PRINTER DRIVER
    2.
    发明申请
    PRINTER DRIVER 有权
    打印机驱动程序

    公开(公告)号:US20130003098A1

    公开(公告)日:2013-01-03

    申请号:US13534197

    申请日:2012-06-27

    IPC分类号: G06K15/02

    摘要: In a printer driver, combinations of standard print conditions and standard render data are saved as standard patterns, and combinations of standard print conditions and standard render data used for exceptional settings are saved as print application patterns. The print application patterns and the standard patterns are associated with each other. When printing document data, print condition data and render data are spooled by each page, the standard print conditions and the standard render data are compared, and a most similar standard pattern is detected. The print application pattern corresponding to the detected standard pattern is referred to, and print conditions are generated by combining standard print conditions and print conditions of the document data for each page. From the render data of the document data or from the standard render data, print data that can be processed by the printer is generated.

    摘要翻译: 在打印机驱动程序中,将标准打印条件和标准渲染数据的组合保存为标准模式,并将标准打印条件和用于异常设置的标准渲染数据的组合保存为打印应用程序模式。 打印应用程序模式和标准模式相互关联。 当打印文档数据时,打印条件数据和渲染数据由每页打印,比较标准打印条件和标准渲染数据,并且检测到最相似的标准图案。 参照对应于检测到的标准图案的打印应用程序模式,并且通过组合每页的文档数据的标准打印条件和打印条件来生成打印条件。 从文档数据的渲染数据或标准渲染数据,生成可由打印机处理的打印数据。

    Printer driver
    3.
    发明授权
    Printer driver 有权
    打印机驱动程序

    公开(公告)号:US08842338B2

    公开(公告)日:2014-09-23

    申请号:US13534197

    申请日:2012-06-27

    摘要: In a printer driver, combinations of standard print conditions and standard render data are saved as standard patterns, and combinations of standard print conditions and standard render data used for exceptional settings are saved as print application patterns. The print application patterns and the standard patterns are associated with each other. When printing document data, print condition data and render data are spooled by each page, the standard print conditions and the standard render data are compared, and a most similar standard pattern is detected. The print application pattern corresponding to the detected standard pattern is referred to, and print conditions are generated by combining standard print conditions and print conditions of the document data for each page. From the render data of the document data or from the standard render data, print data that can be processed by the printer is generated.

    摘要翻译: 在打印机驱动程序中,将标准打印条件和标准渲染数据的组合保存为标准模式,并将标准打印条件和用于异常设置的标准渲染数据的组合保存为打印应用程序模式。 打印应用程序模式和标准模式相互关联。 当打印文档数据时,打印条件数据和渲染数据由每页打印,比较标准打印条件和标准渲染数据,并且检测到最相似的标准图案。 参照对应于检测到的标准图案的打印应用程序模式,并且通过组合每页的文档数据的标准打印条件和打印条件来生成打印条件。 从文档数据的渲染数据或标准渲染数据,生成可由打印机处理的打印数据。

    Method for producing circuit substrate
    4.
    发明授权
    Method for producing circuit substrate 失效
    电路基板的制造方法

    公开(公告)号:US07244370B2

    公开(公告)日:2007-07-17

    申请号:US10910271

    申请日:2004-08-04

    IPC分类号: G01D15/00 G11B5/127 H01B13/00

    摘要: In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.

    摘要翻译: 为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板,本发明提供一种制造电路基板的方法, 在基板的绝缘表面上,多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极,包括在电阻层上形成铝电极布线层的步骤,步骤 通过干蚀刻将电极配线层隔离成各元件,以及通过含有与配线金属形成络合物的磷酸,硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。

    Circuit board and liquid discharging apparatus
    6.
    发明申请
    Circuit board and liquid discharging apparatus 有权
    电路板和液体排放装置

    公开(公告)号:US20050078152A1

    公开(公告)日:2005-04-14

    申请号:US10968901

    申请日:2004-10-21

    摘要: A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.

    摘要翻译: 一种用于液体排放装置的电路板,其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异,并且提供了这种电路板的制造方法。 处理布线材料层的表面部分,使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是,将形成布线材料层的材料的氟化物,氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。

    THROUGH-HOLE FORMING METHOD, INKJET HEAD, AND SILICON SUBSTRATE
    8.
    发明申请
    THROUGH-HOLE FORMING METHOD, INKJET HEAD, AND SILICON SUBSTRATE 失效
    通孔形成方法,喷头和硅基板

    公开(公告)号:US20090073228A1

    公开(公告)日:2009-03-19

    申请号:US12197499

    申请日:2008-08-25

    IPC分类号: B41J2/015 H01L21/00 H01L23/58

    摘要: A through-hole forming method includes steps of forming a first impurity region (102a) around a region where a through-hole is to be formed in the first surface of a silicon substrate (101), the first impurity region (102) being higher in impurity concentration than the silicon substrate (101), forming a second impurity region (102b) at a position adjacent to the first impurity region (102a) in the depth direction of the silicon substrate (101), the second impurity region (102b) being higher in impurity concentration than the first impurity region (102a), forming an etch stop layer (103) on the first surface, forming an etch mask layer (104) having an opening on the second surface of the silicon substrate (101) opposite to the first surface, and etching the silicon substrate (101) until at least the etch stop layer (103) is exposed via the opening.

    摘要翻译: 通孔形成方法包括以下步骤:在硅衬底(101)的第一表面中形成在要形成通孔的区域周围的第一杂质区域(102a),第一杂质区域(102)更高 在所述硅衬底(101)的深度方向上与所述第一杂质区(102a)相邻的位置形成第二杂质区(102b),所述第二杂质区(102b) 杂质浓度高于第一杂质区(102a),在第一表面上形成蚀刻停止层(103),形成在硅衬底(101)的第二表面上具有开口的蚀刻掩模层(104) 并且蚀刻硅衬底(101),直到至少蚀刻停止层(103)经由开口露出。

    Method for producing circuit substrate
    10.
    发明申请
    Method for producing circuit substrate 失效
    电路基板的制造方法

    公开(公告)号:US20050031996A1

    公开(公告)日:2005-02-10

    申请号:US10910271

    申请日:2004-08-04

    摘要: In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.

    摘要翻译: 为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板,本发明提供一种制造电路基板的方法, 在基板的绝缘表面上,多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极,包括在电阻层上形成铝电极布线层的步骤,步骤 通过干蚀刻将电极配线层隔离成各元件,以及通过含有与配线金属形成络合物的磷酸,硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。