Method of forming an integrated circuit having varying substrate depth
    1.
    发明授权
    Method of forming an integrated circuit having varying substrate depth 有权
    形成具有变化的衬底深度的集成电路的方法

    公开(公告)号:US08921203B2

    公开(公告)日:2014-12-30

    申请号:US13750419

    申请日:2013-01-25

    IPC分类号: H01L21/30

    摘要: A method for forming a semiconductor device includes providing a substrate having a first major surface and a second major surface, removing a first portion of the substrate to form a cavity at the first major surface of the substrate, bonding the first major surface of the substrate to a carrier substrate after forming the cavity, and reducing a thickness of the substrate. The method further includes forming a first accelerometer device at the second major surface such that at least a portion of the first accelerometer device is over the cavity and forming a second accelerometer device at the second major surface such that the second accelerometer device is not disposed over the cavity.

    摘要翻译: 一种形成半导体器件的方法包括提供具有第一主表面和第二主表面的衬底,去除衬底的第一部分以在衬底的第一主表面处形成空腔,将衬底的第一主表面 在形成空腔之后到载体基板,并且减小基板的厚度。 该方法还包括在第二主表面处形成第一加速度计装置,使得第一加速度计装置的至少一部分在空腔之上并且在第二主表面处形成第二加速度计装置,使得第二加速度计装置不被布置在 空腔。

    Multiaxial monolithic acceleration sensor
    2.
    发明申请
    Multiaxial monolithic acceleration sensor 审中-公开
    多轴单片加速度传感器

    公开(公告)号:US20060021436A1

    公开(公告)日:2006-02-02

    申请号:US10517808

    申请日:2003-06-10

    IPC分类号: G01P15/18 G01P15/02

    摘要: A multi-axial monolithic acceleration sensor has the following features. The acceleration sensor consists of plural individual sensors with respectively a main sensitivity axis arranged on a common substrate. Each individual sensor is rotatably moveably suspended on two torsion spring elements and has a seismic mass with a center of gravity. Each individual sensor has components that measure the deflection of the seismic mass. The acceleration sensor preferably consists of at least three identical individual sensors. Each individual sensor is suspended eccentrically relative to its center of gravity and is rotated by 90°, 180° or 270° relative to the other individual sensors.

    摘要翻译: 多轴单片加速度传感器具有以下特点。 加速度传感器由多个单独的传感器组成,分别具有布置在公共基板上的主灵敏度轴。 每个单独的传感器可旋转地可移动地悬挂在两个扭转弹簧元件上并且具有重心的地震质量。 每个单独的传感器具有测量地震质量的偏转的组件。 加速度传感器优选地由至少三个相同的单独传感器组成。 每个传感器相对于其重心偏心悬挂,并相对于其他单独的传感器旋转90°,180°或270°。

    Instrument for measuring accelerations and process of making the same
    3.
    发明授权
    Instrument for measuring accelerations and process of making the same 失效
    用于测量加速度的仪器及其制造方法

    公开(公告)号:US5065628A

    公开(公告)日:1991-11-19

    申请号:US477964

    申请日:1990-06-04

    申请人: Wolfgang Benecke

    发明人: Wolfgang Benecke

    摘要: Disclosed is an instrument for measuring accelerations, with the aid of which changes in motion in the three axes of space can be measured with selective sensitivity.In order to detect multi-dimensional changes in motion, three micromechanical sensors, each sensitive to the acceleration in a selected direction, are integrated in a crystal. The sensors are composed of torsion bars having masses eccentrically attached thereto, which, in the event of changes in motion, exercise torques about the axes of the torsion bars. The torques are measured with the aid of integrated piezo-resistances. The planar integration of the acceleration meter permits integrating the evaluation circuit on the same semiconductor surface.Acceleration meters of this kind are fabricated with the prescribed process in planar technology with the aid of epitaxy, lithography and anisotropic etching methods.High precision and high miniaturization make this acceleration meter suited for application in overland and aviation navigation and for component positioning in robotry.

    摘要翻译: PCT No.PCT / DE88 / 00740 Sec。 371日期1990年6月4日第 102(e)日期1990年6月4日PCT提交1988年12月1日PCT公布。 出版物WO89 / 05459 日期:1989年6月15日。公开是一种用于测量加速度的仪器,借助于这三种空间轴的运动变化可以选择灵敏度测量。 为了检测运动中的多维变化,每个对所选方向的加速度敏感的三个微机械传感器被集成在晶体中。 传感器由具有偏心连接到其上的质量块的扭杆组成,其在运动变化的情况下围绕扭杆的轴线的运动扭矩。 借助于集成的压电阻测量扭矩。 加速度计的平面集成允许将评估电路集成在相同的半导体表面上。 借助于外延,光刻和各向异性蚀刻方法,这种加速度计在平面技术中用规定的工艺制造。 高精度和高度小型化使得该加速度计适用于陆上和航空导航以及机器人部件定位。

    Semiconductor device including accelerometer devices
    4.
    发明授权
    Semiconductor device including accelerometer devices 有权
    半导体装置包括加速度计装置

    公开(公告)号:US09233836B2

    公开(公告)日:2016-01-12

    申请号:US14561726

    申请日:2014-12-05

    摘要: A semiconductor device is formed such that a semiconductor substrate of the device has a non-uniform thickness. A cavity is etched at a selected side of the semiconductor substrate, and the selected side is then fusion bonded to another substrate, such as a carrier substrate. After fusion bonding, the side of the semiconductor substrate opposite the selected side is ground to a defined thickness. Accordingly, the semiconductor substrate has a uniform thickness except in the area of the cavity, where the substrate is thinner. Devices that benefit from a thinner substrate, such as an accelerometer, can be formed over the cavity.

    摘要翻译: 半导体器件形成为使得器件的半导体衬底具有不均匀的厚度。 在半导体衬底的选定侧蚀刻空腔,然后将所选择的侧面熔合到另一衬底,例如载体衬底。 在熔接后,将半导体衬底与选定侧相对的侧面被研磨成规定的厚度。 因此,半导体衬底除了空腔的区域之外具有均匀的厚度,其中衬底较薄。 可以在空腔上形成从更薄的衬底(例如加速度计)受益的器件。

    Micromechanical capacitive acceleration sensor
    5.
    发明授权
    Micromechanical capacitive acceleration sensor 有权
    微机电容加速度传感器

    公开(公告)号:US07343801B2

    公开(公告)日:2008-03-18

    申请号:US10471296

    申请日:2002-03-07

    IPC分类号: G01P15/125

    摘要: A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (110), a sensor inertia mass (101) made of a wafer and movably mounted relative to the frame structure (110) about a rotation axis, and a capacitive pick-up unit (120) for producing at least one capacitive output signal representing the position of the sensor mass (101) relative to the frame structure (110). The sensor inertia mass (101) has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass (101) and the frame structure (110) are made monolithically of one single crystal silicon wafer. A cover section (112) forms a common connector plane (150) for the connection of capacitor electrodes (125,126). Torqueable elements (105) form an electrically conducting bearing device for the sensor mass (101).

    摘要翻译: 描述了一种微机电容加速度传感器,用于拾取至少一个方向的物体的加速度。 该传感器包括框架结构(110),由晶片制成的传感器惯性质量块(101),并围绕旋转轴线相对于框架结构(110)可移动地安装;以及电容式拾取单元(120) 表示传感器质量块(101)相对于框架结构(110)的位置的至少一个电容式输出信号。 传感器惯性质量(101)具有垂直于晶片平面的方向相对于旋转轴偏移的重心,用于测量横向于晶片平面的加速度。 传感器质量(101)和框架结构(110)由一个单晶硅晶片制成一体。 盖部分(112)形成用于连接电容器电极(125,126)的公共连接器平面(150)。 扭矩元件(105)形成用于传感器质量块(101)的导电轴承装置。

    Micromechanical capacitive acceleration sensor
    6.
    发明申请
    Micromechanical capacitive acceleration sensor 有权
    微机电容加速度传感器

    公开(公告)号:US20060156818A1

    公开(公告)日:2006-07-20

    申请号:US10471296

    申请日:2002-03-07

    IPC分类号: G01P15/125

    摘要: A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (110), a sensor inertia mass (101) made of a wafer and movably mounted relative to the frame structure (110) about a rotation axis, and a capacitive pick-up unit (120) for producing at least one capacitive output signal representing the position of the sensor mass (101) relative to the frame structure (110). The sensor inertia mass (101) has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass (101) and the frame structure (110) are made monolithically of one single crystal silicon wafer. A cover section (112) forms a common connector plane (150) for the connection of capacitor electrodes (125,126). Torqueable elements (105) form an electrically conducting bearing device for the sensor mass (101).

    摘要翻译: 描述了一种微机电容加速度传感器,用于拾取至少一个方向的物体的加速度。 该传感器包括框架结构(110),由晶片制成的传感器惯性质量块(101),并围绕旋转轴线相对于框架结构(110)可移动地安装;以及电容式拾取单元(120) 表示传感器质量块(101)相对于框架结构(110)的位置的至少一个电容式输出信号。 传感器惯性质量(101)具有垂直于晶片平面的方向相对于旋转轴偏移的重心,用于测量横向于晶片平面的加速度。 传感器质量(101)和框架结构(110)由一个单晶硅晶片制成一体。 盖部分(112)形成用于连接电容器电极(125,126)的公共连接器平面(150)。 扭矩元件(105)形成用于传感器质量块(101)的导电轴承装置。

    MEMS ACCELEROMETER WITH PROOF MASSES MOVING IN AN ANTI-PHASE DIRECTION
    7.
    发明申请
    MEMS ACCELEROMETER WITH PROOF MASSES MOVING IN AN ANTI-PHASE DIRECTION 审中-公开
    具有防伪质量的MEMS加速度计在相位方向上移动

    公开(公告)号:US20150192603A1

    公开(公告)日:2015-07-09

    申请号:US14642529

    申请日:2015-03-09

    申请人: InvenSense, Inc.

    IPC分类号: G01P15/125 G01P15/18

    摘要: A sensor is disclosed. The sensor includes a substrate and a mechanical structure. The mechanical structure includes at least two proof masses including a first proof mass and a second proof mass. The mechanical structure also includes a flexible coupling between the at least two proof masses and the substrate. The at least two proof masses move in an anti-phase direction normal to the plane of the substrate in response to acceleration of the sensor normal to the plane and move in anti-phase in a direction parallel to the plane of the substrate in response to an acceleration of the sensor parallel to the plane. The at least two proof masses move in a direction parallel to the plane of the substrate in response to an acceleration of the sensor parallel to the plane.

    摘要翻译: 公开了一种传感器。 传感器包括基底和机械结构。 机械结构包括至少两个包括第一检验质量和第二检验质量的检验质量块。 所述机械结构还包括所述至少两个检验质量块和所述基板之间的柔性联接。 响应于垂直于平面的传感器的加速度,至少两个证明质量块在垂直于衬底的平面的反相方向上移动,并响应于平行于衬底的平面的方向在反相中移动 传感器平行于平面加速。 响应于平行于平面的传感器的加速度,至少两个检验质量块在平行于衬底的平面的方向上移动。