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    回路基板
    11.
    发明申请
    回路基板 审中-公开
    电路基板

    公开(公告)号：WO2005074338A1

    公开(公告)日：2005-08-11

    申请号：PCT/JP2005/000049

    申请日：2005-01-06

    Applicant: 日本電気株式会社 ,  金高 善史 ,  石塚 直美

    Inventor： 金高 善史 ,  石塚 直美

    IPC: H05K3/34

    CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K2201/094 ,  H05K2201/09854 ,  H05K2201/10189 ,  Y10T29/49139

    Abstract: A circuit substrate includes a plurality of through holes (14, 44) into which a plurality of leads (18) as single electronic parts are inserted and soldered. Among these through holes (14, 44), the volume of the through holes (14b, 24b, 34b, 44b, 54b, 64b) into which the outermost end lead (18) of the electronic part is inserted is set greater than the volume of the through holes (14a, 44a) into which the lead located at the nearest position to the center of the electronic part is inserted.

    Abstract translation: 电路基板包括多个通孔（14,44），作为单个电子部件的多个引线（18）插入并焊接到该多个通孔中。 在这些通孔（14,44）中，插入电子部件的最外端引线（18）的通孔（14b，24b，34b，44b，54b，64b）的容积被设定为大于体积 插入位于电子部件中心最靠近位置的引线的通孔（14a，44a）。

    CONNECTOR APPARATUS, AND ASSOCIATED METHOD, FORMED OF MATERIAL EXHIBITING PHYSICAL-MEMORY CHARACTERISTICS
    12.
    发明申请
    CONNECTOR APPARATUS, AND ASSOCIATED METHOD, FORMED OF MATERIAL EXHIBITING PHYSICAL-MEMORY CHARACTERISTICS 审中-公开
    连接器装置及相关方法，形成材料展示物理记忆特性

    公开(公告)号：WO02097860A2

    公开(公告)日：2002-12-05

    申请号：PCT/IB0201862

    申请日：2002-05-29

    Applicant: NOKIA CORP ,  NOKIA INC

    Inventor： TABACUTU CRISTIAN

    IPC: H01R4/01 ,  H05K3/30 ,  H01L

    CPC classification number: H05K3/308 ,  H01R4/01 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914

    Abstract: A connector, and an associated method, for connecting an electrical circuit component (10) to a substrate, such as a printed circuit board. The connector (10) is formed of one of more pin members (14) formed of an electrically-conductive material which exhibits physical-memory characteristics. The pin member (14) is initially configured into a memory configuration and thereafter reconfigured into an alternate reconfiguration. The alternate configuration is selected to facilitate mounting of the circuit component (10) upon the substrate (28). Thereafter, the pin member (14) is heated to beyond a deformation threshold temperature. When at such temperature, the pin member (14) becomes reconfigured into the memory configuration. Through appropriate selection of the memory configuration, heating of the pin member (14) causes connection of the circuit component (10) with the substrate (28).

    Abstract translation: 一种用于将电路部件（10）连接到诸如印刷电路板的基板的连接器和相关联的方法。 连接器（10）由具有物理存储特性的导电材料形成的多个销构件（14）中的一个形成。 引脚构件（14）最初配置为存储器配置，然后重新配置为备用重新配置。 选择替代配置以便于将电路部件（10）安装在基板（28）上。 此后，将销构件（14）加热到超过变形阈值温度。 当在这样的温度下，销构件（14）被重新配置成存储器配置。 通过适当地选择存储器配置，引脚构件（14）的加热导致电路部件（10）与衬底（28）的连接。

    METHOD AND APPARATUS FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH
    13.
    发明申请
    METHOD AND APPARATUS FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH 审中-公开
    用于提供感染电生物的方法和装置

    公开(公告)号：WO2002078781A2

    公开(公告)日：2002-10-10

    申请号：PCT/US2002/008742

    申请日：2002-03-22

    Applicant: SECOND SIGHT, LLC

    Inventor： OK, Jerry ,  GREENBERG, Robert, J.

    IPC: A61N

    CPC classification number: H05K3/4046 ,  H01L21/486 ,  H01L23/10 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/10287 ,  H05K2201/10416 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T428/24926 ,  H01L2924/00

    Abstract: A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≤ 40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electrochemically stable and suitable for implantation in a patient's body. The method involves: (a) providing an unfired, ceramic sheet having a thickness of ≤ 40 mils and preferably comprising ≥ 99 % aluminium oxide; (b) forming multiple blind holes in said sheet; (c) inserting solid wires, preferably of platinum, in said holes; (d) firing the assembly of sheet and wires to a temperature sufficient to sinter the sheet material but insufficient to melt the wires; and (e) removing sufficient material from the sheet lower surface so that the lower ends of said wires are flush with the finished sheet lower surface.

    Abstract translation: 一种适用于在厚度为40密耳的陶瓷片中形成气密电馈通件的方法和装置。 更具体地，该方法产生一种包括生物相容性和电化学稳定性并且适于植入患者体内的气密电馈通装置。 该方法包括：（a）提供厚度为40密耳，优选包含≥99％氧化铝的未烧制的陶瓷片; （b）在所述片材中形成多个盲孔; （c）将优选铂的实心线插入所述孔中; （d）将片材和电线的组件烧制到足以烧结片材但不足以熔化电线的温度; 以及（e）从片材下表面去除足够的材料，使得所述电线的下端与成品片材下表面齐平。

    CIRCUIT BOARD APPARATUS WITH PIN CONNECTORS
    15.
    发明申请
    CIRCUIT BOARD APPARATUS WITH PIN CONNECTORS 审中-公开
    带引脚连接器的电路板设备

    公开(公告)号：WO01033672A1

    公开(公告)日：2001-05-10

    申请号：PCT/US2000/041857

    申请日：2000-11-02

    IPC: H01R12/52 ,  H01R12/70 ,  H05K3/12 ,  H05K3/34 ,  H01R12/00

    CPC classification number: H01R12/7082 ,  H01R12/523 ,  H01R12/58 ,  H05K3/1216 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10303 ,  H05K2201/10871 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49163

    Abstract: A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins (30) are inserted in a circuit board (10) from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board (10) and solder applied to the pins (30) at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections (72) between the pins (30) and conductive traces (12) on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.

    Abstract translation: 提供了允许在电路板之间廉价自动构建互连的方法。 根据本发明，印刷电路引脚（30）从顶部（部件侧）插入电路板（10）中。 如果引脚的头部足够薄以便位于焊料模板下面，则可将引脚预先安装在电路板（10）上，并将焊料施加到引脚（30）上，同时将焊料施加到 董事会。 因此，可以采用已知的表面贴装技术来形成电路板上的引脚（30）和导电迹线（12）之间的焊接连接（72），这便于分别焊接印刷电路引脚的先前手动操作的自动化。

    ASSEMBLY DEVICE
    16.
    发明申请
    ASSEMBLY DEVICE 审中-公开
    安装装置

    公开(公告)号：WO01013697A1

    公开(公告)日：2001-02-22

    申请号：PCT/EP2000/007838

    申请日：2000-08-11

    IPC: H01L21/52 ,  H01L21/00 ,  H01L21/68 ,  H05K13/04

    CPC classification number: H01L21/67144 ,  H01L21/68 ,  H05K13/0452 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/5313 ,  Y10T29/53178

    Abstract: The invention relates to an assembly device (10), especially a fully automatic assembly device for producing microsystem technical products and for assembling components in the semiconductor industries. Said assembly device comprises an assembly table (12), at least one material transport system (32) that transports the products to be placed with components, and at least one transport system (16) that is mounted on the assembly table (12). The device is further provided with a component transport unit (28) with at least one assembly head (30). Said component transport unit(s) (28) is/are mounted on one or more carrier system(s) (20) that is/are displaced in parallel to the direction of transport of the products to be placed with components which products are in turn displaced by the material transport system(s) (32). The material transport system (32) consists of at least two individual transport systems (34, 36, 38, 40, 42, 44) that run parallel. Every individual transport system (34, 36, 38, 40, 42, 44) is provided with separately controlled drive systems (46, 48, 50, 52, 54, 56). The assembly device (10) has at least one information memory for receiving and processing component-specific data of a multitude of components in a component reservoir (58) and of data with respect to their position within the component reservoir (58). The component transport unit(s) (28) and/or the assembly table (12) are controlled on the basis of these data.

    Abstract translation: 本发明涉及一种安装装置（10），在用于制造微技术产品和用于在半导体工业装配任务，具有载置台（12），物料输送系统（32），用于输送与部件的产品，至少一个在被加载特定全自动装配装置 载置台（12），布置输送系统（16）和至少一个可移动部件传送机构（28）具有至少一个安装头（30）。 在这种情况下，是或都是元器件运输单元或多个单元（28）可沿平行于一个或多个，通过所述传送系统的装置（16）的物料输送系统（32）的装置的输送方向和与该部件被组装产品行进载波系统或 - 系统（20）。 材料输送系统（32）包括至少两个相互平行的单个传输系统（34，36，38，40，42，44），其中，每个单独的输送系统（34，36，38，40，42，44），（彼此被驱动分别驱动系统46 ，48，50，52，54，56）被提供，并且所述安装装置（10），用于接收和处理组件特定的多个组件的一个元件贮存器（）的数据58和元件贮存器内有关其位置数据的至少一个信息存储器（58 ），其中所述组分输送单元的控制或单元（28）和/或与这些数据的帮助下的载置台（12）。

    METHOD FOR PRODUCING AND CONTROLLING ELECTRONIC COMPONENTS
    19.
    发明申请
    METHOD FOR PRODUCING AND CONTROLLING ELECTRONIC COMPONENTS 审中-公开
    生产和控制电子元件的过程

    公开(公告)号：WO99022572A2

    公开(公告)日：1999-05-14

    申请号：PCT/RU1998/000361

    申请日：1998-11-03

    IPC: G01R1/04 ,  G01R31/28 ,  H01L21/66 ,  H01L23/057 ,  H01L23/498

    CPC classification number: G01R31/2863 ,  G01R1/0408 ,  H01L22/20 ,  H01L23/057 ,  H01L23/49805 ,  H01L23/4985 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/19107 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention pertains to the field of electronics and more precisely relates to techniques for producing and controlling semi-conductor integrated micro-circuits as well as semi-conductor structures. The method for producing and controlling electronic components comprises placing a plurality of crystals in a press-mould using as an orientation reference the contact surfaces of the crystals and the base members of said mould. This method then comprises isolating all the crystal surfaces which are not protected except for the contact surfaces. This method is characterised in that the crystals placed in the press-mould are connected together so as to form a group support while all the crystals have their front surfaces located on a same plane with one of the surfaces of said group support. This method further comprises applying simultaneously on this plane all the conductors which are necessary to the electrical thermal ageing and control as well as the external connector of the support. In others variants of the present invention, this method comprises placing simultaneously the crystals and a group metallic frame in the press-mould, wherein said frame is simultaneously connected to the crystals. The group support can also be made in the shape of a flexible printed plate which is connected to a rigid base.

    Abstract translation: 本发明涉及电子领域，特别涉及半导体集成微电路和半导体结构的生产和控制。 生产和控制电子元件的这种方法包括通过从晶体的接触垫和所述模具的基底元件定向自身来在加压成型模具中布置多个晶体。 然后，除了接触区域之外，未被保护的晶体的所有表面都被隔离。 该方法的特征在于，将布置在模具中的晶体彼此固定以形成组支撑，同时确保晶体的前表面布置在同一平面上作为一个 所述组支架的表面。 然后，同时施加所有电气老化和控制所需的导体以及支架的外部连接器。 在该过程的其它变体中，在压力成型模具中同时提供一组金属框架，并同时将该框架同时附着到晶体上。 团体支持也可以是连接到刚性基座的印刷和柔性板的形式。

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