公开(公告)号：US20240262681A1

公开(公告)日：2024-08-08

申请号：US18640142

申请日：2024-04-19

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yang-Che CHEN ,  Victor Chiang LIANG ,  Chen-Hua LIN ,  Chwen-Ming LIU ,  Huang-Wen TSENG ,  Yi-Chuan TENG

IPC分类号： B81B7/04 ,  B81C1/00 ,  B81C3/00

CPC分类号： B81B7/04 ,  B81C3/001 ,  B81B2201/033 ,  B81B2203/0136 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C1/00357 ,  B81C1/00468 ,  B81C1/00476 ,  B81C1/00484 ,  B81C2201/0132 ,  B81C2203/038

摘要： A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

公开(公告)号：US11912565B2

公开(公告)日：2024-02-27

申请号：US17282331

申请日：2019-12-17

申请人： Robert Bosch GmbH

发明人： Christoph Hermes ,  Kerrin Doessel ,  Thomas Friedrich

IPC分类号： B81B7/04 ,  G01L9/00

CPC分类号： B81B7/04 ,  G01L9/0073 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/053

摘要： A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

公开(公告)号：US20220194783A1

公开(公告)日：2022-06-23

申请号：US17694296

申请日：2022-03-14

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Yang-Che CHEN ,  Victor Chiang LIANG ,  Chen-Hua LIN ,  Chwen-Ming LIU ,  Huang-Wen TSENG ,  Yi-Chuan TENG

IPC分类号： B81B7/04 ,  B81C3/00

摘要： A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

公开(公告)号：US20220060171A1

公开(公告)日：2022-02-24

申请号：US17521180

申请日：2021-11-08

申请人： KYOCERA Tikitin Oy

发明人： Antti JAAKKOLA

IPC分类号： H03H9/02 ,  B81B3/00 ,  B81B7/04 ,  H03H9/05 ,  H03H9/24 ,  H01L41/09

摘要： A microelectromechanical resonator includes a support structure, a resonator element suspended to the support structure, and an actuator for exciting the resonator element to a resonance mode. The resonator element includes a plurality of adjacent sub-elements each having a length and a width and a length-to-width aspect ratio of higher than 1 and being adapted to a resonate in a length-extensional, torsional or flexural resonance mode. Further, each of the sub-elements is coupled to at least one other sub-element by one or more connection elements coupled to non-nodal points of the of said resonance modes of the sub-elements for exciting the resonator element into a collective resonance mode.

公开(公告)号：US20220055891A1

公开(公告)日：2022-02-24

申请号：US16998458

申请日：2020-08-20

申请人： U.S. Army Combat Capabilities Development Command, Army Research Laboratory

发明人： Cory R. Knick ,  Christopher J. Morris ,  Gabriel L. Smith

IPC分类号： B81B3/00 ,  B81B7/04

摘要： A microelectromechanical system (MEMS) actuator device includes a substrate; a shape memory alloy over the substrate; and a reflective coating on the shape memory alloy. The shape memory alloy and the reflective coating form a bi-layer cantilever beam having a first end anchored to the substrate, and a second end released from the substrate. The second end of the cantilever beam articulates between a deflection configuration away from the substrate and a non-deflection configuration towards the substrate based on a thermal phase change in the shape memory alloy.

公开(公告)号：US11203523B2

公开(公告)日：2021-12-21

申请号：US17082878

申请日：2020-10-28

申请人： JIANGNAN UNIVERSITY

发明人： Gang Shi ,  Ying Li ,  Jianhua Li ,  Xuan Jin ,  Dawei Wang ,  Likui Wang ,  Jingguo Yang ,  Xinxin Sang ,  Caihua Ni

IPC分类号： B81B7/04 ,  B81C1/00 ,  B81C99/00 ,  B82Y30/00 ,  B82Y40/00 ,  C23C18/16 ,  C23C18/38 ,  C23C18/42 ,  G01N21/65 ,  G01N33/02

摘要： The present invention discloses a bionic SERS substrate of a metal-based compound eye bowl structure, a construction method and application. The bionic SERS substrate of the metal-based compound eye bowl structure of the present invention consists of a metal bowl and a cone-shaped structure substrate in an ordered hierarchy manner. The metal bowl is of a continuously and closely arranged single-layer bowl structure. A height of the metal bowl is 0.01-10 μm, and a bowl opening diameter is 0.01-10 μm. A cone is a micron pyramid cone, and a height of the micron pyramid cone is 1-100 μm. The present invention assembles the metal bowl on a surface of the substrate of the micron pyramid cone structure with great fluctuation by a solid-liquid interface chemical reduction method and a small ball template method, and further constructs a 3D SERS substrate with a bionic compound eye structure.

公开(公告)号：US20210363884A1

公开(公告)日：2021-11-25

申请号：US16879167

申请日：2020-05-20

申请人： Halliburton Energy Services, Inc.

发明人： Dale E. JAMISON ,  William Walter SHUMWAY ,  Preston Andrew MAY ,  Jay Paul DEVILLE

IPC分类号： E21B49/08 ,  B81B3/00 ,  E21B47/005 ,  B81B7/04 ,  E21B49/00

摘要： A method comprising determining a concentration of one or more components of a wellbore servicing fluid during a wellbore servicing operation; and adjusting or maintaining a composition of the wellbore servicing fluid being introduced into a wellbore and/or an operational parameter of the wellbore servicing operation based on the determining of the concentration of the one or more components, wherein the determining of the concentration of the one or more components comprises contacting a sample of the wellbore servicing fluid with a microelectromechanical system (MEMS) device to provide a sample response indicative of the concentration of the one or more components.

公开(公告)号：US10793421B2

公开(公告)日：2020-10-06

申请号：US15810156

申请日：2017-11-13

申请人： VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.

发明人： Natarajan Rajasekaran ,  Siddharth Chakravarty ,  Yu Ting Ng ,  Rakesh Kumar ,  Pradeep Yelehanka

IPC分类号： B81B7/00 ,  H01L21/67 ,  B81C1/00 ,  B81B7/04

摘要： A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate having a MEMS component in a device region. A top cap is fusion bonded to the top surface of the device substrate and a bottom cap is fusion bonded to the bottom surface of the device substrate. The top and bottom caps encapsulate the MEMS components. A cap includes a via isolation which extends a thickness of the cap and surrounds the device region.

公开(公告)号：US20200304093A1

公开(公告)日：2020-09-24

申请号：US16607165

申请日：2019-02-06

申请人： KYOCERA Tikitin Oy

发明人： Antti JAAKKOLA

IPC分类号： H03H9/02 ,  H03H9/24 ,  H01L41/09 ,  H03H9/05 ,  B81B3/00 ,  B81B7/04

摘要： A microelectromechanical resonator includes a support structure, a resonator element suspended to the support structure, and an actuator for exciting the resonator element to a resonance mode. The resonator element includes a plurality of adjacent sub-elements each having a length and a width and a length-to-width aspect ratio of higher than 1 and being adapted to a resonate in a length-extensional, torsional or flexural resonance mode. Further, each of the sub-elements is coupled to at least one other sub-element by one or more connection elements coupled to non-nodal points of the of said resonance modes of the sub-elements for exciting the resonator element into a collective resonance mode.

公开(公告)号：US10737934B1

公开(公告)日：2020-08-11

申请号：US15911045

申请日：2018-03-02

申请人： SiTime Corporation

发明人： Nicholas Miller ,  Ginel C. Hill ,  Charles I. Grosjean ,  Michael Julian Daneman ,  Paul M. Hagelin ,  Aaron Partridge

IPC分类号： B81B7/04 ,  B81B7/02 ,  H02H9/04 ,  B81C1/00 ,  H01L23/00

摘要： A semiconductor device includes first and second exposed electrical contacts and a cavity having a microelectromechanical system (MEMS) structure therein. A conductive path extends from the first exposed electrical contact to the cavity and an over-voltage protection element electrically is coupled between the first and second exposed electrical contacts.