摘要:
A piezoelectric actuator is disclosed including an annular piezoelectric element and a base. There is a gap along the radial direction of the annular piezoelectric element. One of the two ends, i.e., the fixed end of the said annular element, is connected to the base, while the other end is free. The base is made of piezoelectric materials. Furthermore, the annular element is divided into two or more annular parts along the direction of its circumference by the electrode patterns applied on its two opposite surface and/or its polarization directions. When driving voltages are applied, the actuator can generate roughly a rotary motion around the center of the annular piezoelectric element. The annular rotary actuator could be either a single plate or with multilayer structure. The present invention further relates to a dual stage head positioning actuator system of a hard disk drive with a plurality of disks and a plurality of vertically aligned head sliders mounted on distal ends of a plurality of suspensions via the annular piezoelectric actuators.
摘要:
A piezoelectric actuator is disclosed including an annular piezoelectric element and a base. There is a gap along the radial direction of the annular piezoelectric element. One of the two ends, i.e., the fixed end of the said annular element, is connected to the base, while the other end is free. The base is made of piezoelectric materials. Furthermore, the annular element is divided into two or more annular parts along the direction of its circumference by the electrode patterns applied on its two opposite surface and/or its polarization directions. When driving voltages are applied, the actuator can generate roughly a rotary motion around the center of the annular piezoelectric element. The annular rotary actuator could be either a single plate or with multilayer structure. The present invention further relates to a dual stage head positioning actuator system of a hard disk drive with a plurality of disks and a plurality of vertically aligned head sliders mounted on distal ends of a plurality of suspensions via the annular piezoelectric actuators.
摘要:
A piezoelectric device comprises an integral body of piezoelectric material having a length and width greater than its thickness; wherein the device further includes, in contact with the body, respective pairs of electrodes, wherein the electrodes of each pair are opposed in the thickness direction, wherein the body deflects along said transverse direction when a voltage is applied to the electrode pair. The present invention further provisdes a disk drive suspension and a head gimbal assembly.
摘要:
A piezoelectric device comprises an integral body of piezoelectric material having a length and width greater than its thickness; wherein the device further includes, in contact with the body, respective pairs of electrodes, wherein the electrodes of each pair are opposed in the thickness direction, wherein the body deflects along said transverse direction when a voltage is applied to the electrode pair. The present invention further provisdes a disk drive suspension and a head gimbal assembly.
摘要:
A device and a method for processing a short message service are capable of high-reliably processing a short message service. The device for processing a short message service includes a plurality of access units and a plurality of service processing units, where each of the access units is connected to the plurality of service processing units. The access unit is configured to receive the short message service and send it to one of the service processing units, and send out the processed short message service from the service processing unit . The service processing unit is configured to process the short message service, and send out the processed short message service through one of the access units.
摘要:
A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要:
A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要:
A method for processing a substrate having a conductive layer disposed thereon is provided. The substrate is coupled with a planarizing head. The planarizing head is moved to a position above a polishing pad assembly. The planarizing pad is positioned relative to the polishing pad assembly without applying a voltage to the substrate. A first voltage is applied to the substrate for a first time period. A second voltage is applied to the substrate for a second time period in order to remove a portion of the conductive layer, wherein the second voltage is greater than the first voltage. In certain embodiments, applying a first voltage to the substrate further comprises forming a uniform passivation layer on the conductive layer.
摘要:
A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a fluid passage. The openings may each have a lip. The lip may have a chamfered edge. Additionally, a fluid passage may slope generally downward from the openings to the cavity. The chamfered lips and the sloped fluid passage reduce back splashing and help ensure that sufficient rinsing fluid reaches the cavity to rinse polishing fluid and particles from the carrier head. The present invention relates to carrier heads for polishing or planarizing semiconductor substrates by chemical mechanical polishing (CMP) or electrochemical mechanical polishing (ECMP). The cavities in the carrier head are cleaned by rinsing fluid (i.e., liquid or gas) from inside the cavity towards a substrate receiving side of the carrier head.
摘要:
Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a plurality of discrete members and a plurality of apertures. Each of the plurality of discrete members include a first conductive layer and a second conductive layer, with an isolation layer therebetween, and a recess for byproduct accumulation. The second conductive layer comprises a plurality of reaction surfaces that are orthogonal to the upper and lower surfaces of the pad assembly.