ,  H01L2924/0002 ,  H01R13/2414 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10515 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

摘要： A printed circuit board unit includes a first board and a second board. First electrically-conductive terminals are fixed and exposed on the front surface of the first board in a matrix. Second electrically-conductive terminals are arranged in a matrix and supported on the front surface of the second board. The second electrically-conductive terminals have flexibility. Each of the second electrically-conductive terminals is disengageably brought in contact with the corresponding first electrically-conductive terminal. A static pressure member is received on the back surface of the first board within an area corresponding to the specific area to generate a static pressure. An urging plate is overlaid on the static pressure member so that the static pressure member is interposed between the urging plate and the first board. The urging plate exhibits an urging force applied to the first board toward the second board.

摘要翻译： 印刷电路板单元包括第一板和第二板。 第一导电端子以矩阵形式固定并暴露在第一板的前表面上。 第二导电端子布置成矩阵并且支撑在第二板的前表面上。 第二导电端子具有灵活性。 每个第二导电端子可分离地与相应的第一导电端子接触。 在与特定区域相对应的区域内，在第一板的后表面上容纳有静压部件，以产生静压。 推压板重叠在静压部件上，使得静压部件插入在推压板和第一板之间。 推压板向第二板呈现施加到第一板的施力。

公开(公告)号：US20090169842A1

公开(公告)日：2009-07-02

申请号：US12230330

申请日：2008-08-27

申请人： Yoshihiro Morita

发明人： Yoshihiro Morita

IPC分类号： B32B3/10

CPC分类号： H05K1/0248 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09236 ,  Y10T428/24917

摘要： A printed wiring board includes a body made of resin. Woven glass fiber yarns are impregnated in the resin of the body. An electrically-conductive wiring pattern is formed on the surface of the body. The wiring pattern extends in parallel with the glass fiber yarns. The width of the wiring pattern is set equal to or larger than the interval between the centerlines of the adjacent ones of the glass fiber yarns extending in parallel. The wiring pattern is reliably located in a region containing both the glass fiber and the resin. The proportion of the glass fiber to the resin is equalized on the wiring patterns. This results in a suppression of the influence resulting from a difference in the permittivity between the glass fiber and the resin on the wiring pattern. A variation of characteristic impedance is suppressed with such a simplified structure.

摘要翻译： 印刷电路板包括由树脂制成的本体。 机织玻璃纤维纱线浸渍在身体的树脂中。 在本体的表面上形成导电性布线图形。 布线图案与玻璃纤维纱线平行地延伸。 布线图案的宽度设定为等于或大于平行延伸的相邻玻璃纤维纱线的中心线之间的间隔。 布线图形可靠地位于包含玻璃纤维和树脂的区域中。 玻璃纤维对树脂的比例在布线图案上相等。 这导致抑制由布线图案上的玻璃纤维和树脂之间的介电常数差引起的影响。 通过这种简化的结构来抑制特性阻抗的变化。

公开(公告)号：US07133292B2

公开(公告)日：2006-11-07

申请号：US10762276

申请日：2004-01-23

申请人： Yoshinori Uzuka ,  Yoshihiro Morita ,  Koji Hanada ,  Hajime Murakami ,  Yasushi Masuda

发明人： Yoshinori Uzuka ,  Yoshihiro Morita ,  Koji Hanada ,  Hajime Murakami ,  Yasushi Masuda

IPC分类号： H05K7/00 ,  H05K1/14

CPC分类号： G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  G06F1/20 ,  H05K1/14 ,  H05K7/1444 ,  H05K7/1445

摘要： An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

公开(公告)号：US6023412A

公开(公告)日：2000-02-08

申请号：US263840

申请日：1999-03-08

申请人： Yoshihiro Morita

发明人： Yoshihiro Morita

IPC分类号： G06F1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K7/20

CPC分类号： G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  H01R12/737

摘要： A daughter-board cover of a system board device which daughter-board cover covers daughter boards can be removed by a simple operation in a short time. The system board device is adapted to be subjected to forced-air cooling. At least one electronic part generating heat is mounted on a motherboard. A plurality of daughter boards are removably mounted on the motherboard. The daughter boards are mounted so as to be perpendicular to the motherboard. A ventilation cover is attached to the motherboard so as to form an air passage therebetween so that the electronic part and the daughter boards are accommodated in the air passage. The ventilation cover includes the daughter-board cover covering the daughter boards. The daughter-board cover is displaceable so that each of the daughter boards are accessible.

摘要翻译： 可以在短时间内通过简单的操作去除子板盖子子板的系统板装置的子板盖。 系统板装置适于进行强制空气冷却。 至少一个产生热量的电子部件安装在主板上。 多个子板可拆卸地安装在母板上。 子板安装成垂直于主板。 通风盖安装在母板上，以便在其间形成空气通道，使得电子部件和子板容纳在空气通道中。 通风盖包括覆盖子板的子板盖。 子板盖可移位，以便每个子板都可以访问。

公开(公告)号：US07919856B2

公开(公告)日：2011-04-05

申请号：US11838431

申请日：2007-08-14

申请人： Yoshihiro Morita

发明人： Yoshihiro Morita

IPC分类号： H01L23/34

CPC分类号： H05K1/0271 ,  H01L23/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K3/0061 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2201/2009

摘要： A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

摘要翻译： 一种封装板模块，其中诸如LSI的半导体芯片安装在封装板的顶侧表面上，以及封装安装模块，其中封装板安装在大型计算机等的主板上。 用于支撑包装板的加强件和/或用于支撑母板的加强件各自具有双金属结构，其中具有相互不同的热膨胀系数的第一构件和第二构件分别彼此粘合，以便使加强件翘曲 与由温度变化引起的封装板和母板的翘曲一致，从而防止在焊接部分中产生应力。