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14 条记录 (耗时 0.036 秒)

    Optical device
    1.
    发明授权
    Optical device 有权
    光学装置

    公开(公告)号：US08515219B2

    公开(公告)日：2013-08-20

    申请号：US13108133

    申请日：2011-05-16

    申请人： Yosuke Abe ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

    发明人： Yosuke Abe ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

    IPC分类号： G02B6/12

    CPC分类号： H01S5/02248 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/377 ,  G02F2001/3546 ,  H01S5/0092

    摘要： In an optical device 1 in which a wavelength converting element 20 is disposed as an optical element on a silicon substrate 10, configuration includes heaters 40a and 40b formed on the silicon substrate 10; and micro bumps 30a, 30b that are made of Au, that bond the silicon substrate 10 and the wavelength converting element 20, and that transfer the heat generated by the heaters 40a, 40b to the wavelength converting element 20.

    摘要翻译： 在其中将波长转换元件20作为光学元件设置在硅基板10上的光学装置1中，构造包括形成在硅基板10上的加热器40a和40b; 以及由Au制成的微凸块30a，30b，其接合硅衬底10和波长转换元件20，并将由加热器40a，40b产生的热量传递到波长转换元件20。

    OPTICAL DEVICE
    2.
    发明申请
    OPTICAL DEVICE 有权
    光学装置

    公开(公告)号：US20110280512A1

    公开(公告)日：2011-11-17

    申请号：US13108133

    申请日：2011-05-16

    申请人： Yosuke ABE ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

    发明人： Yosuke ABE ,  Masafumi Ide ,  Toru Takizawa ,  Takaaki Nozaki

    IPC分类号： G02B6/12

    CPC分类号： H01S5/02248 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/377 ,  G02F2001/3546 ,  H01S5/0092

    摘要： In an optical device 1 in which a wavelength converting element 20 is disposed as an optical element on a silicon substrate 10, configuration includes heaters 40a and 40b formed on the silicon substrate 10; and micro bumps 30a, 30b that are made of Au, that bond the silicon substrate 10 and the wavelength converting element 20, and that transfer the heat generated by the heaters 40a, 40b to the wavelength converting element 20.

    摘要翻译： 在其中将波长转换元件20作为光学元件设置在硅基板10上的光学装置1中，构造包括形成在硅基板10上的加热器40a和40b; 以及由Au制成的微凸块30a，30b，其接合硅衬底10和波长转换元件20，并将由加热器40a，40b产生的热量传递到波长转换元件20。

    OPTICAL DEVICE
    3.
    发明申请
    OPTICAL DEVICE 失效
    光学装置

    公开(公告)号：US20120243825A1

    公开(公告)日：2012-09-27

    申请号：US13511830

    申请日：2010-11-24

    申请人： Toru Takizawa ,  Takaaki Nozaki ,  Yosuke Abe

    发明人： Toru Takizawa ,  Takaaki Nozaki ,  Yosuke Abe

    IPC分类号： G02F1/365 ,  G02B6/12

    CPC分类号： G02F1/3775 ,  G02B6/4272 ,  G02F1/3501 ,  G02F2001/3505 ,  G02F2201/02 ,  G02F2201/12 ,  G02F2201/307 ,  G02F2202/20 ,  G02F2202/28 ,  G02F2202/36 ,  G02F2203/60

    摘要： An optical device (20) are formed by bonding a optical element (6) having an optical waveguide (8) with a substrate (2). On a surface of the optical element (6) facing the substrate (2) formed are the optical waveguide (8) and a thin film heater (4) that heats the optical waveguide (8). The optical element (6) and the substrate (2) are bonded through a first bonding part (12) and a second bonding part (14) made of metal material. The thin film heater (4) is electrically connected with a wire on the substrate (2) through the first bonding part (12) and the second bonding part (14). In this way, additional wires for electrical connection can be omitted, the optical element 6 can be miniaturized removing a superfluous region, and the manufacturing process can be simplified.

    摘要翻译： 光学器件（20）通过将具有光波导（8）的光学元件（6）与衬底（2）结合而形成。 在形成有基板（2）的光学元件（6）的表面上形成有加热光波导（8）的光波导（8）和薄膜加热器（4）。 光学元件（6）和基板（2）通过第一接合部分（12）和由金属材料制成的第二接合部分（14）接合。 薄膜加热器（4）通过第一接合部（12）和第二接合部（14）与基板（2）上的导线电连接。 以这种方式，可以省略用于电连接的另外的电线，光学元件6可以小型化以去除多余的区域，并且可以简化制造过程。

    Optical device
    4.
    发明授权
    Optical device 失效
    光学装置

    公开(公告)号：US08666205B2

    公开(公告)日：2014-03-04

    申请号：US13511830

    申请日：2010-11-24

    申请人： Toru Takizawa ,  Takaaki Nozaki ,  Yosuke Abe

    发明人： Toru Takizawa ,  Takaaki Nozaki ,  Yosuke Abe

    IPC分类号： G02B6/12

    CPC分类号： G02F1/3775 ,  G02B6/4272 ,  G02F1/3501 ,  G02F2001/3505 ,  G02F2201/02 ,  G02F2201/12 ,  G02F2201/307 ,  G02F2202/20 ,  G02F2202/28 ,  G02F2202/36 ,  G02F2203/60

    摘要： An optical device (20) are formed by bonding a optical element (6) having an optical waveguide (8) with a substrate (2). On a surface of the optical element (6) facing the substrate (2) formed are the optical waveguide (8) and a thin film heater (4) that heats the optical waveguide (8). The optical element (6) and the substrate (2) are bonded through a first bonding part (12) and a second bonding part (14) made of metal material. The thin film heater (4) is electrically connected with a wire on the substrate (2) through the first bonding part (12) and the second bonding part (14). In this way, additional wires for electrical connection can be omitted, the optical element 6 can be miniaturized removing a superfluous region, and the manufacturing process can be simplified.

    摘要翻译： 光学器件（20）通过将具有光波导（8）的光学元件（6）与衬底（2）结合而形成。 在形成有基板（2）的光学元件（6）的表面上形成有加热光波导（8）的光波导（8）和薄膜加热器（4）。 光学元件（6）和基板（2）通过第一接合部分（12）和由金属材料制成的第二接合部分（14）接合。 薄膜加热器（4）通过第一接合部（12）和第二接合部（14）与基板（2）上的导线电连接。 以这种方式，可以省略用于电连接的另外的电线，光学元件6可以小型化以去除多余的区域，并且可以简化制造过程。

    LIGHT SOURCE DEVICE
    5.
    发明申请
    LIGHT SOURCE DEVICE 有权
    光源设备

    公开(公告)号：US20120068609A1

    公开(公告)日：2012-03-22

    申请号：US13305428

    申请日：2011-11-28

    申请人： Masafumi Ide ,  Toru Takizawa

    发明人： Masafumi Ide ,  Toru Takizawa

    IPC分类号： H05B37/02

    CPC分类号： G02B6/12007 ,  G02B6/12004 ,  G02B6/4215

    摘要： In a light source device for combining light waves with at least three wavelengths and outputting thus combined light waves, an optical system element and an electrical system element are formed on a semiconductor substrate, thereby eliminating the necessity of optical members such as an optical connector, and saving space to place the optical members as well as reducing arrangement spacing. In addition, the space necessary for wiring in an electrical circuit is reduced. Therefore, an integration degree of each of the elements, the optical system element and the electrical system element, is enhanced. The optical system element and the electrical system element are formed in layers on the same conductor substrate, thereby reducing the area that is required in configuring a parallel establishment of the optical system element and the electrical system element.

    摘要翻译： 在用于组合具有至少三个波长的光波并输出这样组合的光波的光源装置中，在半导体衬底上形成光学系统元件和电气系统元件，由此消除了诸如光学连接器等光学部件的需要， 并节省空间以放置光学构件以及减少布置间隔。 此外，减少了在电路中布线所需的空间。 因此，提高了各元件，光学系统元件和电气系统元件的集成度。 光学系统元件和电气系统元件以相同的导体衬底上的层形成，从而减少了在配置光学系统元件和电气系统元件的并行建立所需的面积。

    Light source device
    8.
    发明授权
    Light source device 有权
    光源装置

    公开(公告)号：US08704447B2

    公开(公告)日：2014-04-22

    申请号：US13305428

    申请日：2011-11-28

    申请人： Masafumi Ide ,  Toru Takizawa

    发明人： Masafumi Ide ,  Toru Takizawa

    IPC分类号： H05B37/02

    CPC分类号： G02B6/12007 ,  G02B6/12004 ,  G02B6/4215

    摘要： In a light source device for combining light waves with at least three wavelengths and outputting thus combined light waves, an optical system element and an electrical system element are formed on a semiconductor substrate, thereby eliminating the necessity of optical members such as an optical connector, and saving space to place the optical members as well as reducing arrangement spacing. In addition, the space necessary for wiring in an electrical circuit is reduced. Therefore, an integration degree of each of the elements, the optical system element and the electrical system element, is enhanced. The optical system element and the electrical system element are formed in layers on the same conductor substrate, thereby reducing the area that is required in configuring a parallel establishment of the optical system element and the electrical system element.

    摘要翻译： 在用于组合具有至少三个波长的光波并输出这样组合的光波的光源装置中，在半导体衬底上形成光学系统元件和电气系统元件，由此消除了诸如光学连接器等光学部件的需要， 并节省空间以放置光学构件以及减少布置间隔。 此外，减少了在电路中布线所需的空间。 因此，提高了各元件，光学系统元件和电气系统元件的集成度。 光学系统元件和电气系统元件以相同的导体衬底上的层形成，从而减少了在配置光学系统元件和电气系统元件的并行建立所需的面积。

    Electromechanical transducer and method of fabricating the same
    9.
    发明授权
    Electromechanical transducer and method of fabricating the same 失效
    机电换能器及其制造方法

    公开(公告)号：US07461559B2

    公开(公告)日：2008-12-09

    申请号：US11376435

    申请日：2006-03-16

    申请人： Toru Takizawa

    发明人： Toru Takizawa

    IPC分类号： G01B7/16

    CPC分类号： G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084

    摘要： A weight part (12) is supported by a beam part (26) in a slim piece shape supported by a frame-shaped support part (10), and the beam part (26) is provided with a piezoresistance element (20) as a transducing element that transduces a mechanical variation to an electrical variation, so that a mechanical variation of the weight part (12) is transmitted to the piezoresistance element (20) via the beam part (26). Then, the beam part (26) is constructed by stacking the silicon nitride film (16) and a resin film (18) such as a polyimide film.

    摘要翻译： 重物部分（12）由梁部分（26）以由框状支撑部分（10）支撑的细长形状支撑，并且梁部分（26）设置有压电元件（20）作为 转换元件，其将机械变化转换成电变化，使得重量部件（12）的机械变化通过梁部分（26）传递到压阻元件（20）。 然后，通过层叠氮化硅膜（16）和聚酰亚胺膜等树脂膜（18）构成光束部（26）。

    Optical module
    10.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号：US08920047B2

    公开(公告)日：2014-12-30

    申请号：US13554524

    申请日：2012-07-20

    申请人： Toru Takizawa ,  Kaoru Yoda

    发明人： Toru Takizawa ,  Kaoru Yoda

    IPC分类号： G02B6/36 ,  G02B6/42 ,  H01S5/022 ,  G02B6/26 ,  G02B6/12 ,  G02F1/35

    CPC分类号： G02B6/4233 ,  G02B6/262 ,  G02B6/3652 ,  G02B6/4224 ,  G02B6/4225 ,  G02B6/4232 ,  G02B6/4243 ,  G02B2006/12147 ,  G02F2001/3505 ,  H01S5/0092 ,  H01S5/022 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/4012 ,  H01S5/4093

    摘要： On a mounting substrate 101, an LD element 102 and a wavelength converter element 103 are mounted as optical elements. An end of an optical fiber 105 is fixed, at a given length, in a fiber anchoring groove 301 of a sub-substrate 104. The sub-substrate 104 is mounted to the mounting substrate 101 with the surface supporting the optical fiber 105 opposing thereto, and the wavelength converter element 103 and the optical fiber 105 being coupled. By mounting of the sub-substrate 104 to the mounting substrate 101, the coupling position of the output end of the wavelength converter element 103 and the input end of the optical fiber 105 is provided an internal position that is a given distance from the end of mounting substrate 101.

    摘要翻译： 在安装基板101上安装LD元件102和波长转换元件103作为光学元件。 光纤105的端部以给定的长度固定在子基板104的光纤固定槽301中。子基板104被安装到安装基板101，表面支撑与其相对的光纤105 ，波长转换元件103和光纤105耦合。 通过将辅助基板104安装到安装基板101上，波长转换元件103的输出端和光纤105的输入端的耦合位置设置有内部位置，该位置距离 安装基板101。