Light-emitting diode
    2.
    发明授权
    Light-emitting diode 有权
    发光二极管

    公开(公告)号:US09324694B2

    公开(公告)日:2016-04-26

    申请号:US14556251

    申请日:2014-12-01

    摘要: A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first electrode and a second electrode. At least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer. The first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively. At least two metal pads are disposed on top of the first electrode and the second electrode of the LED die respectively. Each of the metal pads has a side surface. A fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads.

    摘要翻译: 提供了一种发光二极管(LED)。 LED管芯包括第一半导体层,发光层,第二半导体层,第一电极和第二电极。 第一半导体的至少一部分从发光层和第二半导体层露出。 第一电极和第二电极分别设置在暴露的第一半导体层和第二半导体层的顶部。 至少两个金属焊盘分别设置在LED芯片的第一电极和第二电极的顶部上。 每个金属垫具有侧面。 荧光层设置在LED管芯的表面上。 荧光层直接与金属焊盘的侧表面接触,并填充金属焊盘之间的间隙。

    Light-emitting diode chip
    4.
    发明授权
    Light-emitting diode chip 有权
    发光二极管芯片

    公开(公告)号:US09130129B2

    公开(公告)日:2015-09-08

    申请号:US13715120

    申请日:2012-12-14

    IPC分类号: H01L33/42 H01L33/20 H01L33/38

    CPC分类号: H01L33/42 H01L33/20 H01L33/38

    摘要: A light-emitting diode (LED) chip comprising a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer; wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation.

    摘要翻译: 一种包括第一半导体层的发光二极管(LED)芯片; 设置在所述第一半导体层上的有源层; 设置在所述有源层上的第二半导体层; 设置在所述第二半导体层上并间接地彼此重叠的金属层,包括连接到沉积在所述第一半导体上的第一电极的第一金属层和连接到透明导电层的第二金属层和沉积的第二电极 在所述第二半导体层上; 其中沉积在所述第一金属层上的所述第二金属层通过凹陷进一步连接到所述第一半导体层。

    METHOD OF MANUFACTURING OXYNITRIDE PHOSPHOR
    10.
    发明申请
    METHOD OF MANUFACTURING OXYNITRIDE PHOSPHOR 有权
    制造氧化磷的方法

    公开(公告)号:US20130009095A1

    公开(公告)日:2013-01-10

    申请号:US13541871

    申请日:2012-07-05

    CPC分类号: C09K11/0883 C09K11/7734

    摘要: A method of manufacturing an oxynitride phosphor is revealed. A precursor is sintered under 0.1-1000 MPa nitrogen pressure for synthesis of an oxynitride phosphor. The general formula of the oxynitride phosphors is MxAyBzOuNv (0.00001≦x≦5; 0.00001≦y≦3; 0.00001≦z≦6; 0.00001≦u≦12; 0.00001≦v≦12). M is an activator or a mixture of activators. A is a bivalent element or a mixture of bivalent elements. B is a trivalent element, a tetravalent element, a mixture of trivalent elements or a mixture of tetravalent elements. O is a univalent element, a bivalent element, a mixture of univalent elements, or a mixture of bivalent elements. N is a univalent element, a bivalent element, a trivalent element, a mixture of univalent elements, a mixture of bivalent elements, or a mixture of trivalent elements. Thus pure phosphor can be mass-produced.

    摘要翻译: 揭示了制造氮氧化物荧光体的方法。 将前体在0.1-1000MPa氮气压力下烧结以合成氮氧化物荧光体。 氮氧化物荧光体的通式为MxAyBzOuNv(0.00001≦̸ x≦̸ 5; 0.00001≦̸ y≦̸ 3; 0.00001≦̸ z≦̸ 6; 0.00001≦̸ u≦̸ 12; 0.00001≦̸ v≦̸ 12)。 M是活化剂或活化剂的混合物。 A是二价元素或二价元素的混合物。 B是三价元素,四价元素,三价元素的混合物或四价元素的混合物。 O是单价元素,二价元素,单价元素的混合物或二价元素的混合物。 N是一价元素,二价元素,三价元素,一价元素的混合物,二价元素的混合物或三价元素的混合物。 因此,可以批量生产纯的磷光体。