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1.发明授权公开(公告)号：US11499855B2
公开(公告)日：2022-11-15
申请号：US16702214
申请日：2019-12-03
发明人： Kader Mekias
IPC分类号： G01F1/684 , F16K31/126 , H01L21/67
摘要： Disclosed is an apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device, in particular a coater or a bonder. The apparatus includes a sealing structure arranged in the pipe, a flow structure having a fluid inlet arranged upstream of the sealing structure and a fluid outlet arranged downstream of the sealing structure, a first chamber arranged in the pipe upstream of the sealing structure, and a second chamber arranged in the pipe downstream of the sealing structure, and a measuring device, wherein the measuring device is adapted to measure a first fluid pressure in the first chamber and a second fluid pressure in the second chamber, wherein the measuring device is configured to determine the fluid flow based on the first and second fluid pressure.
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公开(公告)号：US11049746B2
公开(公告)日：2021-06-29
申请号：US16704875
申请日：2019-12-05
发明人： Bernhard Bogner
IPC分类号： H01L21/673
摘要： A substrate cassette for housing several substrates stacked on top of each other, in particular wafers, has a housing that comprises a first side and a second side that is parallel to the first side, wherein at least an elongated first support is provided for a substrate within the housing between the sides, said support being spaced apart at least in sections from the first side, wherein the first side is closest to said at least one first support.
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公开(公告)号：US20210063863A1
公开(公告)日：2021-03-04
申请号：US17010553
申请日：2020-09-02
摘要： A method for assessing the quality of a multi-channel micro- and/or subwavelength-optical projection unit is disclosed. The method comprises the following steps: At least a predefined portion of the optical projection unit is illuminated so that an image is generated by at least two channels of the predefined portion of the multi-channel optical projection unit. At least one characteristic quantity is determined based on the analysis of the image, wherein a value of the characteristic quantity is associated with a characteristic feature of the projection unit, a defect of the projection unit and/or a defect class of the projection unit. The quality of the projection unit is assessed based on the at least one characteristic quantity. Moreover, a test system for assessing the quality of a multi-channel micro- and/or subwavelength-optical projection unit and a computer program are disclosed
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公开(公告)号：US10688524B2
公开(公告)日：2020-06-23
申请号：US14861117
申请日：2015-09-22
摘要： A method for coating a substrate with a lacquer includes spraying lacquer onto the substrate and subsequently spraying the applied lacquer with solvent. In some embodiments, before the solvent is sprayed the lacquer is heated. Also disclosed is a corresponding coating device for lacquering substrates.
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5.发明授权公开(公告)号：US10580678B2
公开(公告)日：2020-03-03
申请号：US15801813
申请日：2017-11-02
发明人： Hale Johnson , Gregory George , Michael Brennen
IPC分类号： H01L21/68 , H01L21/67 , H01L21/683
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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公开(公告)号：US10343292B2
公开(公告)日：2019-07-09
申请号：US15875708
申请日：2018-01-19
发明人： Bernhard Bogner
IPC分类号： B25J15/06 , H01L21/683 , H01L21/687 , B32B15/04 , G03F7/20 , B25J15/00
摘要： An end effector for holding substrates has a multi-layered main body and a fluid channel which is provided in the main body. The main body has a receiving end and a fastening end, and include at least two layers, wherein at least one of the layers is not inherently stable, and is formed from a synthetic material film.
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公开(公告)号：US10232405B2
公开(公告)日：2019-03-19
申请号：US14861105
申请日：2015-09-22
摘要： A method for coating a substrate with a lacquer is disclosed. First, the lacquer is uniformly applied to the substrate. Then, the solvent proportion of the lacquer applied to the substrate is reduced, and the coated substrate is exposed to a solvent atmosphere. In some embodiments, the lacquer is heated. The invention also relates to a device for planarizing a lacquer layer.
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8.发明授权公开(公告)号：US09837295B2
公开(公告)日：2017-12-05
申请号：US14330536
申请日：2014-07-14
发明人： Hale Johnson , Gregory George , Michael Brennen
IPC分类号： B23B31/28 , H01L21/683 , H01L21/68 , H01L21/67
CPC分类号： H01L21/68 , H01L21/67092 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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公开(公告)号：US09799554B2
公开(公告)日：2017-10-24
申请号：US15093834
申请日：2016-04-08
IPC分类号： H01L21/48 , H01L21/768 , H01L21/02
CPC分类号： H01L21/76831 , H01L21/02118 , H01L21/02282 , H01L21/02307 , H01L21/02315 , H01L21/6715 , H01L21/76898
摘要： A method for coating substrates provided with vias uses a first step in which the substrate is conditioned and a second step in which the substrate is coated with an electrically insulating material such that the vias are filled up completely.
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10.发明授权公开(公告)号：US08919412B2
公开(公告)日：2014-12-30
申请号：US12760973
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
发明人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10 , H01L21/67 , B32B43/00 , H01L21/683 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.
摘要翻译： 用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴 驱动控制。 顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。 包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而 使得器件晶片分离并从载体晶片滑离。
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