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公开(公告)号：US20240002596A1
公开(公告)日：2024-01-04
申请号：US17848775
申请日：2022-06-24
发明人： Rongtao WANG , Chenyu SHEN , Jue TAN
IPC分类号： C08G65/38 , C08K5/5399 , C08K5/3415 , C08K5/3432
CPC分类号： C08G65/38 , C08K5/5399 , C08G2650/56 , C08K5/3432 , C08G2650/36 , C08K5/3415
摘要： A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1), having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including resin filling uniformity, dissipation factor variation rate under heat, glass transition temperature, Z-axis ratio of thermal expansion, peeling strength and thermal resistance after moisture absorption.
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公开(公告)号：US20230357570A1
公开(公告)日：2023-11-09
申请号：US18224722
申请日：2023-07-21
发明人： Xingxing YAO , Rongtao WANG , Ningning JIA
CPC分类号： C08L79/08 , C08L83/04 , C08L33/10 , C08J5/18 , H05K1/095 , C08L37/00 , C08J5/246 , C08J5/244 , C08J2337/00 , C08L2207/53 , C08K5/0066
摘要： A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.
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3.发明公开公开(公告)号：US20230151212A1
公开(公告)日：2023-05-18
申请号：US17557893
申请日：2021-12-21
发明人： Yan ZHANG , Rongtao WANG , Ningning JIA
摘要： A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.
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公开(公告)号：US20230101785A1
公开(公告)日：2023-03-30
申请号：US17526191
申请日：2021-11-15
发明人： Rongtao WANG , Chenyu SHEN , Yan ZHANG , Xing HE
IPC分类号： C08L71/00 , C08L25/02 , C08J5/24 , C09J7/30 , C09J171/00 , C09J125/02
摘要： A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.
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公开(公告)号：US20220348766A1
公开(公告)日：2022-11-03
申请号：US17362525
申请日：2021-06-29
发明人： Rongtao WANG , Ningning JIA
摘要： A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.
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6.发明授权公开(公告)号：US11434367B2
公开(公告)日：2022-09-06
申请号：US17070538
申请日：2020-10-14
发明人： Yan Zhang
摘要： A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.
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公开(公告)号：US20210253855A1
公开(公告)日：2021-08-19
申请号：US16863415
申请日：2020-04-30
发明人： Xingxing YAO , Rongtao WANG , Ningning JIA
摘要： A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.
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公开(公告)号：US10954322B2
公开(公告)日：2021-03-23
申请号：US16228099
申请日：2018-12-20
发明人： Rongtao Wang , Yan Zhang , Bingbing Li
IPC分类号： C08F12/34 , C08K5/3492 , C08L55/00 , C08K5/14 , C08K5/37 , C08K5/38 , C08K5/01 , C08K5/06 , C08K5/08 , C08K5/13 , C08K5/18 , C08K5/46 , C08F16/32 , C08L71/12 , C08L63/00 , C08L67/00 , C08L33/08 , C08L79/08
摘要： A prepolymer, which is prepared by subjecting an unsaturated bond-containing compound and a bis(vinylphenyl) compound monomer or a polymer thereof to a prepolymerization reaction, is provided. The bis(vinylphenyl) compound contains between 80% and 99% of para-para vinyl groups and has a monomer content of between 80% and 100%. Moreover, a resin composition comprising the prepolymer and an additive, a method of preparing the prepolymer, and an article made from the resin composition are also provided.
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公开(公告)号：US20210009759A1
公开(公告)日：2021-01-14
申请号：US16561828
申请日：2019-09-05
发明人： Xingxing YAO , Rongtao WANG , Ningning JIA
摘要： A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.
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10.发明授权Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same 有权低电导率树脂组合物，使用该低电导率树脂组合物的覆铜层压板以及使用其的印刷电路板公开(公告)号：US09131607B2
公开(公告)日：2015-09-08
申请号：US13777477
申请日：2013-02-26
发明人： Rong-Tao Wang , Tse-An Lee , Yi-Jen Chen , Wenjun Tian , Ziqian Ma , Wenfeng Lu
CPC分类号： H05K1/0353 , B32B15/14 , B32B15/20 , B32B2305/076 , B32B2457/08 , C08G14/06 , C08G59/621 , C08L25/08 , C08L61/14 , C08L61/34 , C08L63/00 , C08L79/085 , H05K2201/012 , H05K2201/0209 , Y10T428/31529 , C08L61/06
摘要： A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.
摘要翻译： 无卤树脂组合物包含（A）100重量份的萘环氧树脂; （B）10〜100重量份苯乙烯马来酸酐共聚物; 和（C）30〜70重量份含DOPO的双酚F酚醛清漆树脂。 无卤素树脂组合物包括特定成分，其特征在于其特定比例，从而获得低介电常数，低介电损耗因数，高耐热性和高阻燃性，因此适用于制备预浸料或 树脂膜，从而可应用于覆铜层压板和印刷电路板。
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