公开(公告)号：US20130134606A1

公开(公告)日：2013-05-30

申请号：US13587330

申请日：2012-08-16

申请人： Yun-hyeok IM ,  Won-keun KIM ,  Tae-Je CHO ,  Kyol PARK

发明人： Yun-hyeok IM ,  Won-keun KIM ,  Tae-Je CHO ,  Kyol PARK

IPC分类号： H01L23/29 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/367 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10126 ,  H01L2224/10156 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83007 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83887 ,  H01L2224/83888 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A semiconductor package may include a substrate including a substrate pad on a top surface thereof; at least one semiconductor chip including a connection terminal electrically connected to the substrate on an active surface thereof, and mounted on the substrate; a heat release pattern formed between the substrate and the at least one semiconductor chip and configured to generate heat; and underfill resin underfilled between the substrate and the at least one semiconductor chip and comprising fillers. A semiconductor package may include a substrate including a substrate pad on a top surface thereof and a first heat release pattern configured to generate heat, and a semiconductor chip including a bonding pad formed on an active surface facing the substrate and a second heat release pattern configured to generate heat.

摘要翻译： 半导体封装可以包括在其顶表面上包括衬底焊盘的衬底; 至少一个半导体芯片，包括在其有源表面上电连接到所述衬底的连接端子，并且安装在所述衬底上; 形成在所述基板和所述至少一个半导体芯片之间并被配置为产生热量的散热图案; 以及在所述基底和所述至少一个半导体芯片之间未填充的底部填充树脂，并且包括填料。 半导体封装可以包括：衬底，其包括在其顶表面上的衬底焊盘和被配置为产生热量的第一散热图案;以及半导体芯片，其包括形成在与衬底相对的有源表面上的焊盘，以及第二散热图案， 产生热量。

公开(公告)号：US20140134798A1

公开(公告)日：2014-05-15

申请号：US14158131

申请日：2014-01-17

申请人： Won-keun KIM ,  Hyun-jung SONG ,  Eun-young CHOI ,  Hye-young JANG

发明人： Won-keun KIM ,  Hyun-jung SONG ,  Eun-young CHOI ,  Hye-young JANG

IPC分类号： H01L25/00 ,  H01L23/00

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

摘要翻译： 一种半导体封装，包括：内部封装，其包括至少一个用内部密封件密封的半导体芯片;外部基板，其上安装有内部封装;以及外部密封件封装内部封装。 还提供了一种制造半导体封装的方法，包括形成包括至少一个用内部密封件密封的半导体芯片的内部封装，将内部封装安装在外部基板上，并用外部密封件密封内部封装。 内部密封件和外部密封件具有不同的杨氏模量，例如，内部密封件的杨氏模量小于外部密封件的杨氏模量。 因此，半导体封装不易翘曲，并且可以在随后的半导体封装工艺中相对容易地处理。