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公开(公告)号:US09324694B2
公开(公告)日:2016-04-26
申请号:US14556251
申请日:2014-12-01
发明人: Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
IPC分类号: H01L25/075 , H01L33/50 , H01L33/48 , H01L33/56 , H01L33/62
CPC分类号: H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要: A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first electrode and a second electrode. At least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer. The first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively. At least two metal pads are disposed on top of the first electrode and the second electrode of the LED die respectively. Each of the metal pads has a side surface. A fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads.
摘要翻译: 提供了一种发光二极管(LED)。 LED管芯包括第一半导体层,发光层,第二半导体层,第一电极和第二电极。 第一半导体的至少一部分从发光层和第二半导体层露出。 第一电极和第二电极分别设置在暴露的第一半导体层和第二半导体层的顶部。 至少两个金属焊盘分别设置在LED芯片的第一电极和第二电极的顶部上。 每个金属垫具有侧面。 荧光层设置在LED管芯的表面上。 荧光层直接与金属焊盘的侧表面接触,并填充金属焊盘之间的间隙。
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公开(公告)号:US09130129B2
公开(公告)日:2015-09-08
申请号:US13715120
申请日:2012-12-14
发明人: Han-Zhong Liao , Chih-Hsuan Lu , Fang-I Li , Wei-Kang Cheng , Shyi-Ming Pan
摘要: A light-emitting diode (LED) chip comprising a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer; wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation.
摘要翻译: 一种包括第一半导体层的发光二极管(LED)芯片; 设置在所述第一半导体层上的有源层; 设置在所述有源层上的第二半导体层; 设置在所述第二半导体层上并间接地彼此重叠的金属层,包括连接到沉积在所述第一半导体上的第一电极的第一金属层和连接到透明导电层的第二金属层和沉积的第二电极 在所述第二半导体层上; 其中沉积在所述第一金属层上的所述第二金属层通过凹陷进一步连接到所述第一半导体层。
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公开(公告)号:USD732488S1
公开(公告)日:2015-06-23
申请号:US29479819
申请日:2014-01-21
设计人: Lung-Kuan Lai , Jen-Chih Li , Wei-Kang Cheng , Shyi-Ming Pan
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公开(公告)号:USD731681S1
公开(公告)日:2015-06-09
申请号:US29461970
申请日:2013-07-30
设计人: Chi-Chih Pu , Chen-Hong Lee , Tzu-Hsiang Wang , Wei-Kang Cheng , Shyi-Ming Pan
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公开(公告)号:USD731090S1
公开(公告)日:2015-06-02
申请号:US29461966
申请日:2013-07-30
设计人: Chen-Hong Lee , Chi-Chih Pu , Lung-Kuan Lai , Wei-Kang Cheng , Shyi-Ming Pan
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公开(公告)号:US09029898B2
公开(公告)日:2015-05-12
申请号:US14174010
申请日:2014-02-06
发明人: Chi-Chih Pu , Chen-Hong Lee , Tzu-Hsiang Wang , Sheng-Hung Hsu , Wei-Kang Cheng , Shyi-Ming Pan
IPC分类号: H01L33/50 , H01L33/38 , H01L25/075
CPC分类号: H01L33/508 , H01L25/0753 , H01L33/38 , H01L33/505 , H01L33/507 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012
摘要: The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
摘要翻译: 本发明涉及一种发光二极管(LED)。 LED包括LED管芯,一个或多个金属焊盘和荧光层。 本发明的特征包括为了方便后续的布线和包装过程,将金属垫留下来露出。 此外,本发明提供的LED是单一的混合芯片,其可以直接包装而不需要在包装胶上涂布荧光粉。 由于荧光层和包装胶不是同时处理并且具有不同的材料,所以可以有效地降低封装LED中的应力问题。
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公开(公告)号:US20140103369A1
公开(公告)日:2014-04-17
申请号:US14089708
申请日:2013-11-25
发明人: Chi-Chih Pu , Chen-Hong Lee , Tzu-Hsiang Wang , Sheng-Hung Hsu , Wei-Kang Cheng , Shyi-Ming Pan
IPC分类号: H01L27/15
CPC分类号: H01L25/0753 , F21K9/232 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L33/007 , H01L33/507 , H01L33/62 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/06181 , H01L2224/131 , H01L2224/13109 , H01L2224/13144 , H01L2224/1329 , H01L2224/13339 , H01L2224/1403 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2224/81805 , H01L2224/83385 , H01L2224/83493 , H01L2924/00011 , H01L2924/01322 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/014 , H01L2924/0105 , H01L2924/01083 , H01L2924/00012 , H01L2924/01015 , H01L2924/01033
摘要: A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.
摘要翻译: 半导体发光元件包括透明基板和多个发光二极管(LED)芯片。 透明基板具有彼此相对设置的支撑表面和第二主表面。 至少一些LED结构设置在支撑表面上并且形成第一主表面,其中从支撑表面的一部分发射的光没有LED结构。 每个LED结构包括第一电极和第二电极。 从至少一个LED结构发出的光穿过透明基板并从第二主表面露出。 照明装置包括半导体发光元件和支撑基座。 半导体发光元件设置在支撑基底上,并且在半导体发光元件和支撑基底之间形成角度。
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公开(公告)号:US20130009095A1
公开(公告)日:2013-01-10
申请号:US13541871
申请日:2012-07-05
申请人: CHENG-I CHU , RU-SHI LIU , YU-CHIH LIN , CHEN-HONG LEE , WEI-KANG CHENG , YI-SHENG TING , SHYI-MING PAN
发明人: CHENG-I CHU , RU-SHI LIU , YU-CHIH LIN , CHEN-HONG LEE , WEI-KANG CHENG , YI-SHENG TING , SHYI-MING PAN
CPC分类号: C09K11/0883 , C09K11/7734
摘要: A method of manufacturing an oxynitride phosphor is revealed. A precursor is sintered under 0.1-1000 MPa nitrogen pressure for synthesis of an oxynitride phosphor. The general formula of the oxynitride phosphors is MxAyBzOuNv (0.00001≦x≦5; 0.00001≦y≦3; 0.00001≦z≦6; 0.00001≦u≦12; 0.00001≦v≦12). M is an activator or a mixture of activators. A is a bivalent element or a mixture of bivalent elements. B is a trivalent element, a tetravalent element, a mixture of trivalent elements or a mixture of tetravalent elements. O is a univalent element, a bivalent element, a mixture of univalent elements, or a mixture of bivalent elements. N is a univalent element, a bivalent element, a trivalent element, a mixture of univalent elements, a mixture of bivalent elements, or a mixture of trivalent elements. Thus pure phosphor can be mass-produced.
摘要翻译: 揭示了制造氮氧化物荧光体的方法。 将前体在0.1-1000MPa氮气压力下烧结以合成氮氧化物荧光体。 氮氧化物荧光体的通式为MxAyBzOuNv(0.00001≦̸ x≦̸ 5; 0.00001≦̸ y≦̸ 3; 0.00001≦̸ z≦̸ 6; 0.00001≦̸ u≦̸ 12; 0.00001≦̸ v≦̸ 12)。 M是活化剂或活化剂的混合物。 A是二价元素或二价元素的混合物。 B是三价元素,四价元素,三价元素的混合物或四价元素的混合物。 O是单价元素,二价元素,单价元素的混合物或二价元素的混合物。 N是一价元素,二价元素,三价元素,一价元素的混合物,二价元素的混合物或三价元素的混合物。 因此,可以批量生产纯的磷光体。
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