公开(公告)号：US07215235B2

公开(公告)日：2007-05-08

申请号：US10819929

申请日：2004-04-08

申请人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

发明人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

IPC分类号： H01C1/012

CPC分类号： H01C17/065 ,  H05K1/167 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723

摘要： A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

摘要翻译： 一种具有电阻层的导电性基板，其特征在于，具有通过电阻部件在其表面上被电阻成分处理的基本平坦的高导电性基板粗糙化，并且通过所述电阻部件设置有电阻层，使得能够使高导电性基板和电阻成分层之间的界面成为 基本平坦化，能够在剥离高导电性基材后能够获得具有稳定电阻的薄膜电阻层，并且能够与绝缘支撑体一起保持剥离强度，以及使用其的电阻板。

公开(公告)号：US07794578B2

公开(公告)日：2010-09-14

申请号：US10719020

申请日：2003-11-24

申请人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

发明人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

IPC分类号： C25D3/56

CPC分类号： H05K1/167 ,  C25D3/562 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  Y10T428/12944

摘要： A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

摘要翻译： 一种镀浴，其能够在导电性基体的粗糙化表面上形成具有均匀厚度分布的电阻层，包括镍离子和氨基磺酸或其盐作为必要成分，以及至少一种磷酸，亚磷酸，次磷酸， 及其盐; 具有电阻稳定的薄电阻层的导电性基材和使用该导电性基材的电阻电路基板材料。

公开(公告)号：US20050280498A1

公开(公告)日：2005-12-22

申请号：US11153609

申请日：2005-06-16

申请人： Yuuki Kikuchi ,  Akira Matsuda ,  Yuuji Suzuki ,  Sadao Matsumoto

发明人： Yuuki Kikuchi ,  Akira Matsuda ,  Yuuji Suzuki ,  Sadao Matsumoto

IPC分类号： C25D3/56 ,  C25D5/12 ,  C25D5/16 ,  C25D7/06 ,  H05K1/16 ,  H05K3/38 ,  H01C1/012

CPC分类号： C25D7/0614 ,  C25D3/562 ,  C25D5/12 ,  C25D5/16 ,  H05K1/167 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723

摘要： A conductive base material with resistance layer provided with roughened conductive base material on the surface of which the resistance layer is formed with uniform thickness distribution, and a resistance circuit board material using the same, wherein electrodeposited copper foil having granular crystals is roughening treated on at least one surface to obtain Rz of not more than 2.5 μm and the resistance layer of Ni alloy layer containing at least 8 to 18 wt % of P is formed on the roughening treated side.

摘要翻译： 具有电阻层的导电性基材在其表面上形成均匀厚度分布的电阻层的粗糙导电性基材，以及使用其的电阻电路基板材料，其中具有粒状结晶的电解铜箔在其上进行粗糙化处理 至少一个表面以获得不大于2.5μm的Rz，并且在粗糙化处理侧上形成含有至少8至18重量％的P的Ni合金层的电阻层。

公开(公告)号：US20070228443A1

公开(公告)日：2007-10-04

申请号：US11693273

申请日：2007-03-29

申请人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

发明人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

IPC分类号： H05K1/03

CPC分类号： H05K1/167 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T29/49082

摘要： An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.

摘要翻译： 具有薄膜电阻层的廉价的导电基材，具有薄的电阻值变化小的导电性基材和具有通过稳定地留下电阻元件而制造印刷电阻电路板的电阻层的导电性基材，即导电性基材 具有薄膜电阻层，其由在其表面上形成有电阻层的导电性基材构成，其中电阻层包括含有P的Ni和非晶态和晶体形式混合在一起，并且具有薄膜电阻层的导电基材包含 具有在其表面上形成的电阻层的导电基材，其中电阻层是包含含Ni的结晶薄膜电阻层。

公开(公告)号：US20070110969A1

公开(公告)日：2007-05-17

申请号：US11594134

申请日：2006-11-08

申请人： Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

发明人： Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

IPC分类号： B32B3/00

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  H05K3/4069 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K2203/0723 ,  H05K2203/1461 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/24917

摘要： A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 μm and height of the projection to be 0.3 to 10 μm. Surface roughness of the original foil is 0.1 to 5 μm and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

摘要翻译： 通过使用铜箔和含有低熔点金属的导电膏，电连接的可靠性高，而不会在铜箔和导电膏金属之间的边界处产生有害的空隙和裂纹。 叠层电路板是通过将至少在其一个表面侧上至少具有粗糙化处理的铜箔的多个树脂板层压而成的，其粗化投影沉积小于150mg / dm 2以使表面粗糙度Rz 为0.3〜10μm，突出部的高度为0.3〜10μm。 原始箔的表面粗糙度为0.1〜5μm，粗化处理层的铜金属原子的量设定为含有低熔点金属的扩散性导电性糊状金属原子的量的4倍以下 箔表面。

公开(公告)号：US07976956B2

公开(公告)日：2011-07-12

申请号：US11594134

申请日：2006-11-08

申请人： Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

发明人： Yuuji Suzuki ,  Yuuki Kikuchi ,  Satoru Zama

IPC分类号： B32B3/00

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  H05K3/4069 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K2203/0723 ,  H05K2203/1461 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/24917

摘要： A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 μm and height of the projection to be 0.3 to 10 μm. Surface roughness of the original foil is 0.1 to 5 μm and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

摘要翻译： 通过使用铜箔和含有低熔点金属的导电膏，电连接的可靠性高，而不会在铜箔和导电膏金属之间的边界处产生有害的空隙和裂纹。 层压电路板是通过使至少在其一个表面侧至少具有粗糙化处理的铜箔的多个树脂板层叠多个树脂板而形成的，其粗化投影沉积小于150mg / dm 2，使得表面粗糙度Rz为0.3〜10μm，高度为 投影为0.3〜10μm。 原始箔的表面粗糙度为0.1〜5μm，粗化处理层的铜金属原子的量设定为含有低熔点金属的扩散性导电性糊状金属原子的量的4倍以下， 箔表面。

公开(公告)号：US20070287020A1

公开(公告)日：2007-12-13

申请号：US11808049

申请日：2007-06-06

申请人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

发明人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

IPC分类号： C22C9/00

CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12569 ,  Y10T428/12903

摘要： To provide a surface treated electrodeposited copper foil having a smooth M surface with less asperity on the surface instead of an S surface affected by stripes transferred from a surface drum; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC (total organic carbon) is 400 ppm or smaller, and a current density is 20 to 50 A/dm2, and a surface treatment is performed on an M surface of the copper foil to attain Rz of 1.0 μm or smaller and Ra of 0.2 μm or smaller on the M surface.

摘要翻译： 提供具有光滑M表面的表面处理电沉积铜箔，而不是表面受到从表面转鼓传送的条纹影响的S表面; 在M表面上进行表面处理，M表面是与电沉积铜箔中的滚筒接触的表面的相对表面，其中Rz为1.0μm或更小，并且Ra为0.2μm或更小，电沉积铜镀层为 在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。 氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC（总有机碳）为400ppm以下， 电流密度为20〜50A / dm 2，对铜箔的M面进行表面处理，使M表面的Rz为1.0μm以下，Ra为0.2μm以下。

公开(公告)号：US08153273B2

公开(公告)日：2012-04-10

申请号：US11808049

申请日：2007-06-06

申请人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

发明人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

IPC分类号： B32B15/04 ,  B32B15/20

CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12569 ,  Y10T428/12903

摘要： A surface treated electrodeposited copper foil having a smooth M surface; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC is 400 ppm or smaller, and a current density is 20 to 50 A/dm2.

摘要翻译： 具有光滑M表面的经表面处理的电沉积铜箔; 在M表面上进行表面处理，M表面是与电沉积铜箔中的鼓接触的表面的相对表面，其中Rz为1.0μm以下，Ra为50μm以下，电镀铜为 在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。 氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC为400ppm以下，电流密度为20〜 50 A / dm2。

公开(公告)号：US07223481B2

公开(公告)日：2007-05-29

申请号：US10929471

申请日：2004-08-31

申请人： Yuuji Suzuki ,  Akira Matsuda

发明人： Yuuji Suzuki ,  Akira Matsuda

IPC分类号： B32B15/00

CPC分类号： C25D1/04 ,  H01L2924/0002 ,  H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/0723 ,  Y10T428/12028 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12778 ,  Y10T428/12806 ,  H01L2924/00

摘要： An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

摘要翻译： 本发明的目的是制造具有针孔小，表面粗糙度小，厚度小于5μm的载体的超薄铜箔，制造箔的制造方法 通过使用具有载体的超薄铜箔制造精细图案的印刷电路板，多层印刷电路板和薄膜电路板上的芯片。 本发明提供一种具有载体的超薄铜箔，其通过在载体铜箔的表面上依次层叠剥离层和超薄铜箔而制造，该载体铜箔的表面平滑，使得至少一个侧面的平均表面粗糙度 通过化学抛光，电化学溶解或平滑电镀处理方法独立地组合了两个或更多个，或进一步组合机械抛光，Rz为0.01〜2.0μm。

公开(公告)号：US06924043B2

公开(公告)日：2005-08-02

申请号：US10698014

申请日：2003-10-31

申请人： Yuuji Suzuki ,  Akira Matsuda

发明人： Yuuji Suzuki ,  Akira Matsuda

IPC分类号： H05K1/09 ,  C25D1/04 ,  C25D1/22 ,  C25D5/10 ,  H05K3/02 ,  H05K3/38 ,  B32B15/00

CPC分类号： C25D5/10 ,  C25D1/04 ,  C25D1/22 ,  H05K3/025 ,  H05K3/384 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12771 ,  Y10T428/12806 ,  Y10T428/12847 ,  Y10T428/1291

摘要： An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.

摘要翻译： 一种具有载体的超薄铜箔，其具有能够在使用高耐热性树脂的情况下能够承受甚至高温加工的剥离层，使得载体箔和超薄铜箔容易剥离，并且减少 在不损害剥离层的剥离性的同时通过均匀镀覆的针孔数，即具有载体箔，剥离层和超薄铜箔的载体的超薄铜箔，其中剥离 层和超薄铜箔之间设置有在剥离层侧的表面的触击镀层，根据需要在其上设置超薄铜层，并且由超薄铜箔构成的超薄铜箔 铜或铜合金或含磷铜或含磷铜合金。 载体箔和超薄铜箔之间的剥离层是铬，铬合金，含铬氧化物水合物层，镍，铁或其合金层，或者是氧化物水合物层。