摘要:
A method for forming a semiconductor device includes providing a substrate having a first major surface and a second major surface, removing a first portion of the substrate to form a cavity at the first major surface of the substrate, bonding the first major surface of the substrate to a carrier substrate after forming the cavity, and reducing a thickness of the substrate. The method further includes forming a first accelerometer device at the second major surface such that at least a portion of the first accelerometer device is over the cavity and forming a second accelerometer device at the second major surface such that the second accelerometer device is not disposed over the cavity.
摘要:
A multi-axial monolithic acceleration sensor has the following features. The acceleration sensor consists of plural individual sensors with respectively a main sensitivity axis arranged on a common substrate. Each individual sensor is rotatably moveably suspended on two torsion spring elements and has a seismic mass with a center of gravity. Each individual sensor has components that measure the deflection of the seismic mass. The acceleration sensor preferably consists of at least three identical individual sensors. Each individual sensor is suspended eccentrically relative to its center of gravity and is rotated by 90°, 180° or 270° relative to the other individual sensors.
摘要:
Disclosed is an instrument for measuring accelerations, with the aid of which changes in motion in the three axes of space can be measured with selective sensitivity.In order to detect multi-dimensional changes in motion, three micromechanical sensors, each sensitive to the acceleration in a selected direction, are integrated in a crystal. The sensors are composed of torsion bars having masses eccentrically attached thereto, which, in the event of changes in motion, exercise torques about the axes of the torsion bars. The torques are measured with the aid of integrated piezo-resistances. The planar integration of the acceleration meter permits integrating the evaluation circuit on the same semiconductor surface.Acceleration meters of this kind are fabricated with the prescribed process in planar technology with the aid of epitaxy, lithography and anisotropic etching methods.High precision and high miniaturization make this acceleration meter suited for application in overland and aviation navigation and for component positioning in robotry.
摘要:
A semiconductor device is formed such that a semiconductor substrate of the device has a non-uniform thickness. A cavity is etched at a selected side of the semiconductor substrate, and the selected side is then fusion bonded to another substrate, such as a carrier substrate. After fusion bonding, the side of the semiconductor substrate opposite the selected side is ground to a defined thickness. Accordingly, the semiconductor substrate has a uniform thickness except in the area of the cavity, where the substrate is thinner. Devices that benefit from a thinner substrate, such as an accelerometer, can be formed over the cavity.
摘要:
A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (110), a sensor inertia mass (101) made of a wafer and movably mounted relative to the frame structure (110) about a rotation axis, and a capacitive pick-up unit (120) for producing at least one capacitive output signal representing the position of the sensor mass (101) relative to the frame structure (110). The sensor inertia mass (101) has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass (101) and the frame structure (110) are made monolithically of one single crystal silicon wafer. A cover section (112) forms a common connector plane (150) for the connection of capacitor electrodes (125,126). Torqueable elements (105) form an electrically conducting bearing device for the sensor mass (101).
摘要:
A micromechanical capacitive acceleration sensor is described for picking up the acceleration of an object in at least one direction. The sensor includes a frame structure (110), a sensor inertia mass (101) made of a wafer and movably mounted relative to the frame structure (110) about a rotation axis, and a capacitive pick-up unit (120) for producing at least one capacitive output signal representing the position of the sensor mass (101) relative to the frame structure (110). The sensor inertia mass (101) has a center of gravity which offset relative to the rotation axis in a direction perpendicularly to a wafer plane for measuring accelerations laterally to the wafer plane. The sensor mass (101) and the frame structure (110) are made monolithically of one single crystal silicon wafer. A cover section (112) forms a common connector plane (150) for the connection of capacitor electrodes (125,126). Torqueable elements (105) form an electrically conducting bearing device for the sensor mass (101).
摘要:
A sensor is disclosed. The sensor includes a substrate and a mechanical structure. The mechanical structure includes at least two proof masses including a first proof mass and a second proof mass. The mechanical structure also includes a flexible coupling between the at least two proof masses and the substrate. The at least two proof masses move in an anti-phase direction normal to the plane of the substrate in response to acceleration of the sensor normal to the plane and move in anti-phase in a direction parallel to the plane of the substrate in response to an acceleration of the sensor parallel to the plane. The at least two proof masses move in a direction parallel to the plane of the substrate in response to an acceleration of the sensor parallel to the plane.
摘要:
An inertial sensor includes a substrate, a mass element, and a detecting device for detecting a movement of the mass element relative to the substrate, the mass element being coupled to the substrate with the aid of a spring device, wherein the spring device has a T-shaped cross-sectional profile. A method for manufacturing an inertial sensor is also disclosed.
摘要:
An inertial sensor includes a substrate, a mass element, and a detecting device for detecting a movement of the mass element relative to the substrate, the mass element being coupled to the substrate with the aid of a spring device, wherein the spring device has a T-shaped cross-sectional profile. A method for manufacturing an inertial sensor is also disclosed.
摘要:
An angular acceleration sensor has a weight member, a resilient member for supporting the weight member from the both sides thereof, the resilient member being disposed on a predetermined rotational axis and supporting the weight member for rotation about the rotational axis, and an opposed member opposed to the weight member, an angular acceleration applied to the weight member being detected from a variation in the spacing between the opposed member and the weight member resulting from the rotation of the weight member