公开(公告)号：US20230033545A1

公开(公告)日：2023-02-02

申请号：US17788834

申请日：2020-10-13

申请人： SUMCO CORPORATION

发明人： Ryoya TERAKAWA

IPC分类号： B24B37/34 ,  B24B37/32 ,  H01L21/306 ,  H01L21/02

摘要： Provided is a method of transferring a semiconductor wafer to a single-side polishing apparatus without forming scratches on the surface of the semiconductor wafer. The method includes: starting to splay the liquid from each spray hole; placing the semiconductor wafer on the retainer portion to hold a surface of the semiconductor wafer by suction without contact, and raising the tray to attach the semiconductor wafer to the polishing head, wherein a period of time from a point at which the semiconductor wafer is held by the retainer portion to a point at which the attaching of the semiconductor wafer W to the polishing head is completed is 5 s or more, or wherein a ratio of a total area of the protrusions to an area of the semiconductor wafer is 15% or more.

公开(公告)号：US20230013401A1

公开(公告)日：2023-01-19

申请号：US17375961

申请日：2021-07-14

申请人： Applied Materials, Inc.

发明人： Gary Ka Ho LAM

IPC分类号： B24B37/34 ,  A46B13/02 ,  A46B13/00

摘要： Embodiments provided herein include a system and method for cleaning a first surface of a substrate using a brush carousel assembly. In one embodiment, the brush carousel assembly includes one or more rotatable brush mounting assemblies coupled to a rotatable carriage, having a carriage support structure configured to rotate about a carriage axis. The brush carousel assembly further includes a second brush mounting assembly disposed a second radial distance from the carriage axis, and coupled to the support structure of the carriage that includes the one or more rotatable support members.

公开(公告)号：US20230001533A1

公开(公告)日：2023-01-05

申请号：US17783914

申请日：2020-09-28

申请人： DMG MORI CO., LTD.

发明人： Shinji KAGO ,  Toyotada TANAKA

IPC分类号： B24B19/26 ,  B24B37/025 ,  B24B37/34 ,  B24B41/02 ,  B24B41/04 ,  B24B51/00 ,  B24B55/02

摘要： A machine tool includes a workpiece spindle unit (15) including a workpiece spindle (17) and a workpiece spindle motor (20) and includes a tool spindle unit (25) including a tool spindle (27) and a tool spindle motor. The machine tool further includes a first-axis movement mechanism (6) and a second-axis movement mechanism (9) relatively moving, in a plane including an axis of the workpiece spindle (17) and an axis of the tool spindle (27), the workpiece spindle unit (15) and the tool spindle unit (25) in a first axis direction and a second axis direction intersecting the first axis direction, respectively, and further includes a controller. The tool spindle unit (25) is arranged such that the axis of the tool spindle (27) intersects the axis of the workpiece spindle (17). The controller relatively moves the workpiece spindle unit (15) and the tool spindle unit (25) along the axis of the tool spindle (27) through combined operation of the first-axis movement mechanism (6) and second-axis movement mechanism (9), thereby grinding a workpiece (W) with a cup grindstone (T).

公开(公告)号：US20220395865A1

公开(公告)日：2022-12-15

申请号：US17888305

申请日：2022-08-15

申请人： ENTEGRIS, INC.

发明人： Daniela White

IPC分类号： B08B1/00 ,  B08B3/08 ,  B08B1/02 ,  B24B37/34 ,  C11D3/30 ,  C11D3/37 ,  C11D3/20 ,  C11D7/34 ,  C11D7/32 ,  C11D7/26 ,  B08B3/04 ,  C11D11/00 ,  C11D7/10 ,  A46B13/00 ,  H01L21/67

摘要： Described are methods for removing abrasive particles from a polymeric surface, such as from a polymeric surface of a cleaning brush used in a post chemical-mechanical processing cleaning step, as well as related cleaning solutions.

公开(公告)号：US20220388041A1

公开(公告)日：2022-12-08

申请号：US17889330

申请日：2022-08-16

申请人： Applied Materials, Inc.

发明人： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC分类号： B08B3/10 ,  H01L21/67 ,  B24B37/34

摘要： An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US20220310424A1

公开(公告)日：2022-09-29

申请号：US17212862

申请日：2021-03-25

申请人： Applied Materials, Inc.

发明人： Manoj A. GAJENDRA ,  Mahadev JOSHI ,  Joseph Antony JONATHAN ,  Jamie S. LEIGHTON

IPC分类号： H01L21/67 ,  H01L21/306 ,  H01L21/02 ,  H01L21/66 ,  H01L21/687 ,  B08B3/02 ,  B08B5/02 ,  B08B13/00 ,  B24B37/34 ,  B24B37/013

摘要： A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. A spin rinse dry (SRD) station configured to clean and dry the substrates. A metrology station configured to measure parameters of the substrates. A robot configured to move the substrate in to and out of the SRD station. And an effector rinse and dry (EERD) station configured to clean and dry an end effector of the robot.

公开(公告)号：US11376709B2

公开(公告)日：2022-07-05

申请号：US16596670

申请日：2019-10-08

申请人： Applied Materials, Inc.

发明人： Sreenidhi Attur

IPC分类号： B24B53/017 ,  B24B57/02 ,  B24B37/32 ,  B24B37/34

摘要： A component in a CMP tool disclosed herein having a surface and a hydrophobic layer deposited on the surface. In one example, the component is a component for delivering a fluid in a CMP tool. The component for delivering a fluid in a CMP tool includes an elongated member having a first end and a second end, and an elongated upper surface extending between the two ends. A hydrophobic layer is deposited on the elongated upper surface. In another example, the component is a ring shaped body having an upper side and a lower side. A hydrophobic layer is deposited on the inner surfaces of both the upper and lower sides. In another example, the component is a disk shaped body having a top surface, bottom surface, and ledge defined by the top and bottom surfaces. A hydrophobic layer is deposited on the surfaces and the ledge.

公开(公告)号：US20220143772A1

公开(公告)日：2022-05-12

申请号：US17452616

申请日：2021-10-28

申请人： DISCO CORPORATION

发明人： Toshiyuki MORIYA ,  Tomohiro SHIRAHAMA

IPC分类号： B24B7/04 ,  H01L21/304 ,  B24B55/12 ,  B24B37/34 ,  B24B55/04

摘要： A processing machine includes a chuck table, a chuck table cover having an opening through which a holding surface of the chuck table can protrude, a processing unit having a spindle, a spindle housing, and a mount portion arranged on a lower end portion of the spindle, the processing unit being configured to process a workpiece by a processing tool mounted on a lower part of the mount portion, a processing chamber construction cover that covers the chuck table and the mount portion. The processing machine further includes a processing tool cover that is secured to a lower end portion of the spindle housing and that has an upper wall and a side wall that extends downwardly from the upper wall. The processing tool cover is disposed inside the processing chamber construction cover and covers the processing tool from above and sides by the upper and side walls.

公开(公告)号：US20220020610A1

公开(公告)日：2022-01-20

申请号：US17489277

申请日：2021-09-29

申请人： EBARA CORPORATION

发明人： Haiyang Xu ,  Mitsuhiko Inaba

IPC分类号： H01L21/67 ,  B08B1/04 ,  B08B1/00 ,  B24B37/04 ,  H01L21/02 ,  B24B37/34

摘要： A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.

公开(公告)号：US20210398834A1

公开(公告)日：2021-12-23

申请号：US17283958

申请日：2019-09-26

申请人： HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.

发明人： Linghan Shen ,  EdwardLiCang LEE

IPC分类号： H01L21/677 ,  B24B37/27 ,  B24B37/34 ,  B08B7/02 ,  H01L21/68 ,  H01L21/687

摘要： Disclosed are a CMP wafer cleaning apparatus, and a wafer transfer manipulator and a wafer overturn method for same. The wafer transfer manipulator includes: a transverse transfer shaft, with same only being located at a side of a cleaning unit; a transverse transfer carriage provided on the transverse transfer shaft, and capable of transversely moving along the transverse transfer shaft; a first vertical lifting shaft provided on the transverse transfer carriage, and capable of vertically moving on the transverse transfer carriage; a rotary table provided on the first vertical lifting shaft; and a first claw clamping arm connected to the rotary table, and driven by the rotary table to move in a rotational manner. The CMP wafer cleaning apparatus is provided, and when the CMP wafer cleaning apparatus fails, safe storage of a polished wafer can be realized.