-
公开(公告)号:US20230111976A1
公开(公告)日:2023-04-13
申请号:US17798659
申请日:2021-01-28
发明人: Yoshie Tarutani , Kenji Kubota , Naoki Katou
摘要: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.
-
公开(公告)号:US11618966B2
公开(公告)日:2023-04-04
申请号:US16616804
申请日:2018-07-10
IPC分类号: C25D11/18 , C25D11/04 , C23F1/20 , C25D1/00 , C25D9/02 , C25D11/02 , C25D11/12 , C25D11/34 , C25D9/06 , C25D11/10 , H01M4/66 , H01M8/0232 , H01M8/0247 , C23F1/28 , C25D3/12 , C25D11/24 , H01M4/04 , H01M4/80 , C25D1/08 , H01B1/02 , H01B5/00 , B82Y30/00 , B82Y40/00
摘要: Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m2/cm3 and 90 m2/cm3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m2/cm3 and 72 m2/cm3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m2/cm3 and 85 m2/cm3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.
-
公开(公告)号:US20230078655A1
公开(公告)日:2023-03-16
申请号:US17801963
申请日:2021-05-13
IPC分类号: C21D9/46 , B21D22/02 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/00 , C22C38/60 , C25D3/44 , C25D3/12 , C23C28/00 , C22C21/02
摘要: This steel sheet for hot stamping includes a base material, an Al—Si alloy plating layer in which the Al content is 75 mass % or more, the Si content is 3 mass % or more and the total of the Al content and the Si content is 95 mass % or more, an Al oxide coating having a thickness of 0 to 20 nm and a Ni plating layer in which the Ni content is more than 90 mass % in this order, the base material has a predetermined chemical composition, the Al—Si alloy plating layer has a thickness of 7 to 148 μm, and the Ni plating layer has a thickness of more than 200 nm and 2500 nm or less.
-
公开(公告)号:US20230077095A1
公开(公告)日:2023-03-09
申请号:US17799135
申请日:2021-02-11
发明人: Benedikt Straub , John Burschik
IPC分类号: H01M4/1395 , H01M4/36 , H01M4/38 , H01M4/134 , H01M4/04 , C25F3/12 , C25D3/38 , C25D3/12 , C25D5/12 , C25D5/10
摘要: An electrode for a lithium-ion battery. The electrode has at least one porous silicon layer and a copper layer. There is also described a battery with such an electrode, a method for producing an electrode of this kind, and the use of an electrode of this kind in a battery.
-
公开(公告)号:US11587858B2
公开(公告)日:2023-02-21
申请号:US17323939
申请日:2021-05-18
IPC分类号: H01L23/498 , H01L23/00 , H01L23/495 , B23K1/00 , C25D5/12 , C25D5/18 , C25D7/12 , C25D3/22 , B23K101/36 , C25D3/12
摘要: A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.
-
公开(公告)号:US11552235B2
公开(公告)日:2023-01-10
申请号:US16969524
申请日:2019-11-16
申请人: Berken Energy LLC
发明人: Ronald Petkie , John B. Newman , Ion M. Basa
摘要: Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.
-
公开(公告)号:US20220411949A1
公开(公告)日:2022-12-29
申请号:US17823548
申请日:2022-08-31
发明人: Kimitaka OKUBO
IPC分类号: C25D3/12 , C25B11/042 , C01B21/083 , C25B1/245
摘要: An electrode for electrolytic fluorination contains nickel as a base material with a fluorine content 99 mass %, the iron content≤400 ppm, the copper content
-
公开(公告)号:US11535945B2
公开(公告)日:2022-12-27
申请号:US16731788
申请日:2019-12-31
IPC分类号: B32B15/01 , C25D3/12 , C25D3/48 , C25D7/12 , C23C18/08 , C23C18/32 , C23C18/42 , H01L21/768 , C23C18/16 , C25D3/46
摘要: A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.
-
公开(公告)号:US11530488B2
公开(公告)日:2022-12-20
申请号:US17127644
申请日:2020-12-18
申请人: Ryan Neily
发明人: Ryan Neily
IPC分类号: C25D1/10 , C25D1/00 , C25D3/38 , C25D3/12 , C25D5/12 , C25D7/00 , B05D7/02 , B05D7/26 , B29D99/00 , B29C33/38 , A41D19/04
摘要: Methods and processes are described that enable the manufacture of a superior thin-walled mold from which higher-quality, less-costly disposable gloves can be more efficiently produced. The method can include creating a glove form in a sacrificial material; electroforming an electroformed master from the glove form; removing sacrificial material from the electroformed master; creating a tertiary form from the electroformed master; forming an initial copper layering on the tertiary form; and developing the initial copper layering into a thick copper plating to create a copper mold for gloves.
-
10.
公开(公告)号:US20220372644A1
公开(公告)日:2022-11-24
申请号:US17410785
申请日:2021-08-24
申请人: TCC Steel Corp.
发明人: Jin Hwan Chung , Tae Woo Kwon , Hyun Jun Baek , Yoon Han Kim , Jun Mo Jeon
摘要: The present invention provides a nickel-plated stainless steel sheet and a method of manufacturing the same. In one embodiment, the nickel-plated stainless steel sheet includes: a stainless steel base plate; and a nickel (Ni) plating layer formed on at least one surface of the steel base plate by electroplating, and the nickel plating layer includes a strike plating layer and a main plating layer which are sequentially laminated on the one surface of the steel base plate.
-
-
-
-
-
-
-
-
-