公开(公告)号：US20160260851A1

公开(公告)日：2016-09-08

申请号：US15155199

申请日：2016-05-16

Applicant: Xiaoli Liu ,  Delin Li

Inventor： Xiaoli Liu ,  Delin Li

IPC: H01L31/0224 ,  H01L31/18 ,  H01L31/068 ,  H01L31/0216 ,  H01L31/028

CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

Abstract: The present invention provides a method for manufacturing a front electrode of a semiconductor device. The method includes using an electrically conductive paste composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

Abstract translation: 本发明提供一种半导体器件的前电极的制造方法。 该方法包括使用由无玻璃腐蚀粘合剂，金属粉末和有机载体构成的导电糊剂。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

公开(公告)号：US20140287583A1

公开(公告)日：2014-09-25

申请号：US13894908

申请日：2013-06-21

Applicant: Xiaoli Liu ,  Ran Guo ,  Delin Li

Inventor： Xiaoli Liu ,  Ran Guo ,  Delin Li

IPC: H01L21/288

CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

Abstract: The present invention provides an electrically conductive paste for a front electrode of a solar cell and a preparation method thereof. The electrically conductive paste is composed of a corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more glass-free Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

Abstract translation: 本发明提供一种太阳能电池的前电极用导电性糊剂及其制备方法。 导电浆料由腐蚀粘合剂，金属粉末和有机载体组成。 腐蚀粘合剂是一种或多种无玻璃的Pb-Te基结晶化合物，其熔融温度在440℃至760℃的范围内。在用于形成电极的导电浆料的烧结过程中，腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

公开(公告)号：US09023253B2

公开(公告)日：2015-05-05

申请号：US13787997

申请日：2013-03-07

Applicant: Xiaoli Liu ,  Ran Guo ,  Delin Li

Inventor： Xiaoli Liu ,  Ran Guo ,  Delin Li

IPC: H01B1/02 ,  H01B1/22 ,  H01L31/0224

CPC classification number: C09D5/24 ,  H01B1/16 ,  H01L31/022425 ,  H01L31/18 ,  Y02E10/50

Abstract: The present invention provides a conductive paste characterized by a crystal-based corrosion binder being combined with a glass frit and mixed with a metallic powder and an organic carrier. Methods for preparing each components of the conductive paste are disclosed including several embodiments of prepare Pb—Te—O-based crystal corrosion binder characterized by melting temperatures in a range of 440° C. to 760° C. and substantially free of any glass softening transition upon increasing temperature. Method for preparing the conductive paste includes mixture of the components and a grinding process to ensure all particle sizes in a range of 0.1 to 5.0 microns. Method of applying the conductive paste for the formation of a front electrode of a semiconductor device is presented to illustrate the effectiveness of the crystal-based corrosion binder in transforming the conductive paste to a metallic electrode with good ohmic contact with semiconductor surface.

Abstract translation: 本发明提供了一种导电性糊料，其特征在于将结晶型腐蚀粘合剂与玻璃料组合并与金属粉末和有机载体混合。 公开了制备导电浆料各组分的方法，其包括制备Pb-Te-O基结晶腐蚀粘合剂的几个实施方案，其特征在于在440℃至760℃的范围内的熔融温度，并且基本上不含任何玻璃软化 温度升高时过渡。 制备导电浆料的方法包括组分的混合物和研磨过程，以确保所有粒径在0.1至5.0微米的范围内。 提出了施加用于形成半导体器件的前电极的导电膏的方法，以说明晶体腐蚀粘合剂在将导电膏转化为具有与半导体表面的欧姆接触良好的金属电极的有效性。

公开(公告)号：US09508877B2

公开(公告)日：2016-11-29

申请号：US15155199

申请日：2016-05-16

Applicant: Xiaoli Liu ,  Delin Li

Inventor： Xiaoli Liu ,  Delin Li

IPC: H01L21/00 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/028 ,  H01L31/068 ,  H01L31/18

CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

Abstract: The present invention provides a method for manufacturing a front electrode of a semiconductor device. The method includes using an electrically conductive paste composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

Abstract translation: 本发明提供一种半导体器件的前电极的制造方法。 该方法包括使用由无玻璃腐蚀粘合剂，金属粉末和有机载体构成的导电糊剂。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

公开(公告)号：US20160260850A1

公开(公告)日：2016-09-08

申请号：US15155192

申请日：2016-05-16

Applicant: Xiaoli Liu ,  Delin Li

Inventor： Xiaoli Liu ,  Delin Li

IPC: H01L31/0224 ,  C09D5/24 ,  H01B1/22

CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

Abstract: The present invention provides an electrically conductive paste for a front electrode of a solar cell and a preparation method thereof. The electrically conductive paste is composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

Abstract translation: 本发明提供一种太阳能电池的前电极用导电性糊剂及其制备方法。 导电糊料由无玻璃腐蚀粘合剂，金属粉末和有机载体组成。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

公开(公告)号：US09178090B2

公开(公告)日：2015-11-03

申请号：US13941012

申请日：2013-07-12

Applicant: Delin Li

Inventor： Delin Li

IPC: C23C16/54 ,  H01L21/67 ,  H01L31/0392 ,  H01L31/032 ,  C23C16/455

CPC classification number: H01L31/03928 ,  C23C16/45561 ,  C23C16/545 ,  H01L21/67155 ,  H01L21/67161 ,  H01L21/67173 ,  H01L22/10 ,  H01L22/26 ,  H01L31/0322 ,  H01L31/18 ,  Y02E10/541

Abstract: The present invention provides an apparatus and a method for manufacturing a CIGS absorber of a thin film solar cell. The apparatus includes a supply chamber configured to provide a flexible substrate coated with precursors. The apparatus further includes a reaction chamber coupled to the supply chamber for at least subjecting the precursors on the flexible substrate to a reactive gas at a first state to form an absorber material. Additionally, the apparatus includes a gas-balancing chamber filled with the reactive gas at a second state. The gas-balancing chamber is communicated with the reaction chamber for automatically updating the first state of the reactive gas to the second state. Moreover, the apparatus includes a control system to maintain the second state of the reactive gas in the gas-balancing chamber at a preset condition and to adjust the transportation of the flexible substrate through the reaction chamber.

Abstract translation: 本发明提供一种用于制造薄膜太阳能电池的CIGS吸收体的装置和方法。 该设备包括供应室，其构造成提供涂覆有前体的柔性基材。 该装置还包括耦合到供应室的反应室，用于至少使柔性基板上的前体经受第一状态的反应性气体以形成吸收材料。 另外，该装置包括在第二状态下填充有反应性气体的气体平衡室。 气体平衡室与反应室连通，用于将反应气体的第一状态自动更新为第二状态。 此外，该装置包括将气体平衡室中的反应气体的第二状态保持在预设状态并调节柔性基板通过反应室的输送的控制系统。

公开(公告)号：US07705467B2

公开(公告)日：2010-04-27

申请号：US11769536

申请日：2007-06-27

Applicant: Delin Li

Inventor： Delin Li

IPC: H01L23/34

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.

Abstract translation: 电气部件包括衬底，附接到衬底的第一集成电路，耦合到第一集成电路的金属部分和附接到第一集成电路的第二集成电路。 金属部分夹在第一集成电路和第二集成电路之间。

公开(公告)号：US20060003494A1

公开(公告)日：2006-01-05

申请号：US10880998

申请日：2004-06-30

Applicant: Delin Li

Inventor： Delin Li

IPC: H01L21/44

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.

Abstract translation: 电气部件包括衬底，附接到衬底的第一集成电路，耦合到第一集成电路的金属部分和附接到第一集成电路的第二集成电路。 金属部分夹在第一集成电路和第二集成电路之间。

公开(公告)号：US20050018975A1

公开(公告)日：2005-01-27

申请号：US10625255

申请日：2003-07-23

Applicant: Yen-Ping Ho ,  Delin Li

Inventor： Yen-Ping Ho ,  Delin Li

IPC: G02B6/42 ,  G02B6/36

CPC classification number: G02B6/4202 ,  G02B6/4238

Abstract: An optical component formed from a fiber directly coupled to a photodiode without any intervening optical components such as mirrors or lenses is disclosed. The optical component includes a stripped optical fiber having a core with a flat distal end that extends through a ferrule. The distal flat end of the core is printed with an annular coating of metal leaving a central portion of the core uncovered. The coated flat end of the core is initially aligned with an aperture or active area of a rear side of a back-illuminated photodiode which also includes a coating of metal. With the two parts in abutting engagement, a reflow or a partial melting process is carried out to directly couple the fiber core to the photodiode.

公开(公告)号：US06601292B2

公开(公告)日：2003-08-05

申请号：US09891697

申请日：2001-06-26

Applicant: Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

Inventor： Delin Li ,  Jay DeAvis Baker ,  Achyuta Achari ,  Brenda Joyce Nation ,  John Trublowski

IPC: H05K300

CPC classification number: H05K3/361 ,  H05K1/0293 ,  H05K1/117 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/053 ,  H05K2201/09127 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2203/0228 ,  H05K2203/175 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/4973 ,  Y10T29/49732

Abstract: A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.

Abstract translation: 用于制造和修复第一和第二电路之间的连接的方法，例如柔性电路。 物品10包括：具有第一和第二边缘14/16的柔性电介质基底12和布置在基底上或内部的多个导电电路迹线18，其中每个迹线从靠近第一边缘14延伸到接近第二边缘14 每个电路迹线18包括：靠近第一边缘14设置的第一连接特征20; 设置在第二边缘16附近的第二连接特征22; 以及设置在第一和第二边缘14/16之间的至少一个第三连接特征24。 第一，第二和第三连接特征20/22/24中的每一个是电镀通孔，电镀盲孔或安装垫。 本文10可以用于使用第一和第二连接特征20/22（例如通过焊接）将第一和第二电路50/60连接在一起。 如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品10以便呈现一组第三连接特征24，新的替换电路可以连接到该组。