公开(公告)号：US10658090B2

公开(公告)日：2020-05-19

申请号：US16297620

申请日：2019-03-09

Applicant: Soltrium Advanced Materials Technology, Ltd. Suzhou

Inventor： Jie Zhang ,  Xiaoli Liu ,  Fengzhen Sun ,  Delin Li

IPC: H01B1/22 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/068 ,  H01L31/18 ,  B22F7/08

Abstract: A front-side conductive paste for a crystalline silicon solar cell chip is provided. The front-side conductive paste for a crystalline silicon solar cell chip includes, in parts by weight, 80.0-93.0 parts of a metal powder, 6.0-15.0 parts of an organic carrier, and 1.0-5.0 parts of an oxide etching agent. The oxide etching agent contains at least 10-40% of MgO, 0.1-5% of PbO, and 5-30% of Li2O based on 100% by mole, with the molar ratio of MgO:PbO being 10:5˜40:0.1, and the mole ratio of MgO:Li2O being 10:30˜40:5. The metal powder forms good ohmic contact with crystalline silicon substrate during the sintering process of the front-side conductive paste applied overlying an insulation film on the substrate. Finally, a front-side electrode of low contact resistance, good electrical conductivity, and strong adhesion is obtained.

公开(公告)号：US12006447B2

公开(公告)日：2024-06-11

申请号：US17413564

申请日：2020-01-17

Applicant: Soltrium Advanced Materials Technology, Ltd

Inventor： Wen Shi ,  Fengzhen Sun ,  Delin Li

IPC: C09J11/04 ,  C08K3/08 ,  C08K5/5415 ,  C08K7/00 ,  C08K9/02 ,  C09J9/02 ,  C09J11/06 ,  C09J163/00

CPC classification number: C09J11/04 ,  C08K3/08 ,  C08K5/5415 ,  C08K7/00 ,  C08K9/02 ,  C09J9/02 ,  C09J11/06 ,  C09J163/00 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/005

Abstract: An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

公开(公告)号：US20220348799A1

公开(公告)日：2022-11-03

申请号：US17413564

申请日：2020-01-17

Applicant: Soltrium Advanced Materials Technology, Ltd

Inventor： Wen Shi ,  Fengzhen Sun ,  Dein Ll

IPC: C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C08K3/08 ,  C08K9/02 ,  C08K5/5415 ,  C08K7/00 ,  C09J9/02

Abstract: An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

公开(公告)号：US20220340794A1

公开(公告)日：2022-10-27

申请号：US17413565

申请日：2020-01-17

Applicant: SOLTRIUM ADVANCED MATERIALS TECHNOLOGY, LTD SHENZHEN

Inventor： Wen Shi ,  Fengzhen Sun ,  Delin LI

IPC: C09J163/10 ,  C08K3/08 ,  C08K9/02 ,  C08K7/18

Abstract: A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.

公开(公告)号：US09508877B2

公开(公告)日：2016-11-29

申请号：US15155199

申请日：2016-05-16

Applicant: Xiaoli Liu ,  Delin Li

Inventor： Xiaoli Liu ,  Delin Li

IPC: H01L21/00 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/028 ,  H01L31/068 ,  H01L31/18

CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

Abstract: The present invention provides a method for manufacturing a front electrode of a semiconductor device. The method includes using an electrically conductive paste composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

Abstract translation: 本发明提供一种半导体器件的前电极的制造方法。 该方法包括使用由无玻璃腐蚀粘合剂，金属粉末和有机载体构成的导电糊剂。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

公开(公告)号：US20220351876A1

公开(公告)日：2022-11-03

申请号：US17413563

申请日：2020-01-17

Applicant: Soltrium Advanced Materials Technology, Ltd.

Inventor： Weiteng Feng ,  Fengzhen Sun ,  Delin LI

IPC: H01B1/22 ,  C08K3/08 ,  C08K7/18

Abstract: An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

公开(公告)号：US10902971B2

公开(公告)日：2021-01-26

申请号：US16840344

申请日：2020-04-04

Applicant: Soltrium Advanced Materials Technology, Ltd

Inventor： Jie Zhang ,  Xiaoli Liu ,  Fengzhen Sun ,  Delin Li

IPC: H01L31/0216 ,  H01L31/0224 ,  H01L31/18 ,  H01L31/068 ,  H01B1/22 ,  B22F7/08

Abstract: A front-side conductive paste for a crystalline silicon solar cell chip is provided. The front-side conductive paste for a crystalline silicon solar cell chip includes, in parts by weight, 80.0-93.0 parts of a metal powder, 6.0-15.0 parts of an organic carrier, and 1.0-5.0 parts of an oxide etching agent. The oxide etching agent contains at least 10-40% of MgO, 0.1-5% of PbO, and 5-30% of Li2O based on 100% by mole, with the molar ratio of MgO:PbO being 10:5˜40:0.1, and the mole ratio of MgO:Li2O being 10:30˜40:5. The metal powder forms good ohmic contact with crystalline silicon substrate during the sintering process of the front-side conductive paste applied overlying an insulation film on the substrate. Finally, a front-side electrode of low contact resistance, good electrical conductivity, and strong adhesion is obtained.