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    Method of manufacturing a hemisperical grain silicon layer and method of manufacturing a semiconductor device using the same
    1.
    发明申请
    Method of manufacturing a hemisperical grain silicon layer and method of manufacturing a semiconductor device using the same 审中-公开
    制造半晶粒硅层的方法及使用其制造半导体器件的方法

    公开(公告)号：US20060160337A1

    公开(公告)日：2006-07-20

    申请号：US11323999

    申请日：2005-12-29

    申请人： Young-Jin Kim ,  Hyeon-Deok Lee ,  Seok-Woo Nam ,  Yong-Jae Lee ,  Hyun-Seok Lim ,  Wan-Goo Hwang ,  Jin-Il Lee ,  Jung-Hwan Oh

    发明人： Young-Jin Kim ,  Hyeon-Deok Lee ,  Seok-Woo Nam ,  Yong-Jae Lee ,  Hyun-Seok Lim ,  Wan-Goo Hwang ,  Jin-Il Lee ,  Jung-Hwan Oh

    IPC分类号： H01L21/20 ,  H01L21/36

    CPC分类号： H01L28/84 ,  H01L27/10817 ,  H01L27/10852 ,  H01L28/91

    摘要： In a method of manufacturing a capacitor including a hemispherical grain (HSG) silicon layer, after forming a storage electrode electrically coupled to a contact region of a substrate, the HSG silicon layer is formed on the storage electrode by providing a first gas including silicon and a second gas onto a surface of the storage electrode with a volume ratio of about 1.0:0.1 to about 1.0:5.0. A dielectric layer and a plate electrode are sequentially formed on the HSG silicon layer. A grain size of the HSG silicon layer may be easily adjusted and abnormal growths of the HSG at a lower portion of the storage electrode may be suppressed. Therefore, the HSG silicon layer may be uniformly formed on the storage electrode, and a structural stability of the storage electrode may be improved to prevent electrical defects of the capacitor.

    摘要翻译： 在制造包括半球形晶粒（HSG）硅层的电容器的方法中，在形成与基板的接触区域电耦合的存储电极之后，通过提供包括硅的第一气体和存储电极形成HSG硅层， 第二气体以约1.0:0.1至约1.0:5.0的体积比存储在存储电极的表面上。 在HSG硅层上依次形成电介质层和平板电极。 可以容易地调节HSG硅层的晶粒尺寸，并且可以抑制存储电极下部的HSG的异常生长。 因此，HSG硅层可以均匀地形成在存储电极上，并且可以改善存储电极的结构稳定性，以防止电容器的电缺陷。

    Methods and apparatus for forming a titanium nitride layer
    2.
    发明申请
    Methods and apparatus for forming a titanium nitride layer 审中-公开
    用于形成氮化钛层的方法和装置

    公开(公告)号：US20060110533A1

    公开(公告)日：2006-05-25

    申请号：US11281163

    申请日：2005-11-17

    申请人： Wan-Goo Hwang ,  Myeong-Jin Kim ,  Seung-Ki Chae ,  Hyun-Seok Lim ,  Kyoung-Ho Jang

    发明人： Wan-Goo Hwang ,  Myeong-Jin Kim ,  Seung-Ki Chae ,  Hyun-Seok Lim ,  Kyoung-Ho Jang

    IPC分类号： C23C16/00 ,  B05C11/00

    CPC分类号： H01L21/67109 ,  C23C16/34 ,  C23C16/45546 ,  H01L21/28556 ,  H01L21/67757

    摘要： A method of forming a titanium nitride layer by an atomic layer deposition process using a batch-type vertical reaction furnace is described wherein a first source gas including a titanium precursor is provided onto substrates loaded in a process chamber for a first time period; a first purge gas is introduced into the process chamber for a second time period shorter than the first time period; a second source gas including nitrogen is provided onto the substrates for a third time period substantially identical to the first time period; and, a second purge gas is introduced into the process chamber for a fourth time period substantially identical to the second time period. Titanium nitride layers having uniform thickness and good step coverage may thus be formed while realizing a greatly reduced manufacturing time.

    摘要翻译： 描述了通过使用间歇式立式反应炉的原子层沉积工艺形成氮化钛层的方法，其中包括钛前体的第一源气体在第一时间段内被装载到处理室中的基板上; 将第一吹扫气体引入处理室中比第一时间段短的第二时间段; 包括氮的第二源气体在基板上提供与第一时间段基本相同的第三时间段; 并且将第二吹扫气体与第二时间段基本相同的第四时间段引入到处理室中。 因此可以在实现大大缩短的制造时间的同时形成具有均匀厚度和良好阶梯覆盖的氮化钛层。

    STORAGE CAPACITORS FOR SEMICONDUCTOR DEVICES
    3.
    发明申请
    STORAGE CAPACITORS FOR SEMICONDUCTOR DEVICES 审中-公开
    半导体器件存储电容器

    公开(公告)号：US20080185624A1

    公开(公告)日：2008-08-07

    申请号：US12100042

    申请日：2008-04-09

    申请人： Rak-Hwan Kim ,  Young-Joo Cho ,  Sung-Tae Kim ,  In-Sun Park ,  Hyeon-Deok Lee ,  Hyun-Suk Lee ,  Jung-Hee Chung ,  Hyun-Young Kim ,  Hyun-Seok Lim

    发明人： Rak-Hwan Kim ,  Young-Joo Cho ,  Sung-Tae Kim ,  In-Sun Park ,  Hyeon-Deok Lee ,  Hyun-Suk Lee ,  Jung-Hee Chung ,  Hyun-Young Kim ,  Hyun-Seok Lim

    IPC分类号： H01L29/94

    CPC分类号： H01L28/91 ,  H01L27/10817 ,  H01L27/10852 ,  H01L28/75

    摘要： Methods of forming a storage capacitor include forming an interlayer insulation layer having an opening there through on a semiconductor substrate, forming a contact plug in the opening, forming a molding oxide layer on the interlayer insulation layer and the contact plug, selectively removing portions of the molding oxide layer to form a recess above the contact plug, forming a titanium layer on a bottom surface and side surfaces of the recess, forming a titanium nitride layer on the titanium layer, and forming a titanium oxide nitride layer on the titanium nitride layer. A storage capacitor includes a semiconductor substrate, an interlayer insulation layer having a contact plug therein on the substrate, and a storage electrode on the contact plug including a titanium silicide layer, a titanium nitride layer on the titanium silicide layer, and a titanium oxide nitride layer on the titanium nitride layer.

    摘要翻译： 形成存储电容器的方法包括在半导体衬底上形成具有开口的层间绝缘层，在开口中形成接触插塞，在层间绝缘层和接触插塞上形成模制氧化物层，选择性地去除部分 模制氧化物层以在接触塞上方形成凹陷，在凹陷的底表面和侧表面上形成钛层，在钛层上形成氮化钛层，并在氮化钛层上形成氮氧化钛层。 存储电容器包括半导体衬底，在衬底上具有接触插塞的层间绝缘层，以及包括钛硅化物层的接触插塞上的存储电极，硅化钛层上的氮化钛层和氧化钛氮化物 层在氮化钛层上。

    Storage capacitors for semiconductor devices and methods of forming the same
    4.
    发明申请
    Storage capacitors for semiconductor devices and methods of forming the same 有权
    用于半导体器件的存储电容器及其形成方法

    公开(公告)号：US20060099760A1

    公开(公告)日：2006-05-11

    申请号：US11266520

    申请日：2005-11-03

    申请人： Rak-Hwan Kim ,  Young-Joo Cho ,  Sung-Tae Kim ,  In-Sun Park ,  Hyeon-Deok Lee ,  Hyun-Suk Lee ,  Jung-Hee Chung ,  Hyun-Young Kim ,  Hyun-Seok Lim

    发明人： Rak-Hwan Kim ,  Young-Joo Cho ,  Sung-Tae Kim ,  In-Sun Park ,  Hyeon-Deok Lee ,  Hyun-Suk Lee ,  Jung-Hee Chung ,  Hyun-Young Kim ,  Hyun-Seok Lim

    IPC分类号： H01L21/8242

    CPC分类号： H01L28/91 ,  H01L27/10817 ,  H01L27/10852 ,  H01L28/75

    摘要： Methods of forming a storage capacitor include forming an interlayer insulation layer having an opening therethrough on a semiconductor substrate, forming a contact plug in the opening, forming a molding oxide layer on the interlayer insulation layer and the contact plug, selectively removing portions of the molding oxide layer to form a recess above the contact plug, forming a titanium layer on a bottom surface and side surfaces of the recess, forming a titanium nitride layer on the titanium layer, and forming a titanium oxide nitride layer on the titanium nitride layer. A storage capacitor includes a semiconductor substrate, an interlayer insulation layer having a contact plug therein on the substrate, and a storage electrode on the contact plug including a titanium silicide layer, a titanium nitride layer on the titanium silicide layer, and a titanium oxide nitride layer on the titanium nitride layer.

    摘要翻译： 形成存储电容器的方法包括在半导体衬底上形成具有开口的层间绝缘层，在开口中形成接触插塞，在层间绝缘层和接触插塞上形成模压氧化层，选择性地去除模制件的部分 在接触塞上方形成凹部，在凹部的底面和侧面形成钛层，在钛层上形成氮化钛层，在氮化钛层上形成氮化钛层。 存储电容器包括半导体衬底，在衬底上具有接触插塞的层间绝缘层，以及包括钛硅化物层的接触插塞上的存储电极，硅化钛层上的氮化钛层和氧化钛氮化物 层在氮化钛层上。

    Methods of forming storage capacitors for semiconductor devices
    7.
    发明授权
    Methods of forming storage capacitors for semiconductor devices 有权
    形成半导体器件的储存电容器的方法

    公开(公告)号：US07364967B2

    公开(公告)日：2008-04-29

    申请号：US11266520

    申请日：2005-11-03

    申请人： Rak-Hwan Kim ,  Young-Joo Cho ,  Sung-Tae Kim ,  In-Sun Park ,  Hyeon-Deok Lee ,  Hyun-Suk Lee ,  Jung-Hee Chung ,  Hyun-Young Kim ,  Hyun-Seok Lim

    发明人： Rak-Hwan Kim ,  Young-Joo Cho ,  Sung-Tae Kim ,  In-Sun Park ,  Hyeon-Deok Lee ,  Hyun-Suk Lee ,  Jung-Hee Chung ,  Hyun-Young Kim ,  Hyun-Seok Lim

    IPC分类号： H01L21/8242

    CPC分类号： H01L28/91 ,  H01L27/10817 ,  H01L27/10852 ,  H01L28/75

    摘要： Methods of forming a storage capacitor include forming an interlayer insulation layer having an opening therethrough on a semiconductor substrate, forming a contact plug in the opening, forming a molding oxide layer on the interlayer insulation layer and the contact plug, selectively removing portions of the molding oxide layer to form a recess above the contact plug, forming a titanium layer on a bottom surface and side surfaces of the recess, forming a titanium nitride layer on the titanium layer, and forming a titanium oxide nitride layer on the titanium nitride layer. A storage capacitor includes a semiconductor substrate, an interlayer insulation layer having a contact plug therein on the substrate, and a storage electrode on the contact plug including a titanium silicide layer, a titanium nitride layer on the titanium silicide layer, and a titanium oxide nitride layer on the titanium nitride layer.

    摘要翻译： 形成存储电容器的方法包括在半导体衬底上形成具有开口的层间绝缘层，在开口中形成接触插塞，在层间绝缘层和接触插塞上形成模压氧化层，选择性地去除模制件的部分 在接触塞上方形成凹部，在凹部的底面和侧面形成钛层，在钛层上形成氮化钛层，在氮化钛层上形成氮化钛层。 存储电容器包括半导体衬底，在衬底上具有接触插塞的层间绝缘层，以及包括钛硅化物层的接触插塞上的存储电极，硅化钛层上的氮化钛层和氧化钛氮化物 层在氮化钛层上。

    Capacitor for a semiconductor device and method of forming the same
    10.
    发明授权
    Capacitor for a semiconductor device and method of forming the same 有权
    用于半导体器件的电容器及其形成方法

    公开(公告)号：US07719045B2

    公开(公告)日：2010-05-18

    申请号：US12251352

    申请日：2008-10-14

    申请人： Young-Joo Cho ,  Hyun-Seok Lim ,  Rak-Hwan Kim ,  Jung-Wook Kim ,  Hyun-Suk Lee

    发明人： Young-Joo Cho ,  Hyun-Seok Lim ,  Rak-Hwan Kim ,  Jung-Wook Kim ,  Hyun-Suk Lee

    IPC分类号： H01L27/108

    CPC分类号： H01L28/90 ,  H01L27/0207 ,  H01L27/10852 ,  H01L28/75

    摘要： In a capacitor having a high dielectric constant, the capacitor includes a cylindrical lower electrode, a dielectric layer and an upper electrode. A metal oxide layer is formed on inner, top and outer surfaces of the lower electrode as the dielectric layer. A first sub-electrode is formed on a surface of the dielectric layer along the profile of the lower electrode and a second sub-electrode is continuously formed on the first sub-electrode corresponding to the top surface of the lower electrode, so an opening portion of the lower electrode is covered with the second sub-electrode. The first and second sub-electrodes include first and second metal nitride layers in which first and second stresses are applied, respectively. Directions of the first and second stresses are opposite to each other. Accordingly, cracking is minimized in the upper electrode with the high dielectric constant, thereby reducing current leakage.

    摘要翻译： 在具有高介电常数的电容器中，电容器包括圆柱形下电极，电介质层和上电极。 在作为电介质层的下电极的内表面，顶面和外表面上形成金属氧化物层。 第一子电极沿着下电极的轮廓在电介质层的表面上形成，并且第二子电极连续形成在与下电极的顶表面对应的第一子电极上，因此开口部分 的下部电极被第二子电极覆盖。 第一和第二子电极分别包括施加第一和第二应力的第一和第二金属氮化物层。 第一和第二个应力的方向彼此相反。 因此，在具有高介电常数的上电极中破裂最小化，从而减少电流泄漏。