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    Authenticating a physical card using sensor data
    3.
    发明授权
    Authenticating a physical card using sensor data 有权

    公开(公告)号：US12112220B1

    公开(公告)日：2024-10-08

    申请号：US18348644

    申请日：2023-07-07

    申请人： Capital One Services, LLC

    发明人： Leeyat Bracha Tessler ,  Alexander Mireles ,  Hazar Alsahnawi ,  Dennis Liu

    IPC分类号： G06K19/073

    CPC分类号： G06K19/073

    摘要： In some implementations, a device may obtain video and/or lidar data relating to a physical card captured while the physical card is flipped from a first side of the physical card to a second side of the physical card. The device may determine an authenticity of the physical card, where the authenticity of the physical card is based at least in part on one or more physical characteristics of the physical card identifiable from the video and/or the lidar data. The one or more physical characteristics may relate to a thickness of the physical card, a length and width of the physical card, a shape of the physical card, and/or a design feature of the physical card. The device may cause, based on a determination that the physical card is authentic, information associated with the physical card to be transmitted or stored to be used in connection with a transaction.

    Contactless card with operator controlled structure
    5.
    发明授权
    Contactless card with operator controlled structure 有权

    公开(公告)号：US11983594B2

    公开(公告)日：2024-05-14

    申请号：US17587645

    申请日：2022-01-28

    申请人： STMICROELECTRONICS ASIA PACIFIC PTE LTD

    发明人： Jaehyun Kwak ,  Kyoung Min Cho

    IPC分类号： G06K19/077 ,  G06K19/073 ,  H01H1/12

    CPC分类号： G06K19/07749 ,  G06K19/07345 ,  H01H1/12 ,  H01H2231/05

    摘要： The present disclosure is directed to a contactless card including an actuation security structure that is actuated to provide authorization in accessing identifying information on an integrated circuit within the contactless card. In at least one embodiment, the actuation security structure includes a pair of conductive layers and a pair of electrodes. Ends of the pair of conductive layers overlap respective ones of the pair of electrodes. The ends of the pair of conductive layers are at and in a first elastically deformable region and the respective ones of the pair of electrodes are at and in a second elastically deformable region. An owner of the contactless card may provide authorization to access the identification information on the contactless card by applying force to both the first and second elastically deformable regions inward resulting in the ends of the conductive layers moving into electrical communication with the pair of electrodes.

    Smart card enrollment device
    6.
    发明授权
    Smart card enrollment device 有权

    公开(公告)号：US11954548B2

    公开(公告)日：2024-04-09

    申请号：US17520266

    申请日：2021-11-05

    申请人： STMicroelectronics (Grand Ouest) SAS ,  STMicroelectronics (Rousset) SAS

    发明人： Frederic Gouabau ,  Olivier Rouy

    IPC分类号： G06K19/07 ,  G06K19/073 ,  H05B45/10

    CPC分类号： G06K19/07354 ,  H05B45/10

    摘要： A connector that is configured to receive a smart card includes: a first contact configured to receive a power supply voltage and corresponding to a first (power supply) contact area of the smart card, a second contact configured to receive a reference voltage and corresponding to contact a second (reference voltage) contact area of the smart card, and a third contact corresponding to a three-state (input/output) contact area of the smart card. A first light-emitting diode having an anode coupled to the third contact and a cathode coupled to the second contact. A second light-emitting diode has a cathode coupled to the third contact and an anode coupled to the first contact. Turning on/off of the first and second light-emitting diode is controlled by the smart card through the signal at the three-state (input/output) contact area.

    RFID switch tag
    7.
    发明授权
    RFID switch tag 有权

    公开(公告)号：US11948035B2

    公开(公告)日：2024-04-02

    申请号：US18205406

    申请日：2023-06-02

    申请人： NEOLOGY, INC.

    发明人： Sheshi Nyalamadugu ,  Joe Mullis

    IPC分类号： G06K19/077 ,  G06K19/04 ,  G06K19/073 ,  H01Q1/22

    CPC分类号： G06K19/07715 ,  G06K19/041 ,  G06K19/07345 ,  G06K19/07701 ,  G06K19/07703 ,  G06K19/07745 ,  G06K19/07754 ,  G06K19/07773 ,  G06K19/07794 ,  H01Q1/2225

    摘要： A switchable radio-frequency identification (RFID) tag device comprising: a first RFID module positioned on a first plane; at least one un-tuned antenna section positioned on a second plane, wherein the first plane is positioned parallel to the second plane; a second RFID module positioned on the first plane; a third RFID module positioned on the first plane; and a sliding mechanism configured to move between a first position, a second position, and a third position; and wherein, in the first position, the first RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the second and third RFID modules are detuned and/or inoperable; and in the second position, the second RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the first RFID module and third RFID module are detuned and/or inoperable; and in the third position, the third RFID module is coupled to the at least one un-tuned antenna section to form a tuned RFID tag, and the first and second RFID modules are detuned and/or inoperable.

    FINGERPRINT SENSOR PACKAGE AND SMART CARD INCLUDING FINGERPRINT SENSOR PACKAGE
    10.
    发明公开
    FINGERPRINT SENSOR PACKAGE AND SMART CARD INCLUDING FINGERPRINT SENSOR PACKAGE 审中-公开

    公开(公告)号：US20240046692A1

    公开(公告)日：2024-02-08

    申请号：US18131133

    申请日：2023-04-05

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Gwangjin LEE ,  Jaehyun LIM ,  Heeyoub KANG ,  Hyunjong MOON ,  Yun Seok CHOI ,  Inho CHOI

    IPC分类号： G06V40/13 ,  G06K19/073

    CPC分类号： G06V40/1306 ,  G06K19/07354

    摘要： A fingerprint sensor package includes a first substrate having a core insulating layer with a first surface and a second surface, and a through-hole passing through the first surface and the second surface, a first bonding pad disposed on the second surface of the core insulating layer, and an external connection pad, a second substrate disposed in the through-hole of the core insulating layer and including a plurality of first sensing patterns, a plurality of second sensing patterns, and a second bonding pad, a conductive wire connecting the first bonding pad and the second bonding pad to each other, a controller chip disposed on the second substrate, and a molding layer disposed on the second surface of the core insulating layer, filling the through-hole, covering the second substrate and the first bonding pad, and spaced apart from the external connection pad.