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16 条记录 (耗时 0.013 秒)

    Method for detaching a semiconductor chip from a foil
    3.
    发明授权
    Method for detaching a semiconductor chip from a foil 有权
    从箔上分离半导体芯片的方法

    公开(公告)号：US09240334B2

    公开(公告)日：2016-01-19

    申请号：US14085693

    申请日：2013-11-20

    申请人： Besi Switzerland AG

    发明人： Ernst Barmettler ,  Irving Rodriguez

    IPC分类号： B32B38/10 ,  H01L21/67 ,  B32B43/00 ,  H01L21/683 ,  H01L23/00

    CPC分类号： H01L21/67011 ,  B32B43/006 ,  H01L21/67132 ,  H01L21/67288 ,  H01L21/6836 ,  H01L24/75 ,  H01L2221/68381 ,  H01L2224/756 ,  H01L2224/75753 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1105 ,  Y10T156/1179 ,  Y10T156/1983

    摘要： The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step: Initiating the method step; Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, and Checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value. According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime.

    摘要翻译： 本发明涉及从箔片上分离半导体芯片的方法的印前阶段。 根据第一方面，本发明涉及确定时间段，每个时间段定义了预打步骤的持续时间。 在设置阶段，对每个预打印步骤执行以下步骤：启动方法步骤; 重复两个步骤记录半导体芯片的图像并将时间段分配到从涂覆步骤开始以来已经过去的图像，并且检查图像中半导体芯片的外围区域是否比预定的 亮度值 直到检查导致半导体芯片的周边区域不比预定亮度值更暗的结果。 根据第二方面，实时监测半导体芯片与箔的分离。

    Method For Detaching A Semiconductor Chip From A Foil
    4.
    发明申请
    Method For Detaching A Semiconductor Chip From A Foil 有权
    从铝箔上分离半导体芯片的方法

    公开(公告)号：US20140196853A1

    公开(公告)日：2014-07-17

    申请号：US14085693

    申请日：2013-11-20

    申请人： Besi Switzerland AG

    发明人： Ernst Barmettler ,  Irving Rodriguez

    IPC分类号： H01L21/67 ,  H01L21/683

    CPC分类号： H01L21/67011 ,  B32B43/006 ,  H01L21/67132 ,  H01L21/67288 ,  H01L21/6836 ,  H01L24/75 ,  H01L2221/68381 ,  H01L2224/756 ,  H01L2224/75753 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1105 ,  Y10T156/1179 ,  Y10T156/1983

    摘要： The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step: Initiating the method step; Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, and Checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value; until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value. According to a second aspect, the detachment of the semiconductor chip from the foil is monitored in realtime.

    摘要翻译： 本发明涉及从箔片上分离半导体芯片的方法的印前阶段。 根据第一方面，本发明涉及确定时间段，每个时间段定义了预打步骤的持续时间。 在设置阶段，对每个预打印步骤执行以下步骤：启动方法步骤; 重复两个步骤记录半导体芯片的图像并将时间段分配到从涂覆步骤开始以来已经过去的图像，并且检查图像中半导体芯片的外围区域是否比预定的 亮度值 直到检查导致半导体芯片的周边区域不比预定亮度值更暗的结果。 根据第二方面，实时监测半导体芯片与箔的分离。

    IC cartridge
    7.
    发明授权
    IC cartridge 有权

    公开(公告)号：US09887114B2

    公开(公告)日：2018-02-06

    申请号：US14907748

    申请日：2015-08-27

    申请人： BOE TECHNOLOGY GROUP CO., LTD.

    发明人： Yang Xing

    IPC分类号： B65D85/00 ,  H01L21/673 ,  A45C11/24

    CPC分类号： H01L21/67333 ,  A45C11/24 ,  H01L21/68 ,  H01L24/75 ,  H01L2224/756

    摘要： An IC cartridge is provided, which includes: a cartridge body provided with hollowed-out parts, and an ejection mechanism including a substrate and projected structures which are provided on the substrate and can be slideably extended into the hollowed-out parts for pushing out IC chips; the hollowed-out parts and the projected structures cooperate to form groove structures for accommodating the IC chips. In usage, the IC chip in the groove structure are pushed out by sliding of the projected structures of the ejection mechanism through the hollowed-out parts. Thus, removing and flipping over of the IC chips is facilitated, and the processing safety of the IC chip can be ensured.

    MEMBER BONDING APPARATUS AND METHOD
    8.
    发明申请
    MEMBER BONDING APPARATUS AND METHOD 有权
    会员联结装置和方法

    公开(公告)号：US20160214364A1

    公开(公告)日：2016-07-28

    申请号：US15026575

    申请日：2015-08-04

    申请人： ORIGIN ELECTRIC COMPANY, LIMITED

    发明人： Takuto YAMASHITA ,  Tomoyuki SAITO ,  Masahiro SUDO

    IPC分类号： B32B37/12 ,  B32B37/10

    CPC分类号： B32B37/12 ,  B32B37/10 ,  B32B2305/72 ,  B32B2457/202 ,  C09J5/00 ,  G02F1/1303 ,  G02F1/133308 ,  G02F2001/133331 ,  G02F2202/28 ,  H01L2224/753 ,  H01L2224/756 ,  H01L2224/75745 ,  H01L2224/75802 ,  H01L2224/75803 ,  H01L2224/75804 ,  H01L2224/75901 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83908 ,  H01L2924/00014

    摘要： To allow short time spreading for adhesive, verifying whether the adhesive is spread out to a member end. In obtaining a bonded member by applying the adhesive to a surface of one of two members and bonding the members with a member bonding device, a tilt adjusting device acquires with a camera an image of spreading state of the adhesive in the members' bonding surface, and adjusts the tilt of the bonded member when a non-spreading part of the adhesive between ends of the bonded member and the adhesive has a size bias so that the adhesive moves to the larger side of the part, and a spreading adjustment device controls a pushing amount and a pushing time interval of a pressing-side member to adjust spreading of the adhesive so that the part size reduces to a predetermined size depending on the part size acquired with the camera, and cures the adhesive in the bonded member edge with the non-spreading part eliminated.

    摘要翻译： 为了允许粘合剂的短时间扩散，验证粘合剂是否扩散到成员端。 在通过将粘合剂施加到两个构件中的一个的表面并且通过构件接合装置接合构件来获得接合构件的情况下，倾斜调整装置利用照相机获取粘合剂在构件接合面中的展开状态的图像， 并且当接合部件的端部与粘合剂之间的粘合剂的非扩展部分具有尺寸偏压使得粘合剂移动到部件的较大侧面时调节接合部件的倾斜度，并且扩展调节装置控制 推压量和推压时间间隔，以调节粘合剂的铺展，使得根据用照相机获得的部分尺寸，部件尺寸减小到预定尺寸，并且用粘合部件边缘固化粘合剂 不扩散部分消除。

    BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMICONDUCTOR CHIP
    9.
    发明申请
    BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMICONDUCTOR CHIP 有权
    半导体芯片的接合方法和半导体芯片的接合装置

    公开(公告)号：US20160126218A1

    公开(公告)日：2016-05-05

    申请号：US14710070

    申请日：2015-05-12

    申请人： KABUSHIKI KAISHA TOSHIBA

    发明人： Yoichiro KURITA

    IPC分类号： H01L23/00 ,  H01L21/78

    CPC分类号： H01L24/97 ,  H01L21/02076 ,  H01L21/67132 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/7555 ,  H01L2224/756 ,  H01L2224/75743 ,  H01L2224/759 ,  H01L2224/83104 ,  H01L2224/832 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/05442 ,  H01L2924/10253 ,  H01L2924/1032

    摘要： According to one embodiment, there is provided a bonding method of a semiconductor chip. The bonding method includes arranging an activated front surface of a semiconductor chip and an activated front surface of a substrate so as to face each other with a back surface of the semiconductor chip attached to a sheet. The bonding method includes pushing the back surface of the semiconductor chip through the sheet to closely attach the activated front surface of the semiconductor chip and the activated front surface of the substrate. The bonding method includes stripping the sheet from the back surface of the semiconductor chip while maintaining a state in which the activated front surface of the semiconductor chip is closely attached to the activated front surface of the substrate.

    摘要翻译： 根据一个实施例，提供了半导体芯片的接合方法。 接合方法包括将半导体芯片的激活前表面和基板的激活前表面布置成使得与附接到片材的半导体芯片的背面彼此面对。 接合方法包括通过片材推动半导体芯片的后表面以紧密地附着半导体芯片的激活的前表面和激活的基板的前表面。 接合方法包括从半导体芯片的背面剥离片材，同时保持半导体芯片的活化前表面紧密附着于基板的活化前表面的状态。