公开(公告)号：US09318350B2

公开(公告)日：2016-04-19

申请号：US13936936

申请日：2013-07-08

Applicant: General Dynamics Advanced Information Systems, Inc.

Inventor： Deepak Keshav Pai ,  Melvin Eric Graf

IPC: B23K26/362 ,  H01L21/50 ,  H01L21/60 ,  H01L21/48 ,  B23K26/36 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L21/4821 ,  B23K26/361 ,  B23K26/362 ,  H01L21/50 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/10848 ,  H01L2924/00

Abstract: An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.

Abstract translation: 本发明的一个实施方案一般涉及通过激光加工一部分电引线将商业现货电导线转换成坚固的现成的电引线的方法。 该方法包括从商业现成部件的电引线上烧掉材料以减少转动惯量或增加电引线的灵活性。

公开(公告)号：US08559017B2

公开(公告)日：2013-10-15

申请号：US13225127

申请日：2011-09-02

Applicant: Timothy J. Schulz ,  Richard G. Paxman

Inventor： Timothy J. Schulz ,  Richard G. Paxman

IPC: G01B11/27

CPC classification number: G02B7/183 ,  G02B7/1822 ,  G02B26/06

Abstract: A method for aligning a plurality of sub-apertures of a multiple-aperture imaging system including, but not limited to, identifying one sub-aperture to serve as a reference sub-aperture, actuating the reference sub-aperture in a series of piston steps of a known amount, collecting data relating to each image of a plurality of images of a point object, each image corresponding to a respective piston step, compiling the data into a three-dimensional data cube, detecting a plurality of fringes positioned within the three-dimensional data cube, determining the relative location of each sub-aperture of the plurality of sub-apertures based on a location of each fringe of the plurality of fringes within the three-dimensional data cube, and actuating a piston associated with at least one sub-aperture based, at least in part, on the relative location to move the at least one sub-aperture into alignment with another sub-aperture and repeating with each remaining sub-aperture until all sub-apertures are at substantially the same piston height.

Abstract translation: 一种用于对准多孔成像系统的多个子孔径的方法，包括但不限于识别一个子孔径以用作参考子孔径，在一系列活塞步骤中致动参考子孔径 收集与点对象的多个图像的每个图像有关的数据，每个图像对应于相应的活塞步骤，将数据编译成三维数据立方体，检测位于三维数据立方体内的多个条纹 基于三维数据立方体内的多个条纹中的每个边缘的位置来确定多个子孔径中的每个子孔径的相对位置，以及致动与至少一个子孔径相关联的活塞 至少部分地基于将所述至少一个子孔移动到与另一个子孔对准并且与每个剩余子孔重复的相对位置的子孔径，直到所有亚 - res处于基本相同的活塞高度。

公开(公告)号：US08502072B2

公开(公告)日：2013-08-06

申请号：US12801242

申请日：2010-05-28

Applicant: Frederick Paul Gehrke ,  Dennis Paul Dyer ,  James Ronald Baughan

Inventor： Frederick Paul Gehrke ,  Dennis Paul Dyer ,  James Ronald Baughan

IPC: H02G15/02

CPC classification number: H02G15/18 ,  H01B7/2825 ,  H01R9/03 ,  H01R13/405 ,  H01R13/504 ,  H01R13/5216 ,  Y10T29/49169

Abstract: A cable includes an outer jacket of polyethylene surrounding a plurality of conductive wires. Each one of the plurality of insulated conductive wires comprises a conductive core and an insulating layer surrounding the conductive core, the insulating layer being made of cross-linked polyethylene.

Abstract translation: 电缆包括围绕多根导线的聚乙烯外护套。 多个绝缘导线中的每一个包括导电芯和围绕导电芯的绝缘层，绝缘层由交联聚乙烯制成。

公开(公告)号：US08428259B2

公开(公告)日：2013-04-23

申请号：US11148318

申请日：2005-06-09

Applicant: James P. Waters

Inventor： James P. Waters

IPC: H04L29/06

CPC classification number: H04K1/00 ,  H04J14/02

Abstract: The present invention relates to an apparatus and method for the encryption and decryption of optically transmitted data, and more particularly to the encryption and decryption of optical data transmitted and received using only optical components. Because only optical components are used, the encryption and decryption is independent of the data rate of the optical signal. The apparatus may include an encryption device that operates by receiving and combining both an unencrypted optical signal as well as a delayed optical signal that is based on the unencrypted optical signal. An optical delay may be configured in a number of different ways and may be used for delaying the unencrypted optical signal. The apparatus may further include a decryption device that receives and combines an encrypted optical signal as well as a delayed optical signal that is based on the encrypted optical signal. An optical delay may be configured in a number of different ways and may be used for delaying the encrypted optical signal. To properly work together, the apparatus and method require that the optical delay on the encryption side perfectly match the optical delay on the decryption side in both the length of delay and arrangement.

Abstract translation: 本发明涉及一种用于光学传输数据的加密和解密的装置和方法，更具体地涉及仅使用光学部件发送和接收的光学数据的加密和解密。 由于仅使用光学部件，加密和解密与光信号的数据速率无关。 该装置可以包括通过接收并组合未加密的光信号以及基于未加密的光信号的延迟的光信号来操作的加密装置。 光延迟可以以多种不同的方式配置，并且可以用于延迟未加密的光信号。 该装置还可以包括解密装置，其接收并组合加密的光信号以及基于经加密的光信号的延迟的光信号。 光延迟可以以多种不同的方式配置，并且可以用于延迟加密的光信号。 为了正确地协同工作，该装置和方法要求加密侧的光延迟在延迟和布置长度方面完全匹配解密侧的光延迟。

公开(公告)号：US08196291B2

公开(公告)日：2012-06-12

申请号：US11979487

申请日：2007-11-05

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: H01R43/00

CPC classification number: H05K3/3426 ,  H01L21/4821 ,  H01R43/16 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A system method for manufacturing leads is provided. The method includes providing a conductive sheet, shaping the conductive sheet into at least two opposing longitudinal strips and a plurality of interposing strips, masking lateral sides and a center of the plurality of interposing strips, covering the exposed surface with a conductor and severing the conductive sheet at least along center mask. The plurality of interposing strips are preferably flexible and configurable into desired shapes for potential future attachment to an integrated circuit.

Abstract translation: 提供一种用于制造引线的系统方法。 该方法包括提供导电片，将导电片成形为至少两个相对的纵向条和多个插入条，掩蔽多个插入条的横向侧和中心，用导体覆盖暴露的表面并切断导电 至少沿中心面膜。 多个插入条优选地是柔性的并且可配置成期望的形状，用于将来可能连接到集成电路。

公开(公告)号：US20110157855A1

公开(公告)日：2011-06-30

申请号：US13042903

申请日：2011-03-08

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: H05K7/00 ,  B23K31/02 ,  B23K31/12 ,  B23K1/20

CPC classification number: H05K3/341 ,  H01L23/4822 ,  H01L24/13 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method is provided for connecting an integrated circuit to a surface of a printed wiring board. The integrated circuit includes lead contacts and leadless contact pads. A first solder paste is applied to the leadless contact pads of the integrated circuit, and preformed conductive pieces are placed on the first solder paste. The preformed conductive pieces are slugs that have, for example, a cylindrical shape or a rectangular cross-section. The preformed conductive pieces are heated and brought into electrical contact with the leadless contact pads. The lead contacts are formed into gull wings. The bases of the preformed conductive pieces are generally aligned in a plane, and the bases of the gull wings are substantially coplanar with the plane such that they collectively generally define a contact plane. A second solder paste is applied on the surface, and the bases of the gull wings and the preformed conductive pieces are soldered to the second solder paste on the surface so that the integrated circuit is in electrical contact with the surface through both the leadless contact pads and the lead contacts. The preformed conductive pieces comprise a conductive material (e.g., a copper alloy) that has a higher melting point than the first solder paste and the second solder paste such that the preformed conductive pieces do not melt during heating or soldering that is described above.

Abstract translation: 提供了一种用于将集成电路连接到印刷电路板的表面的方法。 集成电路包括引线触点和无引线接触焊盘。 将第一焊膏施加到集成电路的无引线接触焊盘，并将预成型的导电片放置在第一焊膏上。 预成型的导电片是具有例如圆柱形或矩形横截面的块塞。 预成型的导电片被加热并与无引线接触垫电接触。 铅触点形成鸥翼。 预制导电片的基部通常在平面中对准，并且鸥翼的基部与平面基本共面，使得它们共同地限定接触平面。 在表面上施加第二焊膏，并且将鸥翼和预成型导电片的基底焊接到表面上的第二焊膏，使得集成电路通过两个无引线接触焊盘与表面电接触 和铅触点。 预成型的导电片包括具有比第一焊膏和第二焊膏更高的熔点的导电材料（例如，铜合金），使得预先形成的导电片在上述加热或焊接期间不熔化。

公开(公告)号：US20110101075A1

公开(公告)日：2011-05-05

申请号：US12929224

申请日：2011-01-10

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: B23K31/12 ,  B23K31/02 ,  B23K1/20

CPC classification number: H05K3/341 ,  H01L23/4822 ,  H01L24/13 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface.

Abstract translation: 提供了一种用于制备用于连接到表面的集成电路的方法，所述集成电路包括引线触点和无引线触点。 该方法包括提供集成电路，将第一焊膏施加到无引线触点，在所施加的焊膏上形成焊球，加热焊球，从而去除至少一部分第一焊膏并使焊球进入电 与无引线触点接触，焊球的基部通常在平面中对准，并且将引线触点弯曲成鸥翼，鸥翼的基部与平面基本上共面。 鸥翼的基部和至少一个焊球的基部通常限定接触平面，以便将来与表面接触。

公开(公告)号：US07802046B2

公开(公告)日：2010-09-21

申请号：US12068504

申请日：2008-02-07

Applicant: Bobby Jim Kowalski ,  Ronald R. Denny

Inventor： Bobby Jim Kowalski ,  Ronald R. Denny

IPC: G06F13/40

CPC classification number: G06F13/409

Abstract: A method of and architecture for controlling board elements in an orthogonal system architecture is provided. The method and architecture preferably utilize an internal bus architecture between control boards, such that a first control board can access board elements in its stack via I/O on a second control board and the second control board can access board elements in its stack via I/O on the first control board. Most preferably the internal bus architecture is a HyperTransport bus architecture.

Abstract translation: 提供了一种用于控制正交系统架构中的板单元的方法和架构。 该方法和架构优选地利用控制板之间的内部总线架构，使得第一控制板可以通过第二控制板上的I / O来访问其堆栈中的板单元，并且第二控制板可以经由I访问其栈中的板单元 / O在第一个控制板上。 最优选的内部总线架构是HyperTransport总线架构。

公开(公告)号：US07801250B2

公开(公告)日：2010-09-21

申请号：US11439310

申请日：2006-05-24

Applicant: Michael G. Binkley

Inventor： Michael G. Binkley

IPC: H04L27/32 ,  H04L27/38

CPC classification number: H04L27/3818

Abstract: A digital demodulation method for a quadrature amplitude modulated signal uses a phase locked loop to generate a local carrier signal. The phase locked loop uses a feedback signal derived from one or more demodulated signals of interest. The loop has a filter characteristic with a stop band within the information bandwidth(s) of the information signal(s). The preferred method generates an error signal from DC components of in-phase and quadrature-phase baseband signals. DC components are preferably isolated using a low-latency, AC rejection filter.

Abstract translation: 用于正交幅度调制信号的数字解调方法使用锁相环来产生本地载波信号。 锁相环使用从感兴趣的一个或多个解调信号导出的反馈信号。 环路具有在信息信号的信息带宽内具有阻带的滤波器特性。 优选的方法从同相和正交相位基带信号的直流分量产生误差信号。 DC分量优选使用低延迟的AC拒绝滤波器来隔离。

公开(公告)号：US20100185566A1

公开(公告)日：2010-07-22

申请号：US11066332

申请日：2005-02-25

Applicant: Wade F. Schott ,  Thanh A. Diep

Inventor： Wade F. Schott ,  Thanh A. Diep

IPC: G06F15/00

CPC classification number: G06N5/043

Abstract: The present invention relates to a system and method for problem solving using intelligent agents. The intelligent agents may be embodied as processor-readable software code stored on a processor-readable medium. The intelligent agents may include a brain agent to parse the input and direct the parsed input query to other intelligent agents within the system. The apparatus and method may use, for example, a personality agent, a language agent, a knowledge agent, a mood agent, a visual agent, sound agent, a tactile agent, and a smell/taste agent and various connectors to external data sources or other intelligent systems to interpret questions and provide responses back to the user. The apparatus and method may further parse questions in a conceptual manner. The apparatus and method may further optimize its system performance by evolving with and reacting to specific user interactions. Thus, the present invention may be configured to receive a human question and to output a human answer.

Abstract translation: 本发明涉及一种使用智能代理解决问题的系统和方法。 智能代理可以被实现为存储在处理器可读介质上的处理器可读软件代码。 智能代理可以包括大脑代理来解析输入并将解析的输入查询引导到系统内的其他智能代理。 该装置和方法可以使用例如个性代理，语言代理，知识代理，情绪代理，视觉代理，声音代理，触觉代理和气味/味觉代理以及与外部数据源的各种连接器 或其他智能系统来解释问题并向用户提供响应。 该装置和方法可以进一步以概念的方式解析问题。 该装置和方法可以通过与具体的用户交互进行演变和响应来进一步优化其系统性能。 因此，本发明可以被配置为接收人的问题并输出人的答案。