公开(公告)号：US20040256237A1

公开(公告)日：2004-12-23

申请号：US10485306

申请日：2004-08-09

发明人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda ,  Ikutaro Noji ,  Kunio Fujiwara ,  Osamu Nabeya

IPC分类号： C25D005/06 ,  C25B015/00 ,  C25B007/00 ,  C08F002/58 ,  B01D057/02 ,  C25D017/00

CPC分类号： B23H5/08 ,  C23F3/00 ,  C25F1/00 ,  C25F3/00 ,  C25F7/00 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/32134

摘要： There is provided an electrolytic processing apparatus and method which, while omitting a CMP treatment entirely or reducing a load upon a CMP treatment to the least possible extent, can process a conductive material formed in the surface of a substrate to flatten the material, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The electrolytic processing apparatus includes: a pair of electrodes disposed at a given distance; an ion exchange disposed between the pair of electrodes; and a liquid supply section for supplying a liquid between the pair of electrodes. The electrolytic processing method includes: providing an electrode section having, a pair of electrodes disposed at a given distance with an ion exchanger being interposed: and bringing the electrode into contact with or close to a workpiece while supplying a fluid to the ion exchanger, thereby processing the surface of the workpiece.

摘要翻译： 提供了一种电解处理装置和方法，其可以在完全省略CMP处理或尽可能减少CMP处理时的负载的同时，处理形成在基板的表面中的导电材料以使材料变平，或者可以 去除（清洁）附着在诸如基板的工件的表面上的外来物质。 电解处理装置包括：以一定距离设置的一对电极; 设置在所述一对电极之间的离子交换器; 以及用于在一对电极之间提供液体的液体供应部分。 电解处理方法包括：提供电极部分，其具有设置有离子交换器的给定距离的一对电极，并且使电极与工件接触或接近工件，同时向离子交换器供应流体，由此 加工工件的表面。

公开(公告)号：US20020148732A1

公开(公告)日：2002-10-17

申请号：US09832657

申请日：2001-04-11

发明人： Ismail Emesh ,  Saket Chadda ,  Nikolay Korovin ,  Brian Mueller

IPC分类号： C25D005/06 ,  C25F003/00 ,  C25D017/00 ,  B23H009/00

CPC分类号： C25D17/001 ,  B23H5/08 ,  C25D5/06 ,  C25D5/22 ,  C25D17/14 ,  H01L21/2885 ,  H01L21/67167 ,  H01L21/67219 ,  H01L21/6723

摘要： An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

摘要翻译： 公开了一种用于将材料沉积在工件的表面上并用于抛光材料的电化学沉积设备和方法。 该设备包括压板和抛光表面，其包括邻近压板设置的导电材料和嵌入其中的导体。 在材料沉积期间，跨导体和压板施加偏压以使材料沉积到工件表面上。

公开(公告)号：US20020096435A1

公开(公告)日：2002-07-25

申请号：US10107425

申请日：2002-03-28

申请人： Kabushiki Kaisha Toshiba

发明人： Tetsuo Matsuda ,  Hisashi Kaneko ,  Katsuya Okumura

IPC分类号： C25D005/06 ,  C25D017/00 ,  C25B009/00 ,  C25B015/00 ,  C25D021/12 ,  B23H007/04

CPC分类号： C25D5/16 ,  C25D5/02 ,  C25D5/06 ,  C25D7/123 ,  C25D17/001 ,  C25D17/12 ,  H01L21/2885 ,  H01L21/76877 ,  H05K3/423

摘要： A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plating solution is supplied by causing an impregnated member containing the plating solution to face the conductive layer. Since the plating solution stays in the depression, a larger amount of plating solution is supplied than on the upper surface of the substrate, and the plating rate of the plating film in the depression increases. Consequently, the plating film can be preferentially formed in the depression such as a groove or hole.

公开(公告)号：US20030132120A1

公开(公告)日：2003-07-17

申请号：US10044514

申请日：2002-01-11

发明人： Ismail Emesh ,  Periya Gopalan ,  Phillip M. Rayer II ,  Bentley J. Palmer

IPC分类号： C25D005/06

CPC分类号： C25D17/14 ,  B23H5/08 ,  C25D7/123 ,  C25D17/001 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32125

摘要： An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.

摘要翻译： 提供了一种电化学装置，其将材料沉积在工件表面上或从工件表面去除材料。 该设备包括抛光垫和压板，该压板又包括与抛光垫接触并与第一电位接触的第一导电层，耦合到第二电位的第二导电层和设置在第二电位之间的第一绝缘层 第一和第二导电层。 至少一个电触点位于抛光垫内并电耦合到第二导电层。 提供一个储存器，其将电解质溶液与抛光垫和工件接触。 载体定位和/或将工件压靠在抛光垫上。

公开(公告)号：US20020139681A1

公开(公告)日：2002-10-03

申请号：US09822388

申请日：2001-03-30

申请人： Siemens Westinghouse Power Corporation

发明人： Jeffrey William Long

IPC分类号： C25D003/12 ,  C25D005/06 ,  C25D005/02 ,  C25D005/34

CPC分类号： H01M8/0228 ,  C25D5/06 ,  C25D5/34 ,  H01M8/0247 ,  H01M8/0252 ,  H01M8/1213 ,  H01M8/243 ,  H01M2008/1293

摘要： A method of depositing a metal coating (28) on the interconnect (26) of a tubular, hollow fuel cell (10) contains the steps of providing the fuel cell (10) having an exposed interconnect surface (26); contacting the inside of the fuel cell (10) with a cathode (45) without use of any liquid materials; passing electrical current through a contacting applicator (46) which contains a metal electrolyte solution; passing the current from the applicator (46) to the cathode (45) and contacting the interconnect (26) with the applicator (46) and coating all of the exposed interconnect surface.

摘要翻译： 在管状中空燃料电池（10）的互连（26）上沉积金属涂层（28）的方法包括提供具有暴露的互连表面（26）的燃料电池（10）的步骤。 在不使用任何液体材料的情况下使燃料电池（10）的内部与阴极（45）接触; 使电流通过包含金属电解质溶液的接触施加器（46）; 将电流从施加器（46）传递到阴极（45），并使互连（26）与施加器（46）接触并且涂覆所有暴露的互连表面。

公开(公告)号：US20020033342A1

公开(公告)日：2002-03-21

申请号：US09905335

申请日：2001-07-13

发明人： Cyprian Emeka Uzoh ,  Homayoun Talieh ,  Bulent Basol

IPC分类号： C25D005/02 ,  H01L021/288 ,  H01L021/445 ,  C25D005/06 ,  C25D005/34 ,  C25D005/52

CPC分类号： C25D5/00 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/1848 ,  C23C18/31 ,  C25D5/02 ,  C25D5/10 ,  C25D5/22 ,  C25D5/34 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76855 ,  H01L21/76865 ,  H01L21/76871 ,  H01L21/76874 ,  H01L21/76876 ,  H01L21/76879 ,  H01L21/76885 ,  H01L24/11 ,  H01L2221/1089 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/3011

摘要： The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed layer from a top surface of a substrate and then depositing a conductive material in the cavities of the substrate, where portions of the seed layer remains in the cavities. Another method includes forming an oxide layer on the top surface of the substrate such that the conductive material can be deposited in the cavities without the material being formed on the top surface of the substrate. The present invention also discloses methods for forming multi-level interconnects and the corresponding structures.

摘要翻译： 本发明涉及一种制造高性能芯片互连和封装的方法，该方法通过提供以更高效和省时的方式在衬底的空腔中沉积导电材料的方法。 这是通过从衬底的顶表面选择性地去除种子层的部分，然后在衬底的空腔中沉积导电材料，其中种子层的部分保留在空腔中。 另一种方法包括在衬底的顶表面上形成氧化物层，使得导电材料可以沉积在空腔中，而不会在衬底的顶表面上形成材料。 本发明还公开了用于形成多级互连的方法和相应的结构。

公开(公告)号：US20030070930A1

公开(公告)日：2003-04-17

申请号：US10302213

申请日：2002-11-22

发明人： Homayoun Talieh ,  Cyprian Uzoh ,  Bulent M. Basol

IPC分类号： C25D005/06

CPC分类号： B23H3/04 ,  B23H5/08 ,  C25D5/08 ,  C25D17/00 ,  C25D17/001 ,  C25D17/005 ,  C25F7/00 ,  H01L21/2885

摘要： Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

摘要翻译： 可以通过包括第一和第二导电元件的特定装置来提供导电材料在包含导电材料的电解质的衬底的包括半导体晶片的表面上的基本均匀沉积。 第一导电元件可以具有相同或不同构造的多个电触点，或者可以是导电焊盘的形式，并且可以在基本上所有的衬底表面上与衬底表面接触或以其他方式电互连。 当在电解质与衬底表面和第二导电元件物理接触的同时在第一和第二导电元件之间施加电势时，导电材料沉积在衬底表面上。 可以使施加在阳极和阴极之间的电压的极性反转，从而可以对沉积的导电材料进行电蚀刻。

公开(公告)号：US20030024819A1

公开(公告)日：2003-02-06

申请号：US10254269

申请日：2002-09-25

申请人： Technology Development Associate Operations Limited

发明人： John Michael Lowe

IPC分类号： C25D005/06 ,  C25D005/02 ,  C25D017/00

CPC分类号： H05K3/246 ,  C25D5/02 ,  C25D5/06 ,  H05K3/241 ,  H05K3/245

摘要： This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, and a tool suitable for use in electro-plating electrically conductive regions of a substrate, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to form a second electrode of the electro-plating circuit therewith.

摘要翻译： 本发明是一种在印刷电路上提供导电迹线的方法，包括用电镀溶液涂覆带有印刷轨迹的基板，该工具提供电镀电路的第一电极和轨道提供的第二电极， 电镀的工具，以及适用于电镀电镀基板的导电区域的工具，该工具包括能够承载电镀液的吸收构件; 电镀电路的第一电极，其适于与由吸收构件携带的电镀溶液进行电接触; 以及与所述第一电极电绝缘并与所述吸收构件间隔开的至少一个工具第二电极，所述工具第二电极被定位成使得当所述吸收构件被擦拭穿过衬底的表面时，所述第二电极接触器可被擦过所述第二电极接触器 基板的表面接触基板的导电区域，以形成电镀电路的第二电极。

公开(公告)号：US20020153256A1

公开(公告)日：2002-10-24

申请号：US10165673

申请日：2002-06-06

申请人： Nutool, Inc.

发明人： Cyprian Emeka Uzoh ,  Homayoun Talieh

IPC分类号： C25D005/06 ,  C25D005/52 ,  C25D017/00

CPC分类号： H01L23/53238 ,  B24B37/042 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  C25D5/00 ,  C25D5/02 ,  C25D5/06 ,  C25D5/22 ,  C25D5/50 ,  C25D7/123 ,  C25D17/14 ,  C25D21/02 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/6715 ,  H01L21/76838 ,  H01L21/76877 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a nullproximitynull plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a nullcold workednull manner. In this manner, energy stored in the cold worked regions of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.

公开(公告)号：US20020139682A1

公开(公告)日：2002-10-03

申请号：US09982558

申请日：2001-10-17

发明人： Bulent M. Basol ,  Cyprian Uzoh ,  Homayoun Talieh

IPC分类号： C25D005/22 ,  C25D005/06 ,  C25D017/00

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/001 ,  C25D5/22 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

摘要： Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary method, the workpiece surface influencing device is occasionally placed in contact with a conditioning substrate coated with an inert material, and the bias applied to the electrodeposition system is reversed. According to another exemplary method, the workpiece surface influencing device is conditioned using mechanical contact members, such as brushes, and conditioning of the workpiece surface influencing device occurs, for example, through physical brushing of the workpiece surface influencing device with the brushes. According to a further exemplary method, the workpiece surface influencing device is rotated in different direction during electrodeposition.

摘要翻译： 提出了用于去除或减小在电沉积期间使用的工件表面影响装置上形成金属颗粒的尺寸并限制金属颗粒形成或生长的速率的系统和方法。 根据示例性的方法，工件表面影响装置偶尔地与涂覆有惰性材料的调理基板接触，并且施加到电沉积系统的偏压被反转。 根据另一示例性方法，使用诸如刷子的机械接触构件对工件表面影响装置进行调节，并且例如通过用刷子物理刷刷工件表面影响装置来发生工件表面影响装置的调节。 根据另一示例性方法，在电沉积期间，工件表面影响装置在不同方向上旋转。