摘要:
An adhesive sheet for reinforcing thin rigid plates is disclosed, which comprises a thermosetting resin composition layer and a reinforcing substrate laminated or embedded therewith, the reinforcing substrate having undergone sizing treatment with a heat-resistant resin to have stiffness, and the thermosetting resin composition layer having tackiness at room temperature and comprising a thermosetting resin and a hardener.
摘要:
A method for manufacturing a semiconductor device of the present invention includes, forming a first silicon oxide film by HDP-CVD so as to bury a recess portion in a three-dimensional portion formed in a surface region of a semiconductor workpiece to a position lower than an upper surface of the recess portion, and forming a second silicon oxide film by SOG on the first silicon oxide film so as to fill the recess portion.
摘要:
A composite follow valve for internal combustion engines such as an intake and an exhaust valve and the method for producing the same are disclosed. The valve is produced by integrating into the whole a valve head portion molded from a lightweight, heat-resistant material selected from a group of titanium alloys and titanium-aluminium alloys, a stem portion molded from a high-strength alloy steel, made hollow inside to reduce weight, and a stem end portion molded from a hard material selected from a group of martensitic stainless steel, silicon nitride and silicon carbide ceramics. Since the different materials of the separate valve components are selected to meet the requirements of their particular functions and operating condition under which they are placed. Also, because of this separate arrangement, the valve can be produced at a relatively reduced cost, since the use of expensive materials is saved. Furthermore, the valve is molded, not in a whole body, but in separate components, there is no use for expensive isothermal forging machines as in the case of prior art production methods.
摘要:
A semiconductor substrate with a groove is placed in a plasma generating reaction chamber. Silicon, oxygen and hydrogen containing gases are introduced into the reaction chamber as process gases. A ratio of a gas flow of the hydrogen containing gas except the silicon containing gas to a total gas flow of the silicon containing gas and the oxygen containing gas defines a first gas-flow ratio. A ratio of a gas flow of the oxygen containing gas to that of the silicon containing gas defines a second gas-flow ratio. The first and second gas-flow ratios establish a linear function for a critical condition. A cluster formation condition is set up by relatively increasing the first gas-flow ratio while relatively decreasing the second gas-flow ratio with respect to the critical condition. A cluster suppression condition is also set up by relatively decreasing the first gas-flow ratio while relatively increasing the second gas-flow ratio with respect to the critical condition. The process gases are supplied to the reaction chamber under the cluster formation condition and under the cluster suppression condition, alternately, to form an insulating film buried in the groove.
摘要:
Forming of a first silicon oxide film is started on an internal surface of a trench formed on a surface or upwardly of a semiconductor substrate according to an HDP technique. Then, deposition of the first silicon oxide film stops before an opening of the trench closes. Further, the first silicon oxide film deposited in the vicinity of an opening is etched, and a second silicon oxide film is formed on the first silicon oxide film deposited on the bottom of the trench according to the HDP technique. In this manner, the first and second silicon oxide films can be laminated on the bottom of the trench.
摘要:
A plural number of types of material powders are accommodated in an accommodation chamber in a mixed state and the material powders are continuously subjected to a self-exothermic reaction inducing chemical reactions between the material powders caused by heat of reaction released when the mixed material powders synthesize. The synthesized material of high temperature due to the self-exothermic reaction is pressed by utilizing an electromagnetic force just after the finish of the self-exothermic reaction. The exothermic reaction is caused by an ignition circuit including an ignition electrode and the electromagnetic force is generated by an electromagnetic force generation circuit including an electric current inducing means. These circuits are connected through and regulated by a relay circuit. Thus the synthetic products of fine structure are obtained.
摘要:
Forming of a first silicon oxide film is started on an internal surface of a trench formed on a surface or upwardly of a semiconductor substrate according to an HDP technique. Then, deposition of the first silicon oxide film stops before an opening of the trench closes. Further, the first silicon oxide film deposited in the vicinity of an opening is etched, and a second silicon oxide film is formed on the first silicon oxide film deposited on the bottom of the trench according to the HDP technique. In this manner, the first and second silicon oxide films can be laminated on the bottom of the trench.
摘要:
A semiconductor device comprises a semiconductor substrate, an interlayer insulating layer formed above the semiconductor substrate, a first metal interconnection embedded in the interlayer insulating layer with a surface thereof exposed to the same plane as a surface of the interlayer insulating layer, a diffusion preventive layer formed on at least the first metal interconnection to prevent diffusion of a metal included in the first metal interconnection, a nitrogen-doped silicon oxide layer formed on the diffusion preventive layer, a fluorine-doped silicon oxide layer formed on the nitrogen-doped silicon oxide layer, and a second metal interconnection embedded in the fluorine-doped silicon oxide layer with a surface thereof exposed to the same plane as a surface of the fluorine-doped silicon oxide layer, and electrically connected to the first metal interconnection.
摘要:
A method of manufacturing a rock bit cone having a substantially conical body on a surface of which a number of teeth are formed is manufactured by pressure-casting with using a casting mold having a molding surface including a cone body defining surface portion and tooth defining surface portions, pouring a molten metal of very hard and low melting point alloy having a melting point of 1040.degree.-1120.degree. C. and Rockwell hardness of 55-65 to the casting mold to centrifugal-cast at least a predetermined area including a tip of each tooth with the hard metal, and pouring a molten tough metal to the casting mold to centrifugal-cast the cone body.
摘要:
A crude olefin oxide containing high-boiling ingredients is distilled at a pH of 4 to 7 in the presence of a nonvolatile neutral or weakly basic alkali metal or alkaline earth metal salt or hydroxide to separate the olefin oxide from the high-boiling ingredients. This permits the prevention of the polymerization of the olefin oxide and its conversion to the corresponding glycol.