公开(公告)号：US20020195351A1

公开(公告)日：2002-12-26

申请号：US10121786

申请日：2002-04-12

申请人： Chang Chun Plastics Co., Ltd.

发明人： Chih-Sheng Lu ,  Lu-Ming Luo ,  Yaw-Nan Shieh ,  Ray-Jaung Ho

IPC分类号： C09D005/00 ,  C23C016/00 ,  C23C020/00

CPC分类号： H01L21/2885 ,  C25D3/38 ,  H01L21/76838

摘要： A copper electroplating composition for integrated circuit interconnection is proposed, including a copper salt, an inorganic acid containing same anion as the copper salt, a suppressing agent and a polishing agent. This electroplating composition helps deposit copper into fine trenches with a high aspect ratio on a substrate, so as to form a surface-flat and void-free plated copper layer over the substrate by electroplating. It can therefore reduce the usage of polishing slurry and polishing time in a subsequent chemical mechanical polishing process, and also improve surface planarity of the copper later after being polished.

摘要翻译： 提出了一种用于集成电路互连的铜电镀组合物，包括铜盐，含有与铜盐相同的阴离子的无机酸，抑制剂和抛光剂。 该电镀组合物有助于将铜沉积在衬底上具有高纵横比的精细沟槽中，从而通过电镀在衬底上形成表面平坦且无空隙的镀铜层。 因此，可以在随后的化学机械抛光工艺中减少抛光浆料的使用和抛光时间，并且还可以在抛光后改善铜的表面平面度。

公开(公告)号：US20030159941A1

公开(公告)日：2003-08-28

申请号：US10074141

申请日：2002-02-11

申请人： Applied Materials, Inc.

发明人： Rajeev Bajaj ,  Girish Dixit

IPC分类号： B05B001/00 ,  C23C016/00 ,  C23C020/00 ,  C09D005/10 ,  C09D005/00 ,  C25D003/38

CPC分类号： C25D3/38

摘要： Embodiments of the invention generally provide a method and plating solution for reducing the degradation of additives in electroplating solutions. The method generally includes adding an anti-oxidant to the electroplating solution in an amount effective to reduce the degradation of additives in the plating solution. The plating solution generally includes copper ions, at least one organic plating additive, and at least one anti-oxidant in an amount sufficient to reduce the degradation of the organic plating additives in the plating solution.

摘要翻译： 本发明的实施方案通常提供了用于减少电镀溶液中添加剂降解的方法和电镀溶液。 该方法通常包括以有效减少电镀溶液中添加剂降解的量向电镀溶液中加入抗氧化剂。 电镀溶液通常包括铜离子，至少一种有机电镀添加剂和至少一种抗氧化剂，其量足以减少电镀溶液中有机电镀添加剂的降解。

公开(公告)号：US20030092957A1

公开(公告)日：2003-05-15

申请号：US10112764

申请日：2002-04-02

发明人： Neal A. Scott ,  Janet M. Hampikian

IPC分类号： C23C018/00 ,  C23C020/00 ,  A61N005/00

CPC分类号： A61N5/1015 ,  A61N5/1007 ,  A61N5/1014 ,  A61N5/1027 ,  A61N2005/1005 ,  A61N2005/1012 ,  A61N2005/1018 ,  A61N2005/1019 ,  C23C18/1208 ,  C23C18/1254 ,  Y10T428/12771 ,  Y10T428/12944 ,  Y10T428/12986 ,  Y10T428/31678

摘要： The present invention is directed to a brachytherapy device comprising a substrate comprising at least one radioactive coating layer formed thereon. The radioactive coating layer has a total radioactivity that varies in at least one dimension of the device. Methods of making radioactive coatings, such as electrochemical deposition, electroless deposition and sol-gel are also disclosed. Suitable substrates include medical devices, such as catheters, stents, brachytherapy devices and guidewires, or components thereof. The disclosed methods produce medical devices capable of generating asymmetric, or targeted, radiation fields that correspond to the morphology of a tumor. Methods of using these devices to treat cancer of the breast, brain, prostate, uterine, head and neck are also disclosed.

摘要翻译： 本发明涉及一种近程放射治疗装置，其包括其上形成有至少一个放射性涂层的基底。 放射性涂层具有在装置的至少一个维度上变化的总放射性。 还公开了制备放射性涂层的方法，例如电化学沉积，无电沉积和溶胶 - 凝胶。 合适的基材包括医疗装置，例如导管，支架，近距离放射治疗装置和导线，或其组件。 所公开的方法产生能够产生对应于肿瘤形态的不对称或靶向的辐射场的医疗装置。 还公开了使用这些装置来治疗乳腺，脑，前列腺，子宫，头颈部癌症的方法。

公开(公告)号：US20020144909A1

公开(公告)日：2002-10-10

申请号：US09946818

申请日：2001-09-05

申请人： MATSUDA SANGYO CO., LTD.

发明人： Shinji Ueki

IPC分类号： C25D003/50 ,  C09D005/00 ,  C23C020/00

CPC分类号： H01L23/49582 ,  C25D3/50 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2224/45099

摘要： The present invention provides a palladium plating solution comprising at least 1 to 60 g/L, in terms of the amount of palladium, of a soluble palladium salt and 0.1 to 300 g/L of a sulfamic acid or its salt, the palladium plating solution being substantially free from a brightening agent. This plating solution can be used to form, on a substrate, a palladium plating having on its surface an acicular crystal, and, thus, a plating having excellent adhesion to resin can be provided on the surface of a substrate.

摘要翻译： 本发明提供一种钯电镀液，其以钯的量，可溶性钯盐和0.1〜300g / L的氨基磺酸或其盐为至少1〜60g / L，镀钯液 基本上不含增白剂。 该电镀液可以用于在基板上形成具有针状晶体的钯电镀，因此可以在基板表面上设置对树脂具有优异粘附性的电镀。

公开(公告)号：US20030203111A1

公开(公告)日：2003-10-30

申请号：US10453829

申请日：2003-06-02

发明人： Wei-Wei Zhuang ,  Lawrence J. Charneski ,  David R. Evans ,  Sheng Teng Hsu

IPC分类号： C23C016/00 ,  B05D003/02 ,  C09D005/00 ,  B22F007/00 ,  C23C018/00 ,  C23C020/00

CPC分类号： H01L21/28556 ,  C23C16/18

摘要： A method for chemical vapor deposition of copper metal thin film on a substrate includes heating a substrate onto which the copper metal thin film is to be deposited in a chemical vapor deposition chamber; vaporizing a precursor containing the copper metal, wherein the precursor is a compound of (null-methylstyrene)Cu(I)(hfac), where hfac is hexafluoroacetylacetonate, and (hfac)Cu(I)L, where L is an alkene; introducing the vaporized precursor into the chemical vapor deposition chamber adjacent the heated substrate; and condensing the vaporized precursor onto the substrate thereby depositing copper metal onto the substrate. A copper metal precursor for use in the chemical vapor deposition of a copper metal thin film is a compound of (null-methylstyrene)Cu(I)(hfac), where hfac is hexafluoroacetylacetonate, and (hfac)Cu(I)L, where L is an alkene taken from the group of alkenes consisting of 1-pentene, 1-hexene and trimethylvinylsilane.

摘要翻译： 铜基金属薄膜在基板上进行化学气相沉积的方法包括在化学气相沉积室中加热要沉积铜金属薄膜的基板; 蒸发含有铜金属的前体，其中前体是（α-甲基苯乙烯）Cu（I）（hfac）的化合物，其中hfac是六氟乙酰丙酮化物，和（hfac）Cu（I）L，其中L是烯烃; 将蒸发的前体引入与加热的基底相邻的化学气相沉积室; 并将蒸发的前体冷凝到基底上，从而将铜金属沉积到基底上。 用于铜金属薄膜的化学气相沉积的铜金属前体是（α-甲基苯乙烯）Cu（I）（hfac）的化合物，其中hfac是六氟乙酰丙酮化物，和（hfac）Cu（I）L，其中 L是从由1-戊烯，1-己烯和三甲基乙烯基硅烷组成的烯烃族中获得的烯烃。

公开(公告)号：US20030118729A1

公开(公告)日：2003-06-26

申请号：US10221766

申请日：2002-09-12

发明人： Peter Trenton Bishop ,  Patricia Ann Marsh ,  Benediete Jeanne Suzanne Thiebault ,  Alison Mary Wagland

IPC分类号： B05D005/00 ,  C23C020/00 ,  C07F001/12

CPC分类号： B82Y30/00 ,  C01P2002/84 ,  C01P2002/86 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2004/50 ,  C01P2004/51 ,  C01P2004/64 ,  C01P2006/60 ,  C01P2006/80 ,  C07C321/04 ,  C07C321/22 ,  C07C321/26 ,  C07C323/52 ,  C07C2602/42 ,  C09C1/62

摘要： The present invention relates to novel thiol stabilised gold nanoparticles for decorative uses. Methods of their preparation, compositions comprising them and uses of gold nanoparticles and compositions are also described.

摘要翻译： 本发明涉及用于装饰用途的新型巯基稳定金纳米颗粒。 还描述了它们的制备方法，包含它们的组合物和金纳米颗粒和组合物的用途。

公开(公告)号：US20030008157A1

公开(公告)日：2003-01-09

申请号：US10168104

申请日：2002-06-17

发明人： Hiroshi Shiho ,  Hitoshi Kato ,  Yasuo Matsuki ,  Satoshi Ebata ,  Yoichiro Maruyama ,  Yasuaki Yokoyama

IPC分类号： C23C018/00 ,  C07F001/00 ,  B05B001/00 ,  C09D005/10 ,  B05D003/02 ,  C09D005/00 ,  C23C020/00 ,  C07F001/12

CPC分类号： C07F15/0046 ,  Y10T428/31678

摘要： A composition capable of forming a metal ruthenium film and a ruthenium oxide film by a simple application/baking process, a process for forming a metal ruthenium film and a ruthenium oxide film from the composition, a metal ruthenium film and a ruthenium oxide film formed by the process, and electrodes formed of the films. A solution composition comprising a specific ruthenium complex. The coating film of this solution composition is heated in an atmosphere containing no oxygen or an atmosphere containing oxygen to form a metal ruthenium film or a ruthenium oxide film, respectively, and electrodes formed of the films.

摘要翻译： 通过简单的涂布/烘烤法，能够形成金属钌膜和氧化钌膜的组合物，从组合物形成金属钌膜和氧化钌膜的方法，金属钌膜和氧化钌膜由 该工艺和由膜形成的电极。 包含特定钌络合物的溶液组合物。 该溶液组合物的涂膜在不含氧气或含氧气氛的气氛中分别加热形成金属钌膜或氧化钌膜，以及由该膜形成的电极。

公开(公告)号：US20040157073A1

公开(公告)日：2004-08-12

申请号：US10772672

申请日：2004-02-05

申请人： Nucryst Pharmaceuticals Corp., a Alberta, Canada corporation

发明人： Robert Edward Burrell ,  Hua Qing Yin ,  Antony George Naylor ,  Peter Howard Moxham ,  Walter Carlton Theodore Cholowski ,  Leonard Salvin Bowlby ,  David James Field

IPC分类号： C23C020/00

CPC分类号： A61K9/0024 ,  A01N59/16 ,  A61K9/0019 ,  A61K9/0075 ,  A61K9/0078 ,  A61K9/14 ,  A61K9/7007 ,  A61K33/24 ,  A61K33/38 ,  A61K33/40 ,  A61K47/34 ,  A61K47/38 ,  A61L15/46 ,  A61L17/145 ,  A61L27/30 ,  A61L29/10 ,  A61L31/082 ,  A61L2300/102 ,  A61L2300/104 ,  A61L2300/404 ,  A61L2300/452 ,  A61L2300/606 ,  A61L2300/624 ,  A61L2300/63 ,  Y10S424/15 ,  Y10S514/825 ,  Y10S514/826 ,  Y10S514/829 ,  Y10S514/83 ,  Y10S514/849 ,  Y10S514/851 ,  Y10S514/853 ,  Y10S514/861 ,  Y10S514/862 ,  Y10S514/864 ,  Y10S514/865 ,  Y10S514/88 ,  Y10S514/881 ,  Y10S514/882 ,  Y10S514/886 ,  Y10S514/887 ,  Y10S514/90 ,  Y10S514/901 ,  Y10S514/902 ,  Y10S514/912 ,  Y10S514/914 ,  Y10S514/925 ,  Y10S514/931 ,  Y10S514/932 ,  Y10S514/933 ,  Y10S514/934 ,  Y10S514/944 ,  Y10S514/951 ,  Y10S514/953 ,  Y10S514/954 ,  Y10S514/956 ,  Y10S514/958 ,  Y10S514/964 ,  Y10S514/965 ,  Y10S514/966 ,  Y10S514/967 ,  Y10S514/968 ,  Y10S514/969 ,  Y10T428/31855 ,  A61K2300/00 ,  A01N25/04 ,  A01N25/10 ,  A01N25/12

摘要： The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or more antimicrobial metals formed with atomic disorder such that the coatings provide an antimicrobial and anti-inflammatory effect when wet. The invention also provides a method to produce metal powders by sputtering a coating onto a moving surface, and then scraping the coating with one or more scrapers to produce the metal powder. The method is particularly useful for producing large amounts of nanocrystalline antimicrobial metal powders formed with atomic disorder, useful in the water swellable gel coatings of this invention.

公开(公告)号：US20030183120A1

公开(公告)日：2003-10-02

申请号：US10078445

申请日：2002-02-21

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Hiroshi Kanemoto ,  Tadashi Iida ,  Naoki Nishimura ,  Junichi Kawasaki

IPC分类号： C23C020/00 ,  G03F007/00

CPC分类号： C23C18/40 ,  C23C18/1617 ,  H05K3/422

摘要： An object of the present invention is to provide an elecroless copper plating solution using glyoxylic acid or a salt of glyoxylic acid as the reducing agent in which the amount of Cannizzaro reaction product is small, and the mechanical property of the obtained plated film is excellent, and to provide a supplementary solution for the electroless copper plating solution, a plating method capable of stably forming a plated film using the electroless copper plating solution, and a method of manufacturing a wiring board having an excellent connecting reliability of a through hole. The present invention consist of an electroless copper plating solution including copper ions, a complexing agent of copper ion, a copper ion reducing agent containing glyoxylic acid or a salt of glyoxylic acid, a pH adjusting agent, and succinic acid; a supplementary solution for an electroless copper plating solution including a copper ion reducing agent containing glyoxylic acid or a salt of glyoxylic acid and succinic acid of 10 to 500 ppm; and an electroless copper plating method and a method of manufacturing a wiring board using the electroless copper plating solution and the supplementary solution.

摘要翻译： 本发明的目的在于提供一种使用乙醛酸或乙醛酸盐作为其中坎尼扎罗反应产物量少的还原剂，并且所得镀膜的机械性能优异的无电镀铜溶液， 并且提供一种用于化学镀铜溶液的补充解决方案，能够使用无电镀铜溶液稳定地形成镀膜的电镀方法，以及具有优异的通孔连接可靠性的布线基板的制造方法。 本发明包括铜离子的无电镀铜溶液，铜离子络合剂，含有乙醛酸的铜离子还原剂或乙醛酸盐，pH调节剂和琥珀酸; 包含含有乙醛酸的铜离子还原剂或乙醛酸和琥珀酸盐的化学镀铜溶液的补充溶液为10〜500ppm; 无电镀铜方法以及使用该化学镀铜溶液和辅助溶液的布线板的制造方法。

公开(公告)号：US20020036144A1

公开(公告)日：2002-03-28

申请号：US09899228

申请日：2001-07-06

发明人： Sun-Jung Lee ,  Kyu-Hwan Chang ,  Hyeon-Deok Lee

IPC分类号： C23C016/00 ,  C23C020/00 ,  H01L029/12

CPC分类号： H01L21/76877 ,  C25D3/38 ,  C25D7/12 ,  H01L21/2885 ,  Y10T428/12528

摘要： A copper-plating electrolyte includes an aqueous copper salt solution, a water-soluble null-naphtholethoxylate compound having the formula 1 wherein n is an integer from 10 to 24, one selected from the group consisting of a disulfide having the formula XO3S(CH2)3SS(CH2)3SOX3 and a water-soluble mercaptopropanesulfonic acid or salt thereof having the formula HS(CH2)3SO3X, where X is sodium, potassium, or hydrogen, a water-soluble polyethylene glycol having a molecular weight ranging from about 4,600 to about 10,000, and a water-soluble polyvinylpyrrolidone having a molecular weight ranging from about 10,000 to about 1,300,000.

摘要翻译： 镀铜电解质包括铜盐水溶液，具有下式的水溶性β-萘基乙氧基化合物，其中n是10-24的整数，一个选自具有式XO 3 S（CH 2）3 SS的二硫化物 （CH 2）3 SOX 3和具有式HS（CH 2）3 SO 3 X的水溶性巯基丙磺酸或其盐，其中X是钠，钾或氢，分子量范围为约4,600至约10,000的水溶性聚乙二醇 ，以及分子量为约10,000至约1,300,000的水溶性聚乙烯吡咯烷酮。