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335 条记录 (耗时 0.019 秒)

    Method for use with superconducting devices
    3.
    发明授权
    Method for use with superconducting devices 有权

    公开(公告)号：US11449784B2

    公开(公告)日：2022-09-20

    申请号：US16930512

    申请日：2020-07-16

    申请人： D-WAVE SYSTEMS INC.

    发明人： George E. G. Sterling

    IPC分类号： H01F7/06 ,  G06N10/00 ,  H03H3/00 ,  H01F41/04 ,  H01F13/00 ,  H03H7/42 ,  H05K1/02 ,  H01F41/076 ,  H03H1/00 ,  H05K1/16 ,  H01L39/14 ,  H01L39/02

    摘要： In many cases after degaussing the field distribution in a magnetic material there may be regions within the magnetic material that have ordered domains that contribute a remnant field. There is the need to reduce or eliminate non-uniform fields within a volume of interest left after degaussing a magnetic shield. Degaussing coils surrounding a metal shield can be used to favorably order magnetic domains within the material to counteract the remnant fields left behind following imperfect degaussing. The remnant field value can be measured and a small current may be applied through the degaussing coils. After removing the current, the field can be measured again and a higher current may be applied again through the coils. Repeated applications of currents and field measurement will progressively order domains in the direction of the applied field, resulting in a reduction of the net field and lower field gradient across the volume of interest.

    Multilayer filter including a capacitor connected with at least two vias
    4.
    发明授权
    Multilayer filter including a capacitor connected with at least two vias 有权

    公开(公告)号：US11190157B2

    公开(公告)日：2021-11-30

    申请号：US16720038

    申请日：2019-12-19

    申请人： AVX Corporation

    发明人： Kwang Choi ,  Marianne Berolini

    IPC分类号： H03H1/00 ,  H03H3/00

    摘要： A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.

    Element removal design in microwave filters
    5.
    发明授权
    Element removal design in microwave filters 有权

    公开(公告)号：US11036910B2

    公开(公告)日：2021-06-15

    申请号：US16999528

    申请日：2020-08-21

    申请人： Resonant Inc.

    发明人： Neal Fenzi ,  Kurt Raihn

    IPC分类号： G06F30/392 ,  G06F30/30 ,  G06F30/36 ,  G06F30/367 ,  G06F30/398 ,  H03H3/00 ,  H03H7/00 ,  G06G7/50 ,  H03H9/46 ,  G06G7/48 ,  H03F3/45

    摘要： A method of designing a microwave filter using a computerized filter optimizer, comprises generating a filter circuit design in process (DIP) comprising a plurality of circuit elements having a plurality of resonant elements and one or more non-resonant elements, optimizing the DIP by inputting the DIP into the computerized filter optimizer, determining that one of the plurality of circuit elements in the DIP is insignificant, removing the one insignificant circuit element from the DIP, deriving a final filter circuit design from the DIP, and manufacturing the microwave filter based on the final filter circuit design.

    ELECTROSTATIC CHUCK FILTER BOX AND MOUNTING BRACKET
    6.
    发明申请
    ELECTROSTATIC CHUCK FILTER BOX AND MOUNTING BRACKET 审中-公开

    公开(公告)号：US20200321934A1

    公开(公告)日：2020-10-08

    申请号：US16906301

    申请日：2020-06-19

    申请人： Lam Research Corporation

    发明人： Miguel Benjamin VASQUEZ ,  Jeremy Jerome POOL ,  Damien Martin SLEVIN

    IPC分类号： H03H7/01 ,  H01L21/683 ,  H03H3/00 ,  H05K7/20 ,  H01R43/26 ,  H01R13/629

    摘要： An apparatus and method electrically coupling an electrostatic chuck RF filter box with a pedestal lift. The RF filter box has a contact block and at least one alignment feature on an outer mating surface of the RF filter block. The contact block includes self-aligning electrical connectors and the alignment feature is configured for aligning self-aligning electrical connectors with corresponding electrical connectors on the bracket of the pedestal lift such that the self-aligning electrical connectors and the corresponding electrical connectors on the bracket of the pedestal lift automatically mate when the contact block is mounted to the bracket of the pedestal lift.

    2D & 3D RF Lumped Element Devices for RF System in a Package Photoactive Glass Substrates
    9.
    发明申请
    2D & 3D RF Lumped Element Devices for RF System in a Package Photoactive Glass Substrates 审中-公开

    公开(公告)号：US20200212864A1

    公开(公告)日：2020-07-02

    申请号：US16622421

    申请日：2018-06-27

    申请人： 3D Glass Solutions, Inc.

    发明人： Jeb H. Flemming ,  Jeff A. Bullington ,  Kyle McWethy

    IPC分类号： H03H3/00 ,  H03H7/52 ,  H03H7/01

    摘要： The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

    LC filter and method of manufacturing LC filter
    10.
    发明授权
    LC filter and method of manufacturing LC filter 有权

    公开(公告)号：US10608609B2

    公开(公告)日：2020-03-31

    申请号：US16030106

    申请日：2018-07-09

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Toshiyuki Nakaiso

    IPC分类号： H03H7/01 ,  H03H3/00 ,  H01G4/40 ,  H01F27/28 ,  H01F27/32 ,  H01F27/40 ,  H01F41/04 ,  H01G4/228 ,  H03H1/00 ,  H01G4/33 ,  H01F17/00

    摘要： An LC filter having a multilayer body, coil conductor patterns, a thin-film capacitor, and input/output terminal conductors. The multilayer body is formed by stacking a plurality of resin sheets. At least a portion of the coil conductor pattern is embedded in a resin sheet. The thin-film capacitor is at least partially embedded in the resin sheet, is disposed in the coil opening of the coil conductor pattern, which is spiral-shaped, and is connected to the coil conductor pattern. The thickness of the coil conductor patterns is smaller than the thickness of the resin sheets, and the thickness of the thin-film capacitor is smaller than the thickness of the resin sheets.