-
1.发明公开公开(公告)号：US20240274491A1
公开(公告)日：2024-08-15
申请号：US18394772
申请日：2023-12-22
发明人： Xianming Chen , Gao Huang , Benxia Huang , Zhijun Zhang
IPC分类号： H01L23/367 , H01L21/48 , H01L23/00 , H01L23/498
CPC分类号： H01L23/3675 , H01L21/4857 , H01L23/3672 , H01L23/49822 , H01L24/29 , H01L2224/29005 , H01L2224/29021 , H01L2224/29147 , H01L2924/01029 , H01L2924/182 , H01L2924/351
摘要： A package carrier plate with an embedded efficient heat dissipation module and a manufacturing method therefor are disclosed. The package carrier plate with an embedded efficient heat dissipation module includes: a metal carrier plate, in which a first opening frame is provided; and a metal heat dissipation module, where the metal heat dissipation module includes a first metal layer and a second metal layer, a plurality of copper walls arranged in parallel are connected between the first metal layer and the second metal layer, a phase change material is filled in a cavity formed between every two adjacent copper walls, the metal heat dissipation module is embedded in the first opening frame, and a first dielectric layer is filled in a gap between the metal heat dissipation module and an inner side wall of the first opening frame.
-
公开(公告)号：US12040526B2
公开(公告)日：2024-07-16
申请号：US17220151
申请日：2021-04-01
发明人： Xianming Chen , Lei Feng , Benxia Huang , Jindong Feng , Yejie Hong
CPC分类号： H01P11/008 , B32B37/1284 , C25D5/022 , C25D7/00
摘要： A method for manufacturing an embedded package structure having an air resonant cavity according to an embodiment includes manufacturing a first substrate including a first insulating layer, a chip embedded in the insulating layer, and a wiring layer on a terminal face of the chip of the first substrate, wherein the wiring layer is provided thereon with an opening revealing the terminal face of the chip; manufacturing a second substrate which comprises a second insulating layer; locally applying a first adhesive layer on the wiring layer such that the opening revealing the terminal face of the chip is not covered; and applying a second adhesive layer on the second substrate; and attaching and curing the first adhesive layer of the first substrate and the second adhesive layer of the second substrate to obtain an embedded package structure having an air resonant cavity on the terminal face of the chip.
-
公开(公告)号：US12074115B2
公开(公告)日：2024-08-27
申请号：US17428822
申请日：2020-07-24
发明人： Xianming Chen , Bingsen Xie , Benxia Huang , Lei Feng
IPC分类号： H01L23/552 , H01L21/48 , H01L23/373
CPC分类号： H01L23/552 , H01L21/4871 , H01L23/3735
摘要： Disclosed are a heat dissipation-electromagnetic shielding embedded packaging structure, a manufacturing method thereof, and a substrate. The heat dissipation-electromagnetic shielding embedded packaging structure includes: a dielectric layer including an upper surface and a lower surface, wherein at least one hollow cavity unit is disposed inside the dielectric layer; an insulating layer disposed in the hollow cavity unit, wherein the hollow cavity unit is partially filled with the insulating layer; an electronic element, wherein one end is embedded in the insulating layer, the other end is exposed in the hollow cavity unit, and the electronic element includes terminals; a through hole penetrating through the upper surface and the lower surface of the dielectric layer and communicating with the terminals; and a metal layer covering the six surfaces of the dielectric layer and the interior of the through hole to form a shielding layer and circuit layer respectively.
-
4.发明授权公开(公告)号：US11903133B2
公开(公告)日：2024-02-13
申请号：US17955683
申请日：2022-09-29
发明人： Xianming Chen , Lei Feng , Gao Huang , Benxia Huang , Yejie Hong
CPC分类号： H05K1/186 , H05K1/0366 , H05K1/113 , H05K3/0035 , H05K3/429 , H05K3/4661 , H05K2201/0129 , H05K2201/0166 , H05K2201/032 , H05K2201/09509 , H05K2203/061 , H05K2203/308
摘要： A method for manufacturing a structure for embedding and packaging multiple devices by layer includes preparing a polymer supporting frame, mounting a first device in a first device placement mouth frame to form a first packaging layer, forming a first circuit layer and a second circuit layer, forming a second conductive copper pillar layer and a second sacrificial copper pillar layer, forming a second insulating layer on the first circuit layer, and forming a third insulating layer on the second circuit layer, forming a second device placement mouth frame vertically overlapped with the first device placement mouth frame, mounting a second device and a third device in the second device placement mouth frame to form a second packaging layer, forming a third circuit layer on the second insulating layer. A terminal of the second device and a terminal of the third device are respectively communicated with the third circuit layer.
-
公开(公告)号：US11579362B2
公开(公告)日：2023-02-14
申请号：US17463815
申请日：2021-09-01
发明人： Xianming Chen , Lei Feng , Benxia Huang , Wenshi Wang , Lina Jiang
摘要： A cavity substrate may have a directional optoelectronic transmission channel. The cavity substrate includes a support frame, a first dielectric layer on a first surface of the support frame, and a second dielectric layer on a second surface of the support frame. The support frame, the first dielectric layer and the second dielectric layer constitute a closed cavity having an opening on one side in the length direction of the substrate, a first circuit layer is arranged on the inner surface of the first dielectric layer facing the cavity, an electrode connected with an optical communication device is arranged on the first circuit layer, the electrode is electrically conducted with the first circuit layer, a second circuit layer is arranged on the outer surfaces of the first dielectric layer and the second dielectric layer, and the first circuit layer and the second circuit layer are communicated through a via column.
-
公开(公告)号：US20220310529A1
公开(公告)日：2022-09-29
申请号：US17428822
申请日：2020-07-24
发明人： Xianming Chen , Bingsen Xie , Benxia Huang , Lei Feng
IPC分类号： H01L23/552 , H01L23/373 , H01L21/48
摘要： Disclosed are a heat dissipation-electromagnetic shielding embedded packaging structure, a manufacturing method thereof, and a substrate. The heat dissipation-electromagnetic shielding embedded packaging structure includes: a dielectric layer including an upper surface and a lower surface, wherein at least one hollow cavity unit is disposed inside the dielectric layer; an insulating layer disposed in the hollow cavity unit, wherein the hollow cavity unit is partially filled with the insulating layer; an electronic element, wherein one end is embedded in the insulating layer, the other end is exposed in the hollow cavity unit, and the electronic element includes terminals; a through hole penetrating through the upper surface and the lower surface of the dielectric layer and communicating with the terminals; and a metal layer covering the six surfaces of the dielectric layer and the interior of the through hole to form a shielding layer and circuit layer respectively.
-
公开(公告)号：US20220189789A1
公开(公告)日：2022-06-16
申请号：US17544999
申请日：2021-12-08
发明人： Xianming Chen , Yejie Hong , Benxia Huang , Lei Feng
IPC分类号： H01L21/48
摘要： Disclosed is a substrate manufacturing method for realizing three-dimensional packaging, which includes: preparing a base plate, the base plate including a dielectric material layer, a first sidewall pad, a first through-hole pillar and a cavity, the cavity being filled with a first metal block; processing a first circuit layer and a second circuit layer, the first circuit layer including a first padding plate and a second metal block, and the second circuit layer including a second padding plate and a plurality of pin pads; processing and laminating interlayer through-hole pillars; processing a third circuit layer and a fourth circuit layer, the third circuit layer including a second sidewall pad and the fourth circuit layer including a routing circuit; and etching to expose the first sidewall pad, the second sidewall pad and the pin pads.
-
公开(公告)号：US11257713B2
公开(公告)日：2022-02-22
申请号：US17073968
申请日：2020-10-19
发明人： Xianming Chen , Min Gu , Benxia Huang , Lei Feng , Bingsen Xie
IPC分类号： H01L21/768 , H01L23/532 , H01L23/14 , H01L23/48 , H01L21/48
摘要： A method for manufacturing an interposer board without a feature layer structure according to an embodiment of the present invention may include preparing a temporary carrier; forming an edge seal for the temporary carrier; laminating an insulating material onto upper and lower surfaces of the temporary carrier to form an insulating layer; forming a via on the insulating layer, filling the via with a metal; and removing the edge seal and removing the temporary carrier. An interposer board without a feature layer structure according to an embodiment of the present invention may include an insulating layer and a via-post layer embedded in the insulating layer, wherein the via-post has an end used as a pad.
-
9.发明授权公开(公告)号：US12002734B2
公开(公告)日：2024-06-04
申请号：US17411144
申请日：2021-08-25
发明人： Xianming Chen , Lei Feng , Benxia Huang , Jindong Feng , Minxiong Li , Shigui Xin , Wenshi Wang
IPC分类号： H01L23/40 , H01L23/373
CPC分类号： H01L23/40 , H01L23/3736
摘要： A circuit prearranged heat dissipation embedded packaging structure according to an embodiment of the present disclosure includes at least one chip and a support frame surrounding the at least one chip. The support frame may include a via pillar passing through the support frame in the height direction, a first wiring layer on a first surface of the support frame, and a heat dissipation layer on the back face of the chip. The first wiring layer is flush with or higher than the first surface, the first wiring layer is in conductive connection with the heat dissipation layer, a gap between the chip and the frame is completely filled with the dielectric material, a second wiring layer is formed on a terminal face of the chip, and the second wiring layer is in conductive connection with the first wiring layer through the via pillar.
-
公开(公告)号：US11942465B2
公开(公告)日：2024-03-26
申请号：US17388099
申请日：2021-07-29
发明人： Xianming Chen , Bingsen Xie , Benxia Huang , Lei Feng , Wenshi Wang
IPC分类号： H01L25/00 , H01L21/56 , H01L23/00 , H01L23/31 , H01L25/065
CPC分类号： H01L25/50 , H01L21/568 , H01L23/3121 , H01L24/19 , H01L24/20 , H01L25/0655 , H01L2224/2101
摘要： Disclosed is a manufacturing method for an embedded structure. The method includes: preparing a temporary carrier board; preparing a second circuit layer on at least one of the upper surface and the lower surface of the temporary carrier board, and preparing a first dielectric layer to cover the second circuit layer; patterning and curing the first dielectric layer to form a cavity, mounting a device in the cavity, and performing hot-curing, wherein a surface of the device provided with a terminal faces an opening of the cavity; and preparing a second dielectric layer, wherein the device is embedded in the second dielectric layer, and a surface of the second dielectric layer is higher than a surface of the terminal by a preset value.
-
-
-
-
-
-
-
-
-
搜索结果
26 条记录 (耗时 0.018 秒)
